1. Product Specifications
Core Technical Specifications
- Part Number: XCV50E-7CS144C
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Virtex-E 1.8V Field Programmable Gate Arrays
- Technology Node: 0.18μm CMOS process
- Supply Voltage: 1.8V core voltage
Logic Resources
- System Gates: 71,693 system gates
- Logic Gates: 20,736K logic gates
- Logic Elements/Cells: 1,728 logic cells
- Configurable Logic Blocks (CLBs): Entry-level CLB configuration
- Maximum Operating Frequency: 400MHz (estimated based on speed grade -7)
- Total RAM Bits: 65,536 total RAM bits
- Distributed RAM: 24,576 distributed RAM bits
Package Information
- Package Type: Chip Scale Ball Grid Array (CSBGA)
- Alternative Package Designation: 144-TFBGA, CSPBGA
- Pin Count: 144 pins
- Package Code: CS144C
- Speed Grade: -7 (High-performance grade)
- I/O Pins: 94 user I/O pins
- Mounting Type: Surface Mount
- Packaging: Tray packaging
Environmental Specifications
- Operating Temperature Range: Commercial temperature grade
- Product Status: Obsolete
- RoHS Compliance: RoHS non-compliant
- Package Characteristics: Ultra-compact design for space-constrained applications
- Assembly Technology: Advanced surface mount technology required
Key Features
- Ultra-Compact Footprint: Smallest package option in XCV50E series for space-critical designs
- Advanced Interconnect: 6-layer metal interconnect optimized for compact routing
- Space-Efficient Design: Maximum logic density per unit board area
- High-Speed Operation: 400MHz capability in minimal package size
- Versatile Integration: 94 I/O pins optimized for compact connectivity
- Proven Architecture: Mature Virtex-E platform with established design methodologies
- Low Profile: Chip scale package for ultra-thin form factor requirements
- Cost-Effective Miniaturization: Optimal balance of performance and size
2. Pricing Information
Current Market Pricing
The XCV50E-7CS144C pricing varies due to its obsolete status and specialized ultra-compact CSBGA package. Premium pricing typically applies for space-critical applications requiring minimal footprint solutions.
Stock Availability Examples
Current stock levels from select distributors:
- 246 pcs stock available from IC-Components
- 2,882 pcs stock available from Xilinx-ADM distributor
- Large in-stock quantities reported from specialized component distributors
- Limited availability due to obsolete status
Market Characteristics
- Premium Compact Package: CSBGA packaging commands premium pricing for space-critical applications
- Legacy Product Positioning: Obsolete status affects pricing structure and availability
- Miniaturization Value: High value for applications requiring ultra-compact solutions
- Specialized Market: Primary demand from maintenance and space-constrained designs
Payment and Ordering Options
- Payment Methods: T/T (Bank wire), PayPal, Credit Cards accepted across distributors
- Minimum Order Quantities: Typically starts from 1 piece for most suppliers
- Warranty Options: Up to 90-365 days warranty from select distributors
- Shipping Options: FedEx, DHL, UPS (4-5 days), registered airmail (14-38 days)
Value Proposition
- Space Optimization: Maximum logic functionality in minimum board footprint
- Design Flexibility: 94 I/O pins in ultra-compact package
- Legacy System Support: Critical component for maintaining space-constrained designs
- Miniaturization Enabler: Enables compact electronic product development
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive XCV50E-7CS144C datasheet with complete electrical and timing specifications
- Virtex-E Family Documentation: Complete family data sheet including architectural overview
- Pin Configuration Guide: Detailed pinout for 144-CSBGA package with comprehensive pin function descriptions
- Package Specifications: Mechanical drawings and assembly guidelines for ultra-compact CSBGA mounting
Design Resources
- Application Notes: Proven design implementation guidelines for space-constrained applications
- Reference Designs: Miniaturized sample implementations demonstrating optimal 94 I/O utilization
- Timing Models: Detailed timing specifications for high-speed operation in compact package
- PCB Layout Guidelines: Critical board design recommendations for CSBGA assembly and signal integrity
Development Environment
- ISE Design Suite: Primary development platform compatibility for Virtex-E family
- Legacy Tool Support: Specific ISE versions supporting XCV50E devices
- Programming Utilities: JTAG programming interfaces optimized for compact designs
- IP Core Libraries: Compatible intellectual property cores for space-efficient implementations
CSBGA Package Resources
- Assembly Guidelines: Specialized surface mount procedures for chip scale packages
- Thermal Management: Thermal design considerations for ultra-compact packages
- Signal Integrity: High-speed design guidelines for miniaturized layouts
- Testing Strategies: Access methods and inspection procedures for CSBGA packages
Quality Documentation
