Product Specifications
Core Device Features
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV50E-8PQG240C
- System Gates: 50,000 equivalent gates
- Configurable Logic Blocks (CLBs): 576 logic cells
- User I/O Pins: 180 available I/O connections
- Package Type: PQG240 (Plastic Quad Flat Pack with Ground Paddle)
- Speed Grade: -8 (highest performance grade)
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
Memory and Storage Architecture
- Block RAM: 32 Kbits total embedded memory
- Block RAM Modules: 4 dedicated dual-port memory blocks
- Distributed RAM: Configurable from CLB lookup tables
- Configuration Memory: SRAM-based for rapid reconfiguration
- Memory Access: True dual-port capability with independent clocks
High-Performance Specifications
- Maximum Operating Frequency: Up to 200 MHz (design dependent)
- Speed Grade Performance: -8 grade for maximum timing performance
- Core Supply Voltage: 2.5V ยฑ5% tolerance
- I/O Supply Voltage: 3.3V (multiple standards supported)
- Package Dimensions: 32mm x 32mm quad flat pack
- Pin Pitch: 0.8mm lead spacing
Advanced Technical Capabilities
- Clock Management: Integrated Delay Locked Loop (DLL) technology
- I/O Standards Support: LVDS, LVCMOS, GTL, SSTL, HSTL compatibility
- Boundary Scan: IEEE 1149.1 JTAG compliance for testing
- Arithmetic Features: Dedicated carry chain logic for fast computation
- Routing Architecture: Advanced interconnect for optimal performance
- Configuration Options: Multiple programming modes supported
Package and Thermal Characteristics
- Package Type: PQG240C (Commercial grade plastic package)
- Thermal Resistance: Optimized for efficient heat dissipation
- Pin Count: 240 total pins with ground paddle
- Mounting: Surface-mount technology (SMT) compatible
- Lead Configuration: Gull-wing leads for reliable PCB attachment
Pricing Information
Market Pricing for XCV50E-8PQG240C
Quantity-Based Pricing Structure:
- Prototype Quantities (1-24 pieces): Premium pricing for development
- Small Production (25-99 units): Engineering quantity discounts
- Medium Volume (100-499 units): Production pricing tiers
- High Volume (500+ units): Maximum volume discount rates
Primary Distribution Channels
- Digi-Key Electronics: Immediate availability and fast shipping
- Mouser Electronics: Technical resources and application support
- Arrow Electronics: Supply chain solutions and volume pricing
- Avnet Technology Solutions: Design-in support and services
- Future Electronics: Global distribution and logistics support
Pricing Considerations
- Speed grade premium for -8 performance level
- Package-specific pricing for PQG240C configuration
- Market availability and silicon allocation
- Lead time requirements and expedite options
- Geographic pricing variations and local taxes
Contact authorized distributors for current XCV50E-8PQG240C pricing based on your specific quantity requirements and delivery schedule.
Documents & Media
Essential Technical Documentation
- Complete Datasheet: Electrical characteristics and AC/DC specifications
- User Guide: Comprehensive implementation and design manual
- Speed Files: Timing models for accurate performance analysis
- Application Notes: Design techniques and optimization strategies
- Errata and Advisories: Known limitations and recommended solutions
Design Implementation Resources
- Package Information: Pin assignments and mechanical specifications
- IBIS Models: Signal integrity simulation for high-speed designs
- Thermal Models: Heat dissipation analysis and cooling requirements
- PCB Design Guidelines: Layout recommendations for optimal performance
- Power Estimation: Accurate consumption analysis tools and calculators
Development Software Suite
- Xilinx ISE Design Suite: Professional FPGA development environment
- WebPACK Software: Free development tools for smaller projects
- ChipScope Pro Analyzer: Real-time debugging and signal capture
- System Generator: DSP design with MATLAB/Simulink integration
- PlanAhead: Advanced floorplanning and design analysis
Educational and Training Materials
- Design Tutorial Library: Step-by-step implementation guides
- Video Training Series: Comprehensive design methodology courses
- Webinar Archives: Technical presentations and best practices
- Reference Designs: Proven implementation examples and templates
- Application Briefs: Specific use-case design guidance
Related Resources
Development and Prototyping Platforms
- Xilinx Virtex-E Evaluation Kits: Complete development platforms
- Third-Party Development Boards: Compatible evaluation systems
- Custom Reference Designs: Application-specific implementation boards
- Prototyping Solutions: Breadboard-compatible development modules
Compatible Device Family
- XCV50E Variants: Alternative package and speed grade options
- XCV100E-8PQG240C: Higher logic density with same footprint
- XCV300E Series: Expanded capacity for complex applications
- Spartan-II Alternatives: Cost-optimized solutions for volume production
Intellectual Property (IP) Cores
- DSP IP Cores: Digital signal processing building blocks
- Communication Interfaces: Ethernet, USB, UART, and SPI controllers
- Memory Controllers: SDRAM, DDR, and SRAM interface solutions
- Processor Cores: Embedded CPU implementations (MicroBlaze)
- Video/Audio Processing: Multimedia processing IP components
Technical Support and Services
