1. Product Specifications
Core Technical Specifications
- Part Number: XCV600E-6FG676I
- Manufacturer: AMD Xilinx (formerly Xilinx)
- Product Family: Virtex-E 1.8V FPGAs
- Technology Node: 0.18μm CMOS process
- Supply Voltage: 1.8V core voltage
Logic Resources
- Logic Gates: 186,624 gates
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- Logic Cells: 15,552 cells
- Maximum Operating Frequency: 357MHz
- Logic Density: High-capacity programmable logic solution
Package Information
- Package Type: Fine-Pitch Ball Grid Array (FBGA)
- Pin Count: 676 pins
- Package Code: FG676
- Speed Grade: -6 (Commercial grade)
- Temperature Grade: Industrial temperature range
Key Features
- High Logic Density: Over 600,000 equivalent logic cells for complex designs
- Advanced Interconnect: Rich hierarchy of fast, flexible routing resources
- DSP Capabilities: Specialized resources for signal processing applications
- Block RAM: Extensive on-chip memory resources for data storage
- Configurable I/Os: 444 user I/O pins for flexible connectivity
- Low Power Design: Optimized for power-efficient operation
2. Pricing Information
Current Market Pricing
The XCV600E-6FG676I pricing varies based on quantity, supplier, and market conditions. Pricing is available through multiple authorized distributors with bulk discounts available for volume purchases.
Price Factors
- Quantity Breaks: Significant discounts available for bulk orders
- Lead Times: Pricing may vary based on delivery requirements
- Market Fluctuations: Electronic component prices fluctuate frequently and are updated within 24 hours
- Authorized vs. Independent Distributors: Price variations exist across different supplier channels
Ordering Information
For current pricing and availability, customers should:
- Request quotes from authorized distributors
- Compare pricing across multiple suppliers
- Consider volume discounts for large orders
- Verify authenticity through authorized channels
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive XCV600E-6FG676I datasheet with electrical characteristics
- Pin Configuration Guide: Detailed FBGA-676 pinout diagrams and pin function descriptions
- Application Notes: Design implementation guidelines and best practices
- Errata Documents: Known issues and workarounds for optimal performance
Design Resources
- Reference Designs: Sample implementations for common applications
- IP Cores: Compatible intellectual property cores for accelerated development
- Evaluation Boards: Development platforms for prototyping and testing
- Software Tools: Vivado Design Suite compatibility information
Multimedia Resources
- Product Images: High-resolution package and pin configuration images
- Block Diagrams: Internal architecture illustrations
- Application Videos: Tutorial content for design implementation
- Webinar Recordings: Technical training and application guidance
4. Related Resources
Development Tools
- Vivado Design Suite: Primary development environment for FPGA design
- ISE Design Tools: Legacy support for existing designs
- IP Integrator: Graphical design environment for system-level implementation
- Synthesis Tools: High-performance logic synthesis capabilities
Compatible Products
- Evaluation Boards: ZedBoard, Basys 3, Nexys4-DDR for prototyping
- Development Kits: Virtex-E specific starter kits and reference designs
- Programming Cables: JTAG programming and debugging interfaces
- Power Supplies: Recommended power management solutions
Technical Support
- Application Engineers: Direct technical support for design challenges
- Community Forums: User community for knowledge sharing
- Training Resources: Online and instructor-led FPGA design courses
- Documentation Portal: Comprehensive technical library access
Alternative and Related Parts
- XCV600E-7FG676I: Higher speed grade variant
- XCV600E-6BG432I: Alternative package option
- XCV800E series: Higher capacity alternatives
- Virtex-II Pro: Next-generation FPGA family options
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS directive for lead-free manufacturing
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced in accordance with conflict-free mineral requirements
- ISO Certifications: Manufactured under ISO 9001 quality management systems
Operating Conditions
- Operating Temperature Range: -40°C to +85°C (Industrial grade)
- Storage Temperature: -65°C to +150°C
- Humidity: 85% relative humidity (non-condensing)
- Thermal Management: Requires appropriate heat dissipation for high-performance applications
Export Classifications
- ECCN (Export Control Classification Number): Subject to US export control regulations
- Country of Origin: Manufactured in accordance with international trade requirements
- Import/Export Documentation: Requires proper documentation for international shipments
- Restricted Countries: Export restrictions may apply to certain destinations
Packaging and Handling
- ESD Protection: All devices packaged with electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection
- Moisture Sensitivity: MSL 3 classification requiring proper handling procedures
- Anti-Static Packaging: Conductive packaging for component protection
- Traceability: Full lot traceability for quality assurance
Quality Assurance
- Testing Standards: 100% factory testing for electrical and functional parameters
- Quality Certifications: Manufactured under strict quality control procedures
- Reliability Testing: Extensive qualification testing for long-term reliability
- Warranty: Standard manufacturer warranty coverage
Applications
The XCV600E-6FG676I excels in diverse high-performance applications:
Primary Applications
- Telecommunications Infrastructure: Signal processing, routing, and protocol handling
- Networking Equipment: Routers, switches, and traffic management systems
- Medical Imaging Systems: Real-time image processing for MRI and CT scanners
- Digital Signal Processing: Advanced filtering, modulation, and demodulation
- Embedded Systems: High-performance computing applications
- Data Acquisition: High-speed data logging and processing systems
Key Advantages
- High Logic Capacity: Suitable for complex algorithm implementation
- Fast Processing: 357MHz operation for time-critical applications
- Flexible Architecture: Adaptable to diverse application requirements
- Proven Technology: Based on mature Virtex-E architecture with established design methodologies
Summary
The XCV600E-6FG676I represents a powerful solution for engineers requiring high-performance programmable logic capabilities. With its combination of substantial logic resources, high operating frequency, and flexible I/O options, this Virtex-E family FPGA provides an excellent foundation for demanding applications across telecommunications, medical, and industrial markets. Its proven architecture and comprehensive development tool support make it an ideal choice for both new designs and legacy system upgrades.
