Product Specifications
Core Device Architecture
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV50E-6PQG240C
- System Gates: 50,000 equivalent gates
- Configurable Logic Blocks (CLBs): 576 logic cells
- User I/O Pins: 180 available I/O connections
- Package Type: PQG240 (Plastic Quad Flat Pack with Guard Ring)
- Speed Grade: -6 (standard performance grade)
- Temperature Range: Commercial (0°C to +85°C)
Package and Mechanical Specifications
- Package Format: 240-pin PQFP with guard ring protection
- Package Dimensions: 32mm x 32mm x 3.4mm
- Lead Pitch: 0.5mm spacing between leads
- Lead Count: 240 leads total around package perimeter
- Body Material: High-reliability plastic molding compound
- Lead Finish: Matte tin plating for excellent solderability
Memory Architecture and Resources
- Block RAM: 32 Kbits total embedded block memory
- Block RAM Configuration: 4 independent dual-port memory blocks
- Distributed RAM: Configurable from CLB lookup tables
- Memory Organization: 8K x 1, 4K x 2, 2K x 4, or 1K x 8 configurations
- Configuration Storage: SRAM-based for fast reconfiguration cycles
- Memory Access: True dual-port with independent clock domains
Performance and Electrical Characteristics
- Maximum Operating Frequency: Up to 175 MHz (speed grade -6)
- Core Supply Voltage: 2.5V ±5% tolerance
- I/O Supply Voltage: 3.3V nominal with multiple standard support
- Static Power Consumption: Low quiescent current design
- Dynamic Power: Optimized for balanced performance and power efficiency
- Input/Output Delay: Specified for various loading conditions
Advanced Technical Features
- Clock Management: Four Delay Locked Loops (DLLs) for precise timing control
- I/O Standards: Comprehensive support including LVDS, LVCMOS, GTL, SSTL, HSTL
- Boundary Scan: Full IEEE 1149.1 JTAG compliance for manufacturing test
- Arithmetic Logic: Dedicated carry chains for high-speed mathematical operations
- Routing Architecture: Hierarchical interconnect for optimal performance and routability
- Configuration Modes: Multiple configuration options including JTAG, slave serial, and master modes
Commercial Temperature Qualification
- Operating Temperature: 0°C to +85°C continuous operation
- Junction Temperature: Maximum 125°C with proper thermal management
- Storage Temperature: -65°C to +150°C non-operating conditions
- Thermal Resistance: Junction-to-ambient and junction-to-case specifications available
Pricing Information
Market Pricing Structure for XCV50E-6PQG240C
Commercial Grade Pricing Tiers:
- Prototype Quantities (1-24 units): Development and evaluation pricing
- Engineering Volumes (25-99 units): Design validation quantity discounts
- Production Runs (100-499 units): Manufacturing volume pricing
- High Volume (500+ units): Maximum cost reduction with supply agreements
Pricing Factors and Considerations
- Standard Speed Grade: -6 grade offers balanced performance at competitive pricing
- PQFP Package: Traditional package format with cost-effective assembly
- Commercial Temperature: Standard temperature range for mainstream applications
- Market Availability: Mature product with stable supply chain pricing
- Lead Time Impact: Standard lead times versus expedited delivery options
Authorized Distribution Channels
- Digi-Key Electronics: Comprehensive inventory and rapid delivery services
- Mouser Electronics: Technical support and design resource access
- Arrow Electronics: Supply chain management and volume procurement
- Avnet: Design services and technical consultation support
- Newark Element14: Global distribution and local support services
Cost Optimization Strategies
- Volume Commitments: Long-term supply agreements for price stability
- Package Alternative Analysis: Compare with BGA options for cost/performance
- Design Optimization: Right-sizing logic requirements for cost efficiency
- Supply Chain Planning: Forecast accuracy for better pricing negotiations
Contact authorized distributors for current XCV50E-6PQG240C pricing, availability, and volume discount programs suitable for your application requirements.
