The XCV600-6BG560C is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex series, designed to deliver exceptional performance for demanding digital signal processing and high-speed computing applications. This advanced programmable logic device combines flexibility with robust performance capabilities.
Product Specifications
Core Features
The XCV600-6BG560C features a comprehensive architecture optimized for complex digital designs:
Logic Capacity & Performance:
- 600,000 system gates providing extensive design flexibility
- Speed grade -6 for high-performance applications requiring fast signal processing
- Advanced routing architecture for optimal signal integrity
- Configurable logic blocks (CLBs) for versatile design implementation
Package & Interface:
- BG560 ball grid array (BGA) package with 560 pins
- Compact form factor suitable for space-constrained applications
- Commercial temperature range operation (0°C to +85°C)
- Multiple I/O standards support for versatile connectivity options
Memory & Processing:
- Distributed RAM capabilities for local data storage
- Block RAM resources for larger memory requirements
- Dedicated multiplier blocks for efficient DSP operations
- Phase-locked loops (PLLs) for precise clock management
Pricing Information
The XCV600-6BG560C is competitively priced within the high-performance FPGA market segment. Pricing varies based on:
- Order quantity and volume discounts
- Distribution channel and regional availability
- Current market conditions and supply chain factors
- Packaging and delivery requirements
For current pricing and availability of the XCV600-6BG560C, contact authorized Xilinx distributors or visit official semiconductor marketplace platforms.
Documents & Media
Technical Documentation
Essential resources for implementing the XCV600-6BG560C include:
Design Resources:
- Complete datasheet with electrical specifications and timing parameters
- Pin configuration diagrams and package drawings
- Application notes for optimal design practices
- Reference designs and implementation examples
Development Tools:
- Xilinx ISE Design Suite compatibility information
- Constraint file templates for the BG560 package
- Simulation models and IBIS files for signal integrity analysis
- Programming and configuration guides
Related Resources
Compatible Products
The XCV600-6BG560C integrates seamlessly with various system components:
Development Boards:
- Xilinx evaluation boards supporting the BG560 package
- Third-party development platforms for rapid prototyping
- Custom carrier boards for specific applications
Software Tools:
- Xilinx Vivado Design Suite for advanced designs
- ModelSim simulation environment
- ChipScope Pro for real-time debugging
- IP core libraries for accelerated development
Application Areas
The XCV600-6BG560C excels in multiple application domains:
- Telecommunications infrastructure equipment
- High-speed data processing systems
- Digital signal processing applications
- Aerospace and defense systems
- Industrial automation and control
Environmental & Export Classifications
Environmental Compliance
The XCV600-6BG560C meets stringent environmental standards:
RoHS Compliance:
- Lead-free package construction
- Restriction of hazardous substances compliance
- Environmentally responsible manufacturing processes
Operating Conditions:
- Commercial temperature range: 0°C to +85°C
- Specified voltage and current requirements
- ESD protection and handling guidelines
Export Classifications
Important regulatory information for the XCV600-6BG560C:
Trade Regulations:
- Export control classification numbers (ECCN)
- International traffic in arms regulations (ITAR) considerations
- Country-specific import/export requirements
- End-use and end-user restrictions
Quality Standards:
- ISO 9001 manufacturing quality systems
- Automotive qualification standards where applicable
- Military and aerospace specifications compliance
- Reliability testing and qualification data
The XCV600-6BG560C represents a proven solution for engineers requiring high-performance programmable logic capabilities in a compact, reliable package. Its combination of logic capacity, speed performance, and comprehensive support resources makes it an ideal choice for next-generation digital systems requiring flexibility and performance.
