1. Product Specifications
Core Technical Specifications
- Part Number: XCV50E-7PQ240I
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Virtex-E 1.8V Field Programmable Gate Arrays
- Technology Node: 0.18ฮผm CMOS process
- Supply Voltage: 1.8V core voltage
Logic Resources
- System Gates: 71,693 system gates
- Logic Gates: 20,736 logic gates
- Logic Cells: 1,728 cells
- Configurable Logic Blocks (CLBs): Entry-level CLB configuration
- Maximum Operating Frequency: 400MHz
- Internal Performance: High-speed operation optimized for cost-performance balance
Package Information
- Package Type: Plastic Quad Flat Package (PQFP)
- Pin Count: 240 pins
- Package Code: PQ240I
- Speed Grade: -7 (High-performance grade)
- I/O Pins: Approximately 158 user I/O pins
- Temperature Grade: Industrial temperature range
- Pitch: Standard QFP pitch for automated assembly
Environmental Specifications
- Operating Temperature Range: Industrial temperature grade
- Product Status: Obsolete (legacy product)
- Package Material: Plastic construction for cost-effectiveness
- Assembly Compatibility: Through-hole and surface mount assembly processes
- Lead Configuration: Gull-wing leads for reliable PCB mounting
Key Features
- Entry-Level Logic Density: Cost-effective programmable logic resources for moderate complexity designs
- Advanced Interconnect: 6-layer metal interconnect with optimized routing hierarchy
- Compact Footprint: 240-pin PQFP package for space-constrained applications
- High-Speed Operation: 400MHz operation for time-sensitive applications
- Cost-Effective Solution: Entry-level Virtex-E device balancing performance and cost
- Industrial Grade: Enhanced temperature range for industrial applications
- Proven Architecture: Mature Virtex-E platform with established design methodologies
2. Pricing Information
Current Market Pricing
The XCV50E-7PQ240I pricing varies due to its obsolete status and supply chain limitations. Pricing fluctuates frequently based on available inventory and market demand.
Stock Availability Examples
Current stock levels from select distributors:
- 2,781 pcs stock available from Xilinx-ADM distributor
- Listed as “XILINX QFP240” in distributor catalogs
- Multiple independent distributors maintain inventory
Market Characteristics
- Legacy Pricing Model: Pricing driven by remaining inventory availability
- Historical Price Trends: Real-time price monitoring available through specialized platforms
- Quote Validity: Short-term quotations due to inventory fluctuations
- Volume Availability: Moderate stock levels across multiple suppliers
Payment and Ordering
- Payment Methods: Standard electronic component payment options accepted
- Minimum Order Quantities: Varies by distributor, typically low MOQ for legacy products
- Lead Times: Immediate availability for in-stock items
- Quote Requirements: Submit quantity and contact information for pricing
Sourcing Considerations
- Primary Sources: Independent and surplus electronic component distributors
- Inventory Monitoring: Real-time stock tracking across global supplier networks
- Quality Verification: Ensure authentic parts through qualified suppliers
- Alternative Sourcing: Maintain multiple supplier relationships for availability assurance
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive XCV50E-7PQ240I datasheet with complete electrical specifications
- Virtex-E Family Documentation: Complete family data sheet including architectural overview
- Pin Configuration Guide: Detailed pinout for 240-pin PQFP package with pin function descriptions
- Package Specifications: Mechanical drawings and dimensions for PQFP assembly
Design Resources
- Application Notes: Historical design implementation guidelines and best practices
- Reference Designs: Entry-level sample implementations and proven design examples
- Timing Models: Detailed timing specifications and design constraints
- PCB Layout Guidelines: Board design recommendations for PQFP package mounting
Development Environment
- ISE Design Suite: Primary development platform compatibility for Virtex-E family
- Legacy Tool Support: Specific ISE versions supporting XCV50E devices
- Programming Utilities: JTAG programming interfaces and configuration tools
- IP Core Libraries: Compatible intellectual property cores for accelerated development
CAD and Design Support
- ECAD Models: Electronic design automation models for schematic capture
- PCB Footprint Libraries: Standard PQFP footprints for popular CAD tools
- Package Models: 3D models for mechanical design verification
- Symbol Libraries: Schematic symbol libraries for design tools
Quality Documentation
- Manufacturing Data: Historical production specifications and test criteria
- Reliability Information: Long-term performance data and qualification reports
- Environmental Data: Operating and storage condition specifications
- Legacy Compliance: Historical regulatory compliance documentation
4. Related Resources
Legacy Development Tools
- ISE Design Suite: Primary development environment for Virtex-E family devices
- ModelSim Integration: Simulation tool compatibility and project setup
- ChipScope Pro: Legacy debugging and signal analysis tools
- CORE Generator: IP core development and integration utilities
Family Alternatives and Package Variants
- XCV50E Package Options: Alternative package configurations for different applications
- XCV50E-7FG256I: 256-pin FBGA for higher I/O density
- XCV50E-7CS144C: 144-pin CSBGA for ultra-compact designs
- XCV50E-7PQG240C: Alternative PQFP variant
- Speed Grade Variants: -6, -8 speed grades where available
- Capacity Alternatives: XCV100E, XCV200E for higher logic density requirements
Migration Pathways to Current Generation
- Spartan-7 Family: Contemporary cost-effective alternatives for entry-level applications
- Artix-7 Family: Enhanced performance migration options
- Zynq-7000 Series: System-on-chip alternatives with embedded ARM processing
- Migration Services: AMD Xilinx migration assistance and design porting support
Technical Support Resources
- Legacy Product Support: Limited manufacturer technical support for existing designs
- Community Resources: User forums and knowledge bases for troubleshooting
- Third-Party Services: Independent technical support and consulting services
- Design Archives: Historical design examples and implementation guides
Primary Applications
Historical and Current Applications:
- Prototyping and Development: Entry-level FPGA for design validation and testing
- Educational Projects: University and training applications requiring moderate complexity
- Embedded Controllers: Simple control logic and interface applications
