1. Product Specifications
Core Architecture
- Part Number: XCV600E-6FGG676I
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Balanced performance grade)
- Temperature Grade: Industrial (I-temp: -40ยฐC to +100ยฐC)
- Logic Elements: 15,552 logic cells
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- System Gates: 186.624K gates
Performance Specifications
- Maximum Clock Frequency: 357MHz
- Internal Performance: Up to 357MHz operation
- Process Technology: 0.18ฮผm CMOS technology
- Core Voltage: 1.8V ยฑ 5%
- Total RAM: 294,912 RAM bits
- Package Type: FGG676I (Industrial Fine-pitch Grid)
Package Information
- Package Type: 676-Pin Fine-pitch Ball Grid Array (FBGA)
- Package Designation: FGG676I (Industrial)
- I/O Count: 444 user I/O pins
- Pin Configuration: 676 total pins
- Package Dimensions: 27mm ร 27mm
- Mounting Type: Surface Mount Technology (SMT)
Industrial-Grade Features
- Extended Temperature Range: -40ยฐC to +100ยฐC operational
- Enhanced Reliability: Industrial qualification and testing
- High I/O Count: 444 I/O pins for extensive connectivity
- Legacy Product Status: Not recommended for new designs
- Proven Architecture: Mature Virtex-E platform with extensive support
- Cost-Effective Solution: Balanced performance for price-sensitive applications
2. Pricing Information
Current Market Pricing (2025)
Distributor Pricing:
- FPGAkey: $865.23 per unit (standard pricing)
- Premium Suppliers: $7,991.68 per unit (minimum quantity variants)
- Contact for Quote: Most authorized distributors
Market Characteristics:
- Industrial Premium: I-grade commands premium over commercial variants
- Legacy Product: Not recommended for new designs, affects availability
- Limited Production: Discontinued status influences pricing strategy
- Temperature Range Value: Industrial -40ยฐC to +100ยฐC operation justifies cost
Stock Status:
- Limited Availability: Reduced inventory due to legacy status
- Multiple Suppliers: Various distributors maintain stock
- Inquiry Required: Most suppliers require RFQ for current pricing
- Alternative Sourcing: Specialized legacy component suppliers
Cost Considerations:
- Balanced performance grade (-6) more cost-effective than higher speeds
- Industrial temperature range adds 15-25% premium over commercial
- Legacy product status may increase pricing volatility
- Volume discounts limited due to restricted availability
Note: XCV600E-6FGG676I pricing reflects legacy industrial product status. Contact multiple suppliers for competitive quotations and verify current availability.
3. Documents & Media
Technical Documentation
- Virtex-E Industrial Datasheet: Complete specifications for I-temp operation
- FGG676I Package Specifications: Industrial-grade mechanical and thermal data
- Speed Grade -6 Analysis: Timing specifications and performance characteristics
- Industrial Temperature Guidelines: Operating characteristics -40ยฐC to +100ยฐC
Design Resources
- Industrial PCB Design Guidelines: Layout considerations for harsh environments
- Signal Integrity Analysis: High-speed routing for 444 I/O pins
- Thermal Management: Heat dissipation strategies for industrial temperature range
- Power Distribution: Multi-rail power supply design for industrial applications
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy support)
- Industrial Timing Analysis: Temperature-dependent timing constraints
- Programming Solutions: iMPACT configuration for industrial environments
- Migration Planning: Upgrade paths to modern FPGA families
Application Documentation
- Industrial Applications: Design guidelines for harsh environment systems
- Legacy System Support: Maintenance and upgrade strategies
- Telecommunications: Infrastructure equipment design practices
- Embedded Systems: Industrial control and automation implementations
Quality Documentation
- Industrial Qualification: Extended temperature testing and reliability data
- Component Lifecycle: End-of-life planning and alternative sourcing
- Reliability Analysis: MTBF calculations for industrial environments
- Quality Standards: Industrial electronics compliance and certification
4. Related Resources
Development Platforms
- Legacy Evaluation Boards: Virtex-E development platforms (limited availability)
- FGG676 Breakout Systems: Industrial-grade access to all 444 I/O pins
- Reference Designs: Archived application examples and templates
- Educational Resources: Historical design methodology materials
Compatible Products & Alternatives
- Speed Grade Variants:
- XCV600E-7FGG676I (Higher performance, limited availability)
- XCV600E-6FGG676C (Commercial temperature: 0ยฐC to +85ยฐC)
- XCV600E-6FG676I (Alternative package, same performance)
- Package Alternatives:
- XCV600E-6BG432I (Industrial, 432-pin, compact)
- XCV600E-6BG560I (Industrial, 560-pin, mid-range I/O)
- XCV600E-6FG680I (Industrial, 680-pin, maximum I/O)
- Migration Options:
- Modern Xilinx/AMD FPGA families with migration support
- Pin-compatible newer generation devices
- Performance-equivalent contemporary solutions
Design Tools & Software
- Legacy Development:
- Xilinx ISE Design Suite (versions 10.1-14.7)
- Archived tool downloads and documentation
- Legacy IP core libraries and examples
- Migration Tools:
- Design migration utilities to modern platforms
- Architecture comparison and mapping tools
- Performance analysis for upgrade planning
- Support Resources:
- Legacy product technical support
- Community forums and knowledge preservation
- Historical application notes and design guides
Technical Support Resources
- Legacy Product Support: AMD/Xilinx archived documentation and resources
- Industrial Applications: Specialized support for harsh environment designs
- Migration Consulting: Professional services for design upgrades
- Component Sourcing: Assistance with legacy component procurement
Supply Chain Support
- Authorized Distributors: Network of certified legacy component suppliers
- Inventory Management: Stock monitoring and availability forecasting
- Quality Verification: Counterfeit detection and component authentication
- Lifecycle Planning: Long-term availability and alternative sourcing strategies