- Manufacturing Data: Historical production specifications and test criteria
- Reliability Information: Long-term performance data for compact package reliability
- Environmental Data: Operating conditions and storage specifications for CSBGA
- Package Integrity: Ball attach reliability and inspection procedures
4. Related Resources
Legacy Development Tools
- ISE Design Suite: Primary development environment for Virtex-E family devices
- Compact Design Tools: Specialized tools for space-constrained layout optimization
- Signal Analysis: Tools for high-speed design verification in compact packages
- Thermal Analysis: Design tools for thermal management in miniaturized applications
Family Alternatives and Package Variants
- XCV50E Package Options: Alternative configurations for different space requirements
- XCV50E-7FG256C: 256-pin FBGA for higher I/O density
- XCV50E-7PQ240I: 240-pin PQFP for through-hole compatibility
- XCV50E-7CS144I: Industrial temperature variant of CS144 package
- Speed Grade Variants: -6, -8 speed grades for different performance requirements
- Capacity Alternatives: XCV100E, XCV200E in CS144 packages for higher logic density
Migration Pathways to Current Generation
- Spartan-7 Family: Contemporary ultra-compact alternatives with enhanced features
- Artix-7 Family: Advanced miniaturization with improved performance and power efficiency
- Zynq-7000 Series: System-on-chip alternatives for ultra-compact embedded applications
- Specialized Packages: Modern CSP and WLP options for extreme miniaturization
Technical Support Resources
- Legacy Product Support: Limited manufacturer technical support for existing designs
- Miniaturization Expertise: Specialized support for ultra-compact design challenges
- CSBGA Assembly Services: Professional assembly services for chip scale packages
- Design Migration Services: Professional assistance for transitioning to current architectures
Primary Applications
Historical and Current Applications:
- Portable Electronics: Handheld devices requiring maximum functionality in minimal space
- IoT Devices: Internet of Things applications with severe space constraints
- Wearable Technology: Smart watches, fitness trackers, and body-worn electronics
- Medical Implants: Miniaturized medical devices requiring programmable logic
- Aerospace Applications: Space-constrained avionics and satellite systems
- Mobile Communication: Compact communication modules and signal processing
- Embedded Controllers: Ultra-compact control systems for space-limited applications
- Sensor Fusion: Miniaturized sensor processing and data fusion systems
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Compliance: RoHS non-compliant (legacy product predating regulations)
- Material Composition: Standard semiconductor materials with lead-containing components
- Environmental Impact: Requires specialized electronic waste handling procedures
- Conflict Minerals: Predates current conflict mineral reporting requirements
- REACH Regulation: Subject to EU chemical safety requirements for legacy products
Package and Handling Specifications
- Package Type: 144-pin Chip Scale Ball Grid Array (CSBGA) ultra-compact design
- Moisture Sensitivity: Enhanced moisture precautions required for chip scale packages
- ESD Protection: Critical electrostatic discharge protection due to small package size
- Storage Requirements: Controlled temperature and humidity environment essential
- Physical Protection: Specialized anti-static packaging for ultra-compact components
CSBGA Assembly Considerations
- Surface Mount Technology: Requires advanced SMT assembly capabilities and precision equipment
- Thermal Profile: Specific reflow soldering profiles optimized for chip scale packages
- Ball Grid Inspection: X-ray inspection essential for ultra-fine pitch solder joint verification
- Rework Complexity: Highly specialized BGA rework equipment necessary for repairs
- Assembly Yield: Ultra-high precision placement equipment required for optimal yield
Thermal Management and Design Considerations
- Operating Temperature: Commercial temperature range for standard applications
- Thermal Design: CSBGA package provides direct thermal conduction with minimal thermal resistance
- Power Dissipation: 1.8V operation optimized for thermal efficiency in compact package
- Heat Spreading: Critical PCB thermal design considerations for ultra-compact mounting
- Thermal Interface: Direct die-to-substrate thermal path for efficient heat transfer
Export Control Classifications
- ECCN Classification: Subject to US Export Administration Regulations
- Technology Category: Standard programmable logic device classification
- End-Use Applications: General-purpose programmable logic for commercial applications
- Documentation Requirements: Standard export documentation for international shipments
- Destination Verification: Verify current export restrictions for specific countries
Quality and Manufacturing Standards
- Legacy Manufacturing: Produced under ISO quality management systems
