1. Product Specifications
Core Architecture
- Part Number: XCV600E-6FG680C
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Balanced performance grade)
- Temperature Grade: Commercial (C-temp: 0°C to +85°C)
- Logic Elements: 15,552 logic cells
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- System Gates: 186.624K gates (985,882 equivalent gates)
Performance Specifications
- Maximum Clock Frequency: 357MHz
- Internal Performance: Up to 357MHz operation
- Process Technology: 0.18μm CMOS technology
- Core Voltage: 1.71V to 1.89V (1.8V nominal)
- Total RAM: 294,912 RAM bits
- Silicon Efficiency: Optimized architecture for place-and-route efficiency
Package Information
- Package Type: 680-Pin Fine-pitch Ball Grid Array (FBGA)
- Package Designation: FG680C (Commercial)
- Package Dimensions: 40mm × 40mm surface-mount
- I/O Count: 512 user I/O pins (maximum in Virtex-E series)
- Pin Configuration: 680 total pins
- Mounting Type: Surface Mount Technology (SMT)
Commercial-Grade Features
- Commercial Temperature Range: 0°C to +85°C operational
- Maximum I/O Connectivity: 512 I/O pins for extensive system integration
- Cost-Effective Performance: Balanced speed grade for commercial applications
- Proven Architecture: Mature Virtex-E platform with comprehensive support
- Legacy Product Status: Obsolete/EOL (End-of-Life) status
- RoHS Status: Non-compliant (contains lead and restricted substances)
2. Pricing Information
Current Market Pricing (2025)
Distributor Stock Availability:
- Xilinx-ADM: 2,662 units available (new original)
- Ovaga Technologies: 1,300 units in stock
- Heisener: 6,480 units available
- SZComponents: 101 units in stock
- SILITECH: 161 units available
Market Characteristics:
- Commercial Grade Value: Cost-effective alternative to industrial variants
- Maximum I/O Premium: 680-pin package with 512 I/O commands premium pricing
- EOL Product Status: Obsolete/discontinued status affects long-term availability
- RFQ Pricing: Most suppliers require quotation for current pricing
Pricing Considerations:
- Commercial temperature range provides cost advantage over industrial grades
- Maximum I/O count (512 pins) justifies premium positioning in Virtex-E family
- EOL/obsolete status creates pricing volatility and supply constraints
- Volume discounts available for bulk orders (100+ units)
Supply Chain Status:
- Strong current inventory across multiple distributors
- New, original factory-sealed components available
- Pre-shipment inspection (PSI) services offered
- Global shipping via DHL, FedEx, UPS, TNT
Quality Assurance:
- 365-day warranty from most suppliers
- ISO-certified quality management systems
- Component authentication and counterfeit protection
- Professional quality control and testing procedures
Note: XCV600E-6FG680C pricing reflects commercial-grade specifications and maximum I/O connectivity. Contact multiple suppliers for competitive quotations due to EOL product status.
3. Documents & Media
Technical Documentation
- Virtex-E Commercial Datasheet: Complete specifications for C-temp operation
- FG680C Package Specifications: Commercial-grade mechanical and thermal characteristics
- Maximum I/O Design Guidelines: 512 I/O pin utilization and routing strategies
- Speed Grade -6 Analysis: Timing specifications and cost-performance optimization
Design Resources
- High I/O Count PCB Design: Layout guidelines for 680-pin commercial packages
- Signal Integrity Analysis: Managing 512 I/O pins in commercial environments
- Thermal Management: Heat dissipation for maximum I/O commercial applications
- Cost-Effective Design: Commercial application optimization strategies
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy support)
- Commercial Design Flow: Standard timing analysis and constraint methodology
- High I/O Optimization: Pin assignment and routing for maximum connectivity
- EOL Migration Tools: Upgrade paths to modern FPGA families
Application Documentation
- Maximum I/O Applications: Design strategies for high-connectivity commercial systems
- Commercial Infrastructure: Telecommunications and embedded system implementations
- Cost-Sensitive Design: Commercial application optimization guidelines
- EOL Planning: Component lifecycle management and alternative selection
Quality Documentation
- Commercial Qualification: Standard temperature testing and reliability analysis
- EOL Documentation: Product discontinuation notices and lifecycle information
- Reliability Standards: MTBF calculations for commercial environments
- Supply Chain Management: Inventory planning and alternative sourcing strategies
4. Related Resources
Development Platforms
- Legacy Evaluation Boards: Virtex-E development platforms (limited availability)
- FG680 Breakout Systems: Commercial-grade access to all 512 I/O pins