Documents & Media
Essential Technical Documentation
- Product Datasheet: Complete electrical specifications, timing parameters, and operating conditions
- User Guide: Comprehensive design implementation manual with application examples
- Application Notes: Proven design methodologies, best practices, and reference implementations
- Errata and Advisories: Known device characteristics, limitations, and recommended workarounds
- Package Information: Mechanical drawings, dimensions, and thermal characteristics
Design Implementation Resources
- Pinout Documentation: Complete pin assignments, signal descriptions, and power/ground mapping
- IBIS Behavioral Models: Accurate signal integrity simulation for high-speed design verification
- SPICE Models: Analog simulation support for mixed-signal applications
- Thermal Characterization: Junction-to-ambient and junction-to-case thermal resistance data
- Package Parasitic Models: Electrical characteristics for high-frequency design considerations
PCB Design and Assembly Guidelines
- Footprint Patterns: Recommended PCB land patterns and via structures
- Soldering Profiles: Temperature profiles for wave and reflow soldering processes
- Assembly Guidelines: Component placement, orientation, and handling procedures
- Inspection Criteria: Visual and electrical test specifications for quality assurance
- Rework Procedures: Safe device removal and replacement techniques
Development Software Suite
- Xilinx ISE Design Suite: Professional FPGA development environment with synthesis and place-and-route
- WebPACK Software: Free development tools for educational and evaluation purposes
- ChipScope Pro: Real-time in-system debugging and signal analysis capabilities
- System Generator: MATLAB/Simulink integration for DSP and control applications
- Timing Analyzer: Static timing analysis and constraint management tools
Educational and Reference Materials
- Design Tutorial Library: Step-by-step implementation guides and practical examples
- Video Training Series: Comprehensive FPGA design methodology instruction
- Webinar Recordings: Technical presentations and advanced design techniques
- University Program Resources: Academic curriculum support and teaching materials
Related Resources
Development and Prototyping Platforms
- Virtex-E Evaluation Boards: Complete development platforms with onboard peripherals
- Breadboard Development Modules: Rapid prototyping and proof-of-concept systems
- Third-Party Evaluation Kits: Compatible development boards from ecosystem partners
- Custom Development Services: Professional prototype development and validation support
Compatible Product Family Options
- XCV50E Package Variants: Alternative package options (BGA, other QFP formats)
- XCV100E-6PQG240C: Pin-compatible higher gate count upgrade option
- XCV300E-6 Series: Expanded logic capacity for more complex design requirements
- Spartan-II Alternatives: Cost-optimized solutions for high-volume production applications
Configuration and Programming Solutions
- XC18V Configuration PROMs: One-time programmable configuration memory devices
- XCF Platform Flash: In-system programmable configuration with reconfiguration capability
- JTAG Programming: Boundary scan configuration and debugging interface support
- Configuration Management: Multi-boot and fail-safe configuration strategies
Intellectual Property (IP) Core Library
- DSP Processing Cores: Digital filters, FFT processors, and signal processing algorithms
- Communication Protocol IP: UART, SPI, I2C, and high-speed serial communication controllers
- Memory Interface Controllers: SDRAM, DDR, SRAM, and Flash memory interface IP
- Processor IP Cores: Soft-core processors and embedded system building blocks
- Application-Specific IP: Industry-specific processing and control algorithms
Technical Support and Design Services
- Xilinx Community Forums: Peer-to-peer technical discussions and problem resolution
- Application Engineering Support: Direct technical assistance from Xilinx specialists
- Alliance Partner Network: Certified design services and consulting partnerships
- Training and Certification: Professional development programs and skill building courses
Debug and Test Equipment
- Logic Analyzers: High-speed digital signal capture and analysis equipment
- In-Circuit Emulators: Real-time debugging and development support tools
- FPGA Programming: Dedicated programming hardware and cable systems
- Signal Generators: Test signal generation for functional verification
Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Directive Compliance: Lead-free package options available with full material traceability
- WEEE Directive: Waste electrical and electronic equipment regulations compliance