- Test Coverage: Comprehensive functional and parametric testing optimized for compact packages
- Package Quality: Ultra-fine pitch ball attach and substrate reliability verification
- Lot Traceability: Manufacturing lot identification for quality control and reliability tracking
- Field History: Proven reliability through extensive deployment in space-constrained applications
Packaging and Distribution Standards
- Component Protection: Specialized anti-static packaging optimized for ultra-compact components
- Physical Handling: Extreme care required to protect fine-pitch ball attachments
- Identification: Clear part marking and date code visible on minimal package real estate
- Documentation: Technical documentation and quality certificates for critical applications
- Shipping Protection: Enhanced packaging for mechanical protection during transport
Disposal and Recycling Considerations
- E-Waste Classification: Electronic component recycling through certified facilities
- Material Recovery: Semiconductor and precious metal recovery from ultra-compact packages
- Environmental Responsibility: Proper disposal per local environmental regulations
- Lead Content Disclosure: Environmental disclosure for lead-containing materials
- Specialized Recycling: Advanced recycling procedures for chip scale packages
Ultra-Compact Design Considerations
CSBGA Package Advantages
- Maximum Miniaturization: Smallest possible footprint for given logic capacity
- Superior Electrical Performance: Minimal parasitic inductance and capacitance
- Thermal Efficiency: Direct die attachment for optimal heat dissipation
- Signal Integrity: Short interconnect paths for high-speed operation
- Board Space Optimization: Maximum functionality per unit PCB area
Design and Assembly Challenges
- Assembly Complexity: Requires state-of-the-art SMT equipment and expertise
- Inspection Difficulty: X-ray inspection mandatory for quality verification
- Rework Limitations: Extremely challenging component replacement procedures
- Design Constraints: Limited access for test points and debug interfaces
- Cost Considerations: Premium assembly and testing costs for ultra-compact packages
Migration Benefits to Modern Alternatives
- Enhanced Miniaturization: Current generation offers even smaller packages with higher logic density
- Advanced Process Technology: Improved performance and power efficiency in compact form factors
- Modern Package Options: Wafer-level packaging and advanced CSP technologies
- Integration Levels: System-on-chip solutions reducing overall component count
- Design Tool Support: Enhanced design productivity for ultra-compact applications
Obsolescence Management for Space-Critical Applications
- Critical Application Assessment: Evaluate impact of package size requirements on system design
- Miniaturization Requirements: Assess if space constraints mandate continued use of legacy devices
- Alternative Package Evaluation: Analysis of modern ultra-compact alternatives
- Redesign Feasibility: Cost-benefit analysis of system redesign versus component substitution
- Supply Chain Strategy: Long-term sourcing plan for critical space-constrained applications
Summary
The XCV50E-7CS144C represents the ultimate in compact FPGA solutions from Xilinx’s proven Virtex-E family, featuring 71,693 system gates, 1,728 logic cells, 94 I/O pins, and 400MHz operation in an ultra-compact 144-pin CSBGA package. With its optimized 0.18μm CMOS technology and 1.8V operation, this device provides exceptional programmable logic capabilities for the most demanding space-constrained applications.
Key advantages include the ultra-miniaturized CSBGA packaging that delivers maximum logic functionality in minimal board footprint, proven Virtex-E architecture reliability, and robust high-speed performance optimized for compact designs. The device’s 94 user I/O pins and advanced interconnect architecture make it particularly suitable for portable electronics, IoT devices, wearable technology, and embedded systems where every square millimeter of board space is critical.
While this obsolete device offers proven performance characteristics and unmatched compactness for maintaining existing ultra-miniaturized designs, its legacy status, RoHS non-compliance, and complex CSBGA assembly requirements limit applicability for new commercial projects. Organizations utilizing the XCV50E-7CS144C should implement comprehensive obsolescence management strategies specifically addressing space-critical application requirements.
For new designs, AMD Xilinx’s current FPGA families provide superior performance, advanced features, and modern ultra-compact packaging options. The Spartan-7 and Artix-7 families offer excellent migration paths with enhanced miniaturization capabilities, power efficiency, and comprehensive development tool support, ensuring optimal solutions for contemporary space-constrained programmable logic applications while providing long-term product support and next-generation features for ultra-compact electronic designs.
