1. Product Specifications
Core Technical Specifications
- Part Number: XCV600E-6BG560C
- Manufacturer: AMD Xilinx (formerly Xilinx)
- Product Family: Virtex-E 1.8V Field Programmable Gate Arrays
- Technology Node: 0.18μm CMOS process
- Supply Voltage: 1.8V core voltage
Logic Resources
- Logic Gates: 186,624 gates
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- Logic Cells: 15,552 cells
- Maximum Operating Frequency: 357MHz
- Total RAM Bits: 294,912 total RAM bits
- Memory Architecture: Distributed and block RAM resources
Package Information
- Package Type: Metal Ball Grid Array (BGA)
- Pin Count: 560 pins
- Package Code: BG560
- Speed Grade: -6 (Commercial grade)
- I/O Pins: 404 user I/O pins
- Package Features: 560-LBGA Exposed Pad, Metal construction
Environmental Specifications
- Product Status: Obsolete
- RoHS Compliance: RoHS non-compliant
- Packaging Type: Tray packaging
- Thermal Design: Exposed pad for enhanced heat dissipation
- Package Construction: Metal BGA for improved reliability
Key Features
- High Logic Density: Extensive programmable logic resources for complex digital designs
- Advanced Interconnect: 6-layer metal interconnect with rich routing hierarchy
- Enhanced Thermal Performance: Metal BGA with exposed pad for superior heat management
- Flexible I/O: 404 configurable I/O pins supporting various standards
- High-Speed Operation: 357MHz operation for time-critical applications
- Proven Architecture: Mature Virtex-E platform with established design methodologies
2. Pricing Information
Current Market Pricing
The XCV600E-6BG560C pricing varies significantly due to its obsolete status and limited supply chain availability. Pricing fluctuates frequently and is updated periodically within 24 hours by distributors.
Pricing Characteristics
- Legacy Pricing Model: Pricing driven by remaining inventory and market demand
- Quote Validity: Quotations typically expire after 5 days due to market volatility
- Availability-Based Pricing: Limited stock availability affects pricing structure
- Volume Considerations: Bulk pricing may be available for larger quantities
Payment Options
Multiple payment methods accepted across distributors:
- Traditional Methods: Wire Transfer, Credit Card
- Digital Payments: PayPal, Alipay, WeChat
- International Options: Western Union, MoneyGram, Escrow
- Processing Fees: Some payment forms may require handling fees
Market Availability
- Stock Status: Available through multiple distributors with varying stock levels
- Lead Times: Immediate availability for in-stock items
- Shipping Options: Industry-leading freight companies including DHL, UPS, FedEx, TNT
- Geographic Distribution: Global availability through independent distributor networks
Sourcing Strategy
- Primary Sources: Independent and surplus distributors
- Stock Verification: Real-time inventory monitoring across supplier networks
- Quality Assurance: Pre-shipment inspection (PSI) available from select suppliers
- Authentication: Verify part authenticity due to obsolete status
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive XCV600E-6BG560C datasheet with complete electrical specifications
- Virtex-E Family Documentation: Complete family data sheet including architectural overview
- Package Specifications: Detailed mechanical drawings for 560-LBGA package
- Thermal Characteristics: Thermal resistance and power dissipation specifications
Design Resources
- Pinout Information: Complete pin assignment and function descriptions
- PCB Layout Guidelines: Board design recommendations for Metal BGA package
- Application Notes: Historical design implementation guidelines and best practices
- Reference Designs: Legacy sample implementations and design examples
Development Support
- Software Compatibility: ISE Design Suite compatibility and version requirements
- IP Core Support: Compatible intellectual property cores and libraries
- Migration Documentation: Guidelines for transitioning to current FPGA families
- Timing Models: Detailed timing specifications and constraints
Quality Documentation
- Manufacturing Data: Historical production specifications and test criteria
- Reliability Information: Long-term reliability data and qualification reports
- Environmental Data: Operating and storage condition specifications
- Compliance Records: Historical regulatory compliance documentation
CAD Resources
- ECAD Models: Electronic CAD models for schematic capture
- Mechanical Models: 3D package models for mechanical design verification
- Footprint Libraries: PCB footprint libraries for layout tools
- Symbol Libraries: Schematic symbol libraries for design tools
4. Related Resources
Legacy Development Environment
- ISE Design Suite: Primary development platform for Virtex-E family
- Legacy Tool Versions: Specific ISE versions supporting XCV600E devices
- Programming Tools: Compatible JTAG programmers and configuration utilities
- Simulation Support: ModelSim and other simulation tool compatibility
Package Alternatives
- Family Variants: Other XCV600E package options for pin count flexibility
- XCV600E-6FG676C: 676-pin FBGA alternative
- XCV600E-6BGG432C: 432-pin BGA compact option
- XCV600E-6FG900C: 900-pin package for maximum I/O
- Speed Grade Options: -5, -7, -8 speed grades where available
- Temperature Grades: Commercial and industrial temperature variants
Migration Pathways
- Current Generation FPGAs: Recommended modern alternatives
- Artix-7 Family: Contemporary low-power, high-performance solutions
- Kintex UltraScale: High-performance migration options
- Zynq UltraScale+: System-on-chip alternatives with embedded processing
- Pin-Compatible Options: Devices with similar pinout for direct replacement
- Performance Upgrades: Higher-performance alternatives with enhanced features
Technical Support Resources
- Legacy Technical Support: Limited manufacturer support for existing designs