5. Environmental & Export Classifications
Environmental Specifications
- Industrial Temperature Grade (I-temp):
- Operating Temperature: -40ยฐC to +100ยฐC
- Junction Temperature: Up to +125ยฐC maximum
- Storage Temperature: -65ยฐC to +150ยฐC
- Enhanced thermal qualification for industrial environments
- Extended Environmental Conditions:
- Humidity: 5% to 95% relative humidity, non-condensing
- Altitude: Up to 5,000 meters operational
- Thermal Shock: Qualified for rapid temperature transitions
- Vibration: Industrial-grade mechanical stress resistance
Physical Characteristics
- Industrial Package Specifications:
- Package Type: 676-FBGA (27mm ร 27mm)
- Package Height: 2.5mm maximum
- Weight: Approximately 3.0 grams
- Ball Count: 676 solder balls
- Ball Pitch: Fine-pitch configuration for high-density routing
- Thermal Performance:
- Thermal Resistance (ฮธJA): 13ยฐC/W (still air)
- Enhanced thermal performance with proper heatsink
- Industrial temperature optimization
- Thermal interface requirements for extended range operation
Power Requirements
- Supply Specifications:
- Core Voltage: 1.8V ยฑ 5% (industrial tolerance)
- I/O Voltages: Variable by bank (1.2V to 3.3V)
- Enhanced power supply rejection for industrial environments
- Temperature-compensated power characteristics
- Power Consumption:
- Speed grade -6 optimized for balanced power efficiency
- Temperature-dependent power characteristics
- Industrial power management features
- Dynamic power scaling capabilities
Compliance & Certifications
- Industrial Standards:
- IEC 61000 electromagnetic compatibility
- Industrial electronics qualification standards
- Extended temperature testing and validation
- Vibration and shock resistance certification
- Environmental Compliance:
- RoHS Status: Varies by manufacturing date
- REACH Regulation: EU chemical safety compliance
- WEEE Directive: Electronic waste disposal guidelines
- Industrial packaging and handling standards
Export Control Information
- Standard Export Classification:
- ECCN: Subject to U.S. Export Administration Regulations
- Industrial Use: Standard commercial export procedures
- Legacy Product: Simplified export documentation
- Geographic Restrictions: Limited sensitive destination controls
- Documentation Requirements:
- Standard industrial export documentation
- End-use certification for specific applications
- Compliance with international trade regulations
- Industrial supply chain verification
Quality & Reliability Standards
- Industrial Qualification:
- Extended temperature cycling: -65ยฐC to +150ยฐC
- Industrial reliability testing procedures
- Quality assurance for harsh environment applications
- Enhanced screening and burn-in processes
- Reliability Metrics:
- MTBF: Industrial environment calculations
- FIT Rate: Enhanced specifications for extended temperature
- Quality Standards: Industrial electronics industry requirements
- Failure Analysis: Industrial environment failure modes
Environmental Impact
- Sustainable Design:
- Long operational life reduces replacement frequency
- Energy-efficient CMOS technology for industrial applications
- Recyclable packaging materials
- Industrial lifecycle optimization
Moisture Sensitivity
- MSL Rating: Moisture Sensitivity Level 3
- Floor Life: 168 hours at 30ยฐC/60% RH
- Enhanced moisture barrier for industrial environments
- Baking Requirements: 125ยฐC for 24 hours if exceeded
- Industrial handling and storage procedures
Applications
The XCV600E-6FGG676I excels in industrial applications requiring extended temperature operation:
Industrial Automation & Control:
- Process control systems in extreme environments
- Manufacturing automation in temperature-variable facilities
- Robotics and motion control systems
- Industrial monitoring and data acquisition
Telecommunications Infrastructure:
- Outdoor telecommunications equipment
- Base station control systems in all climates
- Network infrastructure for harsh environments
- Communication protocol processing
Transportation Systems:
- Railway signaling and control systems
- Automotive testing and manufacturing equipment
- Marine navigation and control systems
- Airport ground support equipment
Energy & Utilities:
- Power grid monitoring and control systems
- Renewable energy system controllers
- Oil and gas exploration equipment
- Industrial power management systems
Legacy System Maintenance:
- Replacement components for existing designs
- System upgrades and modernization projects
- Long-term support for critical infrastructure
- Spare parts inventory for extended lifecycle systems
Design Considerations
Industrial Temperature Advantages:
- Reliable operation from -40ยฐC to +100ยฐC
- Proven performance in harsh environmental conditions
- Cost-effective solution for extended temperature requirements
- Mature architecture with predictable behavior
Legacy Product Considerations:
- Not recommended for new designs by manufacturer
- Limited long-term availability and support
- Migration planning recommended for future projects
- Extensive existing documentation and community knowledge
Implementation Guidelines:
- Industrial-grade PCB materials and assembly processes
- Enhanced thermal management for extended temperature range
- Robust power supply design for temperature variations
- Proven design methodologies and constraint strategies
Conclusion
The XCV600E-6FGG676I provides a balanced solution for industrial applications requiring extended temperature operation and proven reliability. With its 357MHz performance, 444 I/O pins, and industrial-grade -40ยฐC to +100ยฐC qualification, this Virtex-E FPGA offers designers a cost-effective solution for maintaining and upgrading existing industrial systems. While representing a legacy product not recommended for new designs, its established architecture, extensive documentation, and available supply chain ensure continued viability for critical industrial applications requiring proven performance in harsh environments. Migration planning to modern FPGA families is recommended for long-term projects while leveraging this device for immediate industrial requirements.
