1. Product Specifications
Core Technical Specifications
- Part Number: XCV600E-6BG432C
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Virtex-E 1.8V Field Programmable Gate Arrays
- Technology Node: 0.18μm CMOS process
- Supply Voltage: 1.8V core voltage
Logic Resources
- System Gates: 985,882 system gates
- Logic Gates: 186,624 logic gates
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- Logic Elements: 15,552 logic elements
- Logic Cells: 15,552 cells
- Maximum Operating Frequency: 357MHz
- Total RAM Bits: 294,912 total RAM bits
- Internal Performance: 130MHz (four LUT levels)
Package Information
- Package Type: Metal Ball Grid Array (MBGA)
- Pin Count: 432 pins
- Package Code: BG432C
- Speed Grade: -6 (Commercial grade)
- I/O Pins: 316 user I/O pins
- Package Features: 432-LBGA exposed pad, metal construction
- Packaging: Tray packaging
Environmental Specifications
- Operating Temperature Range: 0°C to 85°C (Commercial temperature grade)
- Product Status: Obsolete
- Moisture Sensitivity Level: MSL 3 (standard moisture precautions required)
- RoHS Compliance: Not RoHS compliant due to the presence of lead
- PCI Compliance: PCI compliant design
- Low Power Operation: Designed for low-power operation
Key Features
- High Logic Density: Extensive programmable logic resources for complex digital designs
- Advanced Interconnect: 6-layer metal interconnect with rich routing hierarchy
- Enhanced Thermal Performance: Metal BGA with exposed pad for superior heat management
- Flexible I/O Configuration: 316 configurable I/O pins supporting various standards
- High-Speed Operation: 357MHz operation for time-critical applications
- Proven Architecture: Mature Virtex-E platform with established design methodologies
- Automated Assembly Compatible: Surface mount device suitable for modern manufacturing
2. Pricing Information
Current Market Pricing
The XCV600E-6BG432C pricing varies significantly due to its obsolete status and limited supply chain availability. Price and inventory fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours, and quotations usually expire after 5 days.
Stock Availability Examples
Current stock levels vary across distributors:
- 578 pcs stock available from IC-Components
- 2,759 pcs stock available from Xilinx-ADM
- 22,258 pcs stock available from XI DA Electronics
Payment Options
Multiple payment methods accepted across distributors:
- Traditional Methods: Wire Transfer, Credit Card
- Digital Payments: PayPal, Alipay, WeChat
- International Options: Western Union, MoneyGram, Escrow
- Processing Considerations: Some payment forms may require handling fees
Delivery Information
- Lead Times: Immediate availability for in-stock items
- Shipping Options: Industry-leading freight companies including DHL, UPS, FedEx, TNT, Registered Mail
- Express Delivery: 3-5 days typical delivery time
- Registered Mail: 25-60 days for standard mail
- Shipping Insurance: Available from most distributors
Warranty and Quality Assurance
- Warranty Period: Up to 365 days warranty from select distributors
- Quality Standards: 100% original and genuine parts
- Pre-Shipment Inspection: Random PSI available from qualified suppliers
- Return Policy: 90-day return window for defective items in original packaging
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive XCV600E-6BG432C datasheet with complete electrical specifications
- Virtex-E Family Data Sheet: Complete family documentation (DS022-1 v2.3, July 17, 2002)
- Pin Configuration Guide: Detailed pinout for 432-MBGA package with pin function descriptions
- Package Specifications: Mechanical drawings and thermal characteristics for BG432 package
Design Resources
- Application Notes: Historical design implementation guidelines and best practices
- Reference Designs: Legacy sample implementations and proven design examples
- Timing Models: Detailed timing specifications and design constraints
- Migration Guidelines: Documentation for transitioning to current FPGA families
CAD and Design Support
- EDA/CAD Models: Electronic design automation models for schematic capture
- PCB Footprint Libraries: Board layout footprints for popular CAD tools
- 3D Package Models: Mechanical models for design verification
- Symbol Libraries: Schematic symbol libraries for design tools
Development Environment
- ISE Design Suite: Primary development platform compatibility
- Legacy Tool Support: Specific ISE versions supporting XCV600E devices
- Programming Utilities: JTAG programming and configuration tools
- IP Core Libraries: Compatible intellectual property cores and functions
Quality and Compliance Documentation
- Certificate of Conformance: Quality assurance documentation for specific lots
- Test Reports: Electrical and functional verification data
- Reliability Data: Long-term performance and qualification information
- Environmental Compliance: Lead content disclosure and handling requirements
4. Related Resources
Legacy Development Tools
- ISE Design Suite: Primary development environment for Virtex-E family
- ModelSim Integration: Simulation tool compatibility and setup
- ChipScope Pro: Legacy debugging and analysis tools
- CORE Generator: IP core development and integration utilities
Family Alternatives and Variants
- Package Options: Alternative XCV600E package configurations
- XCV600E-6FG676C: 676-pin FBGA for higher I/O count
- XCV600E-6BG560C: 560-pin BGA alternative
- XCV600E-6FG900C: 900-pin package for maximum I/O
- Speed Grade Variants: -5, -7, -8 speed grades where available
- Capacity Alternatives: XCV300E, XCV400E, XCV800E, and XCV1000E, each with unique features and capabilities
Migration Pathways to Current Generation
- Artix-7 Family: Contemporary low-power, high-performance alternatives
- Kintex UltraScale: High-performance migration options for advanced applications
- Zynq UltraScale+: System-on-chip alternatives with embedded ARM processing
- Migration Tools: AMD Xilinx migration assistance and design porting services
Technical Support Resources
- Legacy Product Support: Limited manufacturer technical support for existing designs
- Third-Party Services: Independent technical support and consulting services
- Community Forums: User knowledge bases and troubleshooting resources
- Repair and Refurbishment: Component-level repair services for critical applications
Primary Applications
Historical and Current Applications:
- Embedded systems, industrial automation, telecommunications, and other applications requiring high-performance, field-programmable logic
- Complex digital computing tasks in high-end communication infrastructure, medical equipment, and defense systems