- Xilinx Support Community: Online forums and peer collaboration
- Application Engineering: Direct technical consultation services
- Design Services Partners: Certified professional design assistance
- Training Programs: Comprehensive education and certification courses
- Migration Services: Device upgrade and optimization support
Design Tools and Utilities
- Synthesis Tools: Logic optimization and mapping utilities
- Simulation Software: ModelSim integration and verification tools
- Hardware Debuggers: In-circuit debugging and analysis equipment
- Performance Analyzers: Timing closure and optimization tools
- IP Integration Tools: Core evaluation and integration platforms
Environmental & Export Classifications
Environmental Compliance and Standards
- RoHS Directive: Lead-free package variants available for environmental compliance
- WEEE Regulation: Electronic waste directive compliance certification
- REACH Compliance: European chemical safety regulation conformance
- Conflict Minerals Reporting: Responsible sourcing documentation
- ISO 14001: Environmental management system certification
Export Control and Trade Classifications
- ECCN Classification: 3A001.a.7 (Export Control Classification Number)
- Schedule B Export Code: 8542.39.0001 for US export documentation
- HTS Import Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent (varies by fab)
- Export License Requirements: Destination-specific restrictions may apply
Quality and Manufacturing Standards
- ISO 9001:2015: Quality management system certification
- Temperature Classification: Commercial grade (0ยฐC to +85ยฐC)
- Moisture Sensitivity Level: MSL 3 rating per JEDEC J-STD-020
- Package Qualification: JEDEC standards compliance testing
- Reliability Standards: Comprehensive qualification and stress testing
Packaging and Material Specifications
- ESD Classification: Electrostatic discharge sensitive device (Class 1)
- Storage Requirements: Controlled humidity and temperature conditions
- Shelf Life Management: Moisture barrier bag protection systems
- Package Materials: High-reliability plastic molding compounds
- Lead-Free Processing: Compatible with Pb-free soldering processes
International Regulatory Compliance
- CE Marking: European Conformity declaration for electromagnetic compatibility
- FCC Part 15: United States electromagnetic interference regulations
- ICES-003: Canadian electromagnetic compatibility standards
- VCCI Class B: Japanese electromagnetic interference compliance
- KC Certification: Korean electromagnetic compatibility requirements
Supply Chain and Traceability
- Lot Traceability: Complete manufacturing history tracking
- Date Code Standards: Industry-standard marking for production dating
- Anti-Counterfeiting: Secure supply chain and authentication measures
- Authorized Distribution: Verified authentic product guarantee
- Quality Escapes: Comprehensive failure analysis and corrective action
Key Application Areas
The XCV50E-8PQG240C excels in high-performance applications requiring maximum speed:
High-Speed Communications
- Wireless infrastructure and base station processing
- High-frequency trading systems and financial applications
- Network switching and routing acceleration
- Software-defined radio (SDR) implementations
Advanced Signal Processing
- Real-time digital signal processing systems
- High-speed data acquisition and analysis
- Radar and sonar signal processing
- Medical imaging and diagnostic equipment
Industrial and Automation
- High-speed motor control systems
- Machine vision and inspection systems
- Real-time control and monitoring applications
- Precision measurement and instrumentation
Test and Measurement Equipment
- High-speed oscilloscope and analyzer systems
- Automated test equipment (ATE) applications
- Signal generation and arbitrary waveform systems
- Laboratory and research instrumentation
Performance Advantages of XCV50E-8PQG240C
Speed Grade Benefits
- -8 Speed Grade: Highest performance tier for maximum frequency operation
- Optimized Timing: Reduced propagation delays for critical path performance
- High-Speed I/O: Support for fastest interface standards and protocols
- Clock Performance: Maximum PLL and DLL operating frequencies
Design Flexibility
- Rapid Prototyping: Fast design iteration and verification cycles
- In-System Programming: Field upgradeable functionality
- Multiple Configuration: Support for various programming methods
- Design Security: Optional configuration encryption and protection
Commercial Grade Reliability
- Temperature Range: 0ยฐC to +85ยฐC operating specification
- Long-Term Availability: Established product with stable supply chain
- Proven Technology: Time-tested Virtex-E architecture platform
- Comprehensive Support: Extensive documentation and design resources
Technical Support and Procurement
For detailed technical specifications, current pricing information, and procurement assistance for the XCV50E-8PQG240C, contact your regional authorized Xilinx distributor or access the official Xilinx technical documentation portal for comprehensive design resources and support materials.
This detailed product description provides comprehensive information about the XCV50E-8PQG240C FPGA. For the most current technical specifications, design resources, and ordering information, consult official Xilinx documentation and authorized distribution partners.