- High I/O Reference Designs: Maximum connectivity commercial application examples
- Educational Resources: Design methodology and best practices documentation
Compatible Products & Alternatives
- Temperature Grade Variants:
- XCV600E-6FG680I (Industrial temperature: -40°C to +100°C)
- XCV600E-7FG680C (Higher performance commercial: 400MHz)
- XCV600E-8FG680C (Maximum performance, extremely limited availability)
- Package Alternatives:
- XCV600E-6FG676C (Commercial, 676-pin, 444 I/O)
- XCV600E-6BG560C (Commercial, 560-pin, reduced I/O)
- XCV600E-6BG432C (Commercial, 432-pin, compact footprint)
- Migration Options:
- Modern AMD/Xilinx FPGA families with equivalent I/O count
- Pin-compatible newer generation devices with migration support
- Performance-equivalent contemporary solutions for commercial applications
Design Tools & Software
- Legacy Development:
- Xilinx ISE Design Suite (versions 10.1-14.7)
- Archived tool downloads and comprehensive documentation
- Legacy IP core libraries and commercial design examples
- High I/O Design Tools:
- Advanced pin assignment and routing utilities for 680-pin packages
- Signal integrity analysis for maximum I/O commercial applications
- Thermal analysis tools for commercial operating environments
- Migration Support:
- Design migration utilities to modern FPGA platforms
- I/O mapping and performance analysis for commercial upgrades
- Architecture comparison tools for cost-effective migration planning
Technical Support Resources
- Legacy Product Support: AMD/Xilinx archived documentation and resources
- Commercial Applications: Specialized support for cost-sensitive designs
- Maximum I/O Consultation: Expert guidance for high-connectivity commercial applications
- EOL Management: Professional services for component lifecycle planning
Supply Chain Support
- Authorized Distributors: Global network of certified legacy component suppliers
- Inventory Management: Real-time stock monitoring across multiple suppliers
- Quality Verification: Counterfeit detection and component authentication services
- Lifecycle Planning: Long-term availability assessment and alternative sourcing strategies
5. Environmental & Export Classifications
Environmental Specifications
- Commercial Temperature Grade (C-temp):
- Operating Temperature: 0°C to +85°C
- Junction Temperature: Up to +125°C maximum
- Storage Temperature: -65°C to +150°C
- Standard commercial environmental qualification
- Standard Environmental Conditions:
- Humidity: 5% to 95% relative humidity, non-condensing
- Altitude: Up to 3,000 meters operational
- Standard atmospheric pressure operation
- Commercial-grade environmental resilience
Physical Characteristics
- Commercial Package Specifications:
- Package Type: 680-FBGA (40mm × 40mm)
- Package Height: 2.8mm maximum
- Weight: Approximately 4.2 grams
- Ball Count: 680 solder balls
- Ball Pitch: Fine-pitch configuration for maximum density
- Thermal Performance:
- Thermal Resistance (θJA): 12°C/W (still air, typical)
- Enhanced thermal performance with proper heatsink design
- Commercial temperature optimization for standard environments
- Thermal interface requirements for sustained operation
Power Requirements
- Supply Specifications:
- Core Voltage: 1.71V to 1.89V (1.8V nominal)
- I/O Voltages: Variable by bank (1.2V to 3.3V)
- Standard commercial power supply tolerance
- Maximum I/O power considerations for 512-pin connectivity
- Power Consumption:
- Speed grade -6 optimized for balanced power efficiency
- Temperature-dependent power characteristics across 0°C to +85°C
- Commercial power management for standard applications
- Dynamic power scaling for maximum I/O utilization
Compliance & Certifications
- Commercial Standards:
- FCC Part 15 electromagnetic compatibility
- CE marking for European commercial markets
- Commercial electronics safety and quality standards
- Standard qualification testing procedures
- Environmental Compliance:
- RoHS Status: Non-compliant (contains lead and restricted substances above allowable limits)
- REACH Regulation: EU chemical safety compliance with material declarations
- WEEE Directive: Electronic waste disposal guidelines and procedures
- Conflict Minerals: Industry standard reporting and compliance documentation
Export Control Information
- Standard Export Classification:
- ECCN: 3A991.d (subject to Export Administration Regulations)
- USHTS: 8542390001 (U.S. Harmonized Tariff Schedule classification)
- TARIC: 8542399000 (EU tariff classification system)
- Commercial Use: Standard export procedures for commercial applications
- Documentation Requirements:
- Standard commercial export documentation and end-use certification
- Maximum I/O applications may require additional technical documentation
- Compliance with international trade regulations and commercial standards
- Commercial supply chain verification and traceability requirements