- Process Control: Industrial automation and control systems
- Test Equipment: High-speed test and measurement instrumentation
- Signal Processing: Real-time digital signal processing applications
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Compliance: Not RoHS compliant due to the presence of lead, necessitating careful handling and consideration in applications requiring environmental compliance
- Lead Content: Contains lead in package materials and solder connections
- REACH Regulation: Subject to EU chemical safety requirements for legacy products
- Conflict Minerals: Predates current conflict mineral reporting requirements
- Environmental Impact: Requires special e-waste handling and disposal procedures
Package and Handling Specifications
- Moisture Sensitivity: Moisture Sensitivity Level (MSL) 3, which means it needs to be handled with standard moisture precautions for a safe operational lifespan
- Package Construction: Surface mount device housed in a 432-LBGA exposed pad, metal package, compatible with automated assembly processes used in modern electronic manufacturing lines
- ESD Protection: Anti-static packaging with electrostatic discharge protection
- Storage Requirements: Controlled temperature and humidity environment recommended
Thermal Management and Design Considerations
- Thermal Design: Exposed pad design for enhanced heat dissipation to PCB
- Operating Temperature: Commercial temperature range (0°C to 85°C)
- Thermal Interface: Direct thermal path through exposed pad for efficient heat transfer
- Heat Sink Compatibility: Package designed for standard thermal management solutions
- Power Dissipation: Metal package provides superior thermal performance
Export Control Classifications
- ECCN Classification: Subject to US Export Administration Regulations
- Technology Transfer: Potential restrictions for defense and aerospace applications
- End-Use Verification: Due diligence required for sensitive applications
- Documentation Requirements: Proper export documentation for international shipments
- Destination Controls: Verify current export restrictions for specific countries
Quality and Manufacturing Standards
- ISO Compliance: Manufactured under ISO 9001 quality management systems
- Lot Traceability: Complete manufacturing lot tracking for quality control
- Test Coverage: Comprehensive electrical and functional testing during production
- Reliability Standards: Proven field performance through extensive deployment
- Legacy Quality Data: Historical quality records available for existing applications
Packaging and Distribution Standards
- Anti-Static Protection: Faraday cage performance packaging for component protection
- Physical Protection: Robust packaging designed for global distribution
- Identification Standards: Clear part marking and date code for inventory management
- Documentation Package: Certificate of conformance and quality documentation
- Shipping Insurance: Available through authorized distributors for high-value shipments
Disposal and Recycling Requirements
- E-Waste Classification: Requires certified electronic waste handling procedures
- Lead Content Disclosure: Environmental hazard disclosure for lead-containing materials
- Recycling Programs: Component recycling through certified facilities
- Material Recovery: Precious metal recovery programs available
- Environmental Responsibility: Proper disposal critical for regulatory compliance
Legacy Product Management Considerations
Obsolescence Strategy
- Supply Chain Risk Assessment: Limited long-term availability due to obsolete status
- Strategic Inventory Planning: Consider last-time buy for critical applications
- Multi-Source Strategy: Establish relationships with multiple distributors
- Allocation Management: Plan for potential supply shortages during peak demand
Design Lifecycle Management
- Maintenance Mode Applications: Primary use for sustaining existing product lines
- Redesign Timeline Planning: Evaluate migration schedule for long-term products
- Performance Baseline: Document current performance for comparison with alternatives
- Support Lifecycle: Plan for limited technical support availability
Modern Alternative Advantages
- Performance Improvements: 10x to 100x performance improvements in current generations
- Power Efficiency: Dramatic power savings with advanced process technologies
- Logic Density: Higher logic capacity in smaller form factors
- I/O Capabilities: Support for latest high-speed interface standards
- Design Productivity: Enhanced development tools and IP ecosystem
Migration Support Services
- Design Assessment: Professional evaluation of migration complexity and timeline
- Tool Migration: Support for transitioning from ISE to Vivado design suite
- IP Conversion: Updated IP cores available for current architectures
- Training Programs: Migration training and certification programs available
Summary
The XCV600E-6BG432C represents a proven, high-performance FPGA solution from Xilinx’s established Virtex-E family, featuring robust 432-pin Metal BGA packaging optimized for thermal management. With 186,624 gates, 15,552 logic elements, 316 I/O pins, and 357MHz operation capability, this device provides substantial programmable logic resources for demanding applications in embedded systems, industrial automation, telecommunications, and defense sectors.
Key technical advantages include the exposed pad Metal BGA design for superior thermal performance, MSL 3 moisture handling characteristics, and compatibility with automated assembly processes. The device’s 0.18μm CMOS technology and 1.8V operation deliver reliable performance for complex digital computing tasks in high-end communication infrastructure, medical equipment, and defense systems.
While this obsolete device offers proven reliability and substantial logic resources for maintaining existing designs, its legacy status, lead content, and RoHS non-compliance limit applicability for new projects. Organizations utilizing the XCV600E-6BG432C should implement comprehensive obsolescence management strategies, including strategic inventory planning and migration timeline development.
For new designs, AMD Xilinx’s current FPGA families provide superior performance, advanced features, power efficiency, and long-term support, ensuring optimal solutions for contemporary programmable logic requirements. Migration services and tools are available to facilitate smooth transitions from legacy Virtex-E designs to modern architectures while preserving existing intellectual property investments.