- Signal Processing: Basic digital signal processing tasks
- Communication Interfaces: Protocol conversion and interface bridging
- Industrial Control: Simple automation and monitoring applications
- Test Equipment: Basic test and measurement instrument designs
5. Environmental & Export Classifications
Environmental Compliance Status
- Legacy Product Status: Predates current environmental regulations
- Material Composition: Plastic package construction with standard semiconductor materials
- RoHS Status: Likely non-compliant as a legacy product (verification required)
- Environmental Impact: Standard semiconductor disposal procedures recommended
- Conflict Minerals: Predates current conflict mineral reporting requirements
Package and Handling Specifications
- Package Type: Plastic Quad Flat Package (PQFP) with gull-wing leads
- Moisture Sensitivity: Standard semiconductor moisture precautions recommended
- ESD Protection: Standard electrostatic discharge protection required during handling
- Storage Requirements: Controlled temperature and humidity environment
- Physical Protection: Anti-static packaging for component protection
Thermal Management and Design Considerations
- Operating Temperature: Industrial temperature range capabilities
- Thermal Design: Standard PQFP thermal characteristics
- Heat Dissipation: Natural convection and conduction cooling
- Power Consumption: Low-power 1.8V operation for efficient thermal management
- PCB Considerations: Standard PQFP mounting and thermal relief requirements
Export Control Classifications
- ECCN Classification: Subject to US Export Administration Regulations
- Technology Category: Standard programmable logic classification
- End-Use Applications: General-purpose programmable logic applications
- Documentation Requirements: Standard export documentation for international shipments
- Destination Verification: Verify current export restrictions for specific countries
Quality and Manufacturing Standards
- Legacy Manufacturing: Produced under historical quality management systems
- Test Coverage: Standard functional and parametric testing during production
- Lot Traceability: Manufacturing lot identification for quality control
- Field History: Proven reliability through extensive field deployment
- Quality Records: Historical quality data available for reference
Packaging and Distribution Standards
- Component Protection: Standard anti-static packaging materials
- Physical Handling: Careful handling required for PQFP lead protection
- Identification: Clear part marking and date code for inventory management
- Documentation: Basic quality documentation from suppliers
- Shipping Protection: Appropriate packaging for mechanical protection during transport
Disposal and Recycling Considerations
- E-Waste Classification: Standard electronic component recycling procedures
- Material Recovery: Semiconductor material recovery through certified facilities
- Environmental Responsibility: Proper disposal per local environmental regulations
- Component Recycling: Precious metal recovery available through recycling programs
- Documentation: Maintain material safety data sheets as required
Legacy Product Considerations
Entry-Level Design Applications
- Educational Use: Ideal for learning FPGA design principles and methodologies
- Prototyping Platform: Cost-effective solution for proof-of-concept designs
- Simple Controllers: Suitable for basic control logic and state machine applications
- Interface Design: Protocol conversion and simple communication interfaces
- Legacy System Maintenance: Replacement component for existing designs
Design Limitations and Considerations
- Logic Capacity: Limited logic resources compared to modern FPGAs
- I/O Standards: Support for legacy I/O standards, limited modern interface support
- Power Efficiency: Higher power consumption compared to current-generation devices
- Tool Support: Requires legacy ISE design tools, limited modern tool support
- Long-term Availability: Limited supply chain support for future requirements
Migration Benefits to Modern Alternatives
- Performance Improvements: Significantly higher performance in current generations
- Logic Density: Much higher logic capacity in similar or smaller packages
- Power Efficiency: Dramatic power reduction with advanced process technologies
- I/O Capabilities: Support for latest high-speed interface standards
- Development Tools: Enhanced design productivity with modern development environments
Obsolescence Management Strategy
- Supply Planning: Strategic inventory management for critical applications
- Alternative Evaluation: Assessment of modern replacement options
- Design Migration: Timeline planning for transitioning to current devices
- Support Lifecycle: Planning for limited technical support availability
- Cost Analysis: Total cost of ownership comparison with modern alternatives
Summary
The XCV50E-7PQ240I represents an entry-level, cost-effective FPGA solution from Xilinx’s proven Virtex-E family, featuring 20,736 gates, 1,728 logic cells, and 400MHz operation in a compact 240-pin PQFP package. With its industrial temperature grade and optimized 0.18ฮผm CMOS technology, this device provides reliable programmable logic capabilities for moderate complexity applications in embedded systems, prototyping, and educational environments.
Key advantages include the space-efficient PQFP packaging, cost-effective entry-level positioning, and proven Virtex-E architecture reliability. The device’s 1.8V operation and 400MHz performance make it suitable for applications requiring moderate speed and logic density, while the industrial temperature grade ensures reliable operation in demanding environments.
While this obsolete device offers proven performance characteristics and cost-effective entry-level FPGA capabilities for maintaining existing designs or educational applications, its legacy status and limited logic resources restrict applicability for new commercial projects. Organizations utilizing the XCV50E-7PQ240I should implement comprehensive obsolescence management strategies and consider migration planning.
For new designs, AMD Xilinx’s current FPGA families provide superior performance, advanced features, significantly higher logic density, and long-term support. The Spartan-7 and Artix-7 families offer excellent migration paths with enhanced capabilities, power efficiency, and modern development tool support, ensuring optimal solutions for contemporary programmable logic requirements while preserving design investment and accelerating time-to-market.