- Third-Party Support: Independent technical service providers
- Community Resources: User forums and knowledge bases
- Repair Services: Component-level repair and refurbishment options
Application Examples
Historical Applications:
- Telecommunications Infrastructure: High-speed data processing and protocol handling
- Industrial Control Systems: Process automation and control applications
- Medical Equipment: Real-time signal processing in diagnostic equipment
- Defense Systems: Secure communications and signal intelligence applications
- Test Equipment: High-speed test and measurement instrumentation
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Compliance: RoHS non-compliant (legacy product predating regulations)
- Lead Content: Contains lead in package materials and solder connections
- REACH Regulation: Subject to EU chemical safety requirements for legacy products
- Environmental Impact: Requires special handling and disposal procedures
- Conflict Minerals: Predates current conflict mineral reporting requirements
Handling and Storage Requirements
- Package Sensitivity: Standard ESD precautions required for Metal BGA package
- Storage Conditions: Controlled temperature and humidity environment recommended
- Moisture Sensitivity: Metal package provides enhanced moisture protection
- Physical Protection: Anti-static packaging with ESD shielding required
Thermal Management
- Thermal Design: Exposed pad design for enhanced heat dissipation
- Operating Temperature: Commercial temperature range specifications
- Thermal Interface: Direct thermal path through exposed pad to PCB
- Heat Sink Compatibility: Package designed for standard heat sink attachment
- Power Dissipation: Thermal characteristics support high-performance operation
Export Control Classifications
- ECCN Classification: Subject to US export administration regulations
- Technology Transfer: Restrictions may apply for certain end-use applications
- Destination Controls: Verify export restrictions for specific countries
- Documentation Requirements: Proper export documentation required for international shipments
- End-Use Verification: Due diligence required for defense and aerospace applications
Quality and Reliability
- Manufacturing Standards: Historical production under ISO quality systems
- Test Coverage: Comprehensive electrical and functional testing during production
- Lot Traceability: Manufacturing lot tracking for quality control and reliability analysis
- Field Performance: Proven reliability through extensive field deployment
- Legacy Support: Quality data available for existing applications
Packaging and Distribution
- Anti-Static Protection: ESD-safe packaging with conductive materials
- Physical Protection: Robust packaging for component protection during shipping
- Identification: Clear part marking and labeling for inventory management
- Documentation: Certificate of conformance available from authorized sources
- Shipping Insurance: Available through most distributors for high-value shipments
Disposal and Recycling
- E-Waste Classification: Requires proper electronic waste handling procedures
- Lead Content Disclosure: Environmental disclosure for lead-containing materials
- Recycling Programs: Component recycling through certified e-waste facilities
- Material Recovery: Precious metal recovery programs available
- Environmental Responsibility: Proper disposal critical for environmental compliance
Legacy Product Considerations
Obsolescence Management
- Supply Chain Risk: Limited long-term availability due to obsolete status
- Last-Time Buy: Consider strategic inventory for critical applications
- Alternative Sourcing: Multiple distributor relationships recommended
- Allocation Risk: Potential for supply shortages in high-demand periods
Design Lifecycle Management
- Maintenance Mode: Suitable primarily for sustaining existing designs
- Redesign Planning: Evaluate migration timeline for long-term products
- Performance Limitations: Consider modern alternatives for enhanced capabilities
- Support Lifecycle: Limited technical support availability
Modern Alternative Benefits
- Performance Improvements: Significantly enhanced performance in current generations
- Power Efficiency: Substantial power savings with advanced process technologies
- Logic Density: Higher logic capacity in smaller packages
- I/O Capabilities: Advanced I/O standards and higher speed interfaces
- Design Tools: Enhanced development environments with modern features
Migration Support
- Design Porting: Migration assistance available from AMD Xilinx
- Tool Compatibility: Modern tools support legacy design import
- IP Migration: Updated IP cores available for current architectures
- Training Resources: Migration training and documentation available
Summary
The XCV600E-6BG560C represents a mature, high-performance FPGA solution from Xilinx’s proven Virtex-E family, featuring 560-pin Metal BGA packaging with enhanced thermal characteristics. With 186,624 gates, 15,552 logic cells, and 404 I/O pins operating at 357MHz, this device provides substantial programmable logic resources for demanding applications.
While this obsolete device offers robust performance characteristics and proven reliability for maintaining existing designs, its legacy status and RoHS non-compliance limit its applicability for new projects. The exposed pad Metal BGA package provides excellent thermal management capabilities, making it suitable for high-performance applications requiring reliable heat dissipation.
For organizations maintaining systems incorporating the XCV600E-6BG560C, careful supply chain management and obsolescence planning are essential. For new designs, AMD Xilinx’s current FPGA families offer superior performance, power efficiency, advanced features, and long-term support, ensuring optimal solutions for modern programmable logic requirements.