Quality & Reliability Standards
- Commercial Qualification:
- Standard temperature cycling: 0°C to +85°C (500+ cycles)
- Commercial reliability testing across standard temperature range
- Quality assurance for commercial application environments
- Maximum I/O pin reliability testing and validation procedures
- Reliability Metrics:
- MTBF: Commercial environment calculations and specifications
- FIT Rate: Commercial application specifications across temperature range
- Quality Standards: Commercial electronics industry requirements and standards
- Failure Analysis: Commercial environment failure modes and prevention strategies
Environmental Impact
- Sustainable Design:
- Long operational life reduces replacement frequency in commercial applications
- Energy-efficient CMOS technology optimized for commercial environments
- Recyclable packaging materials and responsible disposal procedures
- Commercial lifecycle optimization for cost-effective service life
Moisture Sensitivity
- MSL Rating: Moisture Sensitivity Level 3
- Floor Life: 168 hours at 30°C/60% RH
- Standard moisture barrier packaging for commercial storage
- Baking Requirements: 125°C for 24 hours if MSL exceeded
- Commercial handling procedures and environmental controls
Applications
The XCV600E-6FG680C excels in commercial applications requiring maximum I/O connectivity:
Telecommunications Equipment:
- Commercial communication infrastructure and switching systems
- Network equipment requiring extensive I/O interfaces
- Protocol processing and packet switching applications
- Voice and data communication systems in standard environments
Industrial Automation:
- Manufacturing automation systems with extensive sensor networks
- Process control applications requiring maximum connectivity
- Data acquisition systems with high-channel count requirements
- Human-machine interface (HMI) systems with comprehensive I/O
Embedded Systems:
- High-connectivity embedded computing platforms
- System-on-chip (SoC) implementations with maximum I/O
- Multi-interface embedded controllers and processors
- Custom computing solutions for commercial applications
Test & Measurement:
- Commercial test equipment with high-channel requirements
- Data acquisition and analysis systems for standard environments
- Multi-channel signal processing and generation equipment
- Laboratory and educational instrumentation
Consumer Electronics:
- High-definition video and audio processing systems
- Gaming and entertainment systems requiring extensive connectivity
- Smart home automation and IoT gateway devices
- Advanced multimedia and display controller applications
Design Considerations
Maximum I/O Advantages:
- 512 I/O pins provide highest connectivity in Virtex-E family
- Proven architecture for high I/O count commercial applications
- Commercial temperature range suitable for standard operating environments
- Cost-effective solution compared to industrial temperature variants
Commercial Grade Benefits:
- Optimized for standard 0°C to +85°C operating environments
- Cost-effective alternative to industrial temperature variants
- Proven reliability in commercial application environments
- Extensive ecosystem support and documented design methodologies
EOL Product Considerations:
- Obsolete/discontinued status requires strategic lifecycle planning
- Current inventory levels support short to medium-term requirements
- Migration planning to modern FPGA families recommended for new projects
- Alternative sourcing strategies essential for long-term sustainability
Implementation Guidelines:
- Commercial-grade PCB materials and assembly processes for 680-pin package
- Standard thermal management for maximum I/O utilization in commercial environments
- Proven power distribution design for 512 I/O pins across temperature range
- Signal integrity considerations for high-speed, high I/O count commercial applications
Conclusion
The XCV600E-6FG680C provides the optimal solution for commercial applications requiring maximum I/O connectivity and cost-effective performance. With its 512 I/O pins, proven 357MHz performance, and commercial-grade 0°C to +85°C qualification, this Virtex-E FPGA represents the pinnacle of connectivity and value for demanding commercial applications. While representing an EOL product requiring careful lifecycle management, its established architecture, maximum I/O capability, and extensive inventory availability ensure continued viability for critical commercial systems requiring proven performance in standard operating environments. Strategic migration planning to modern FPGA families is recommended for new designs while leveraging this device for maintaining and upgrading existing high-connectivity commercial systems that demand maximum I/O capability and cost-effective implementation.