- REACH Regulation: European Union chemical safety requirements fully satisfied
- Conflict Minerals Compliance: Responsible sourcing with complete supply chain transparency
- Green Package Initiative: Environmentally sustainable manufacturing and packaging processes
Export Control and Trade Classifications
- ECCN Classification: 3A001.a.7 (Export Control Classification Number)
- Schedule B Export Number: 8542.39.0001 for United States export documentation
- HTS Import Classification: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location varies by production facility and assembly site
- Export License Requirements: Destination-dependent restrictions and end-use considerations
Quality and Manufacturing Standards
- Production Standards: ISO 9001:2015 certified manufacturing facilities worldwide
- Commercial Temperature Grade: -C suffix indicating 0°C to +85°C operation specification
- Moisture Sensitivity Level: MSL 3 classification per JEDEC J-STD-020D standards
- Quality Assurance Testing: 100% electrical test coverage with statistical quality monitoring
- Reliability Qualification: Comprehensive stress testing including temperature cycling and humidity exposure
Package and Assembly Information
- ESD Sensitivity Classification: Class 1C electrostatic discharge protection (>1000V HBM)
- Moisture Barrier Packaging: Sealed moisture barrier bags with desiccant packets
- Storage and Handling: Anti-static precautions and proper grounding procedures required
- Baking Requirements: Moisture drive-out procedures before surface mount assembly
- Assembly Compatibility: Compatible with standard SMT assembly processes and equipment
International Safety and EMC Certifications
- CE Marking: European conformity declaration for electromagnetic compatibility
- FCC Part 15: United States Federal Communications Commission EMI compliance
- IC Certification: Industry Canada electromagnetic compatibility requirements
- VCCI Japan: Voluntary Control Council for Interference compliance certification
- International Standards: IEC, ANSI, and other global safety and performance standards
Shipping and Logistics Information
- Transportation Classification: Not classified as hazardous material for shipping purposes
- IATA Regulations: International Air Transport Association packaging and handling requirements
- Packaging Standards: Anti-static protection and physical damage prevention measures
- Customs Documentation: Proper classification codes and country of origin certificates
Key Applications
The XCV50E-6PQG240C excels across diverse application domains requiring reliable programmable logic:
Telecommunications and Networking
- Digital signal processing in communication infrastructure equipment
- Protocol processing and packet classification in network switches
- Base station controllers and wireless communication systems
- Fiber optic communication interfaces and signal conditioning
Industrial Automation and Control
- Programmable logic controllers (PLCs) for manufacturing automation
- Motion control systems for precision machinery and robotics
- Process monitoring and control in industrial manufacturing
- Human-machine interface (HMI) controllers and display systems
Consumer and Multimedia Applications
- Digital video processing and format conversion systems
- Audio signal processing and digital audio workstations
- Set-top box controllers and multimedia streaming devices
- Gaming systems and entertainment electronics
Test and Measurement Equipment
- Automated test equipment (ATE) for semiconductor testing
- Laboratory instrumentation and data acquisition systems
- Signal generation and analysis equipment
- Quality control and production testing systems
Medical and Scientific Instrumentation
- Medical imaging and diagnostic equipment controllers
- Laboratory automation and analytical instrument control
- Patient monitoring and life support system controllers
- Scientific research equipment and data collection systems
Technical Advantages of XCV50E-6PQG240C
Package and Assembly Benefits
- PQFP Package: Traditional quad flat pack for proven assembly processes
- Guard Ring Protection: Enhanced package reliability and stress distribution
- Lead Accessibility: Visual inspection and rework capability with exposed leads
- Thermal Performance: Good heat dissipation characteristics for air-cooled applications
- Cost-Effective Assembly: Compatible with standard SMT assembly equipment and processes
Design and Development Advantages
- Proven Architecture: Time-tested Virtex-E platform with extensive field deployment history
- Comprehensive Tools: Mature development software with extensive documentation and support
- Pin Compatibility: Migration path within Virtex-E family for design scalability and upgrades
- Standard Performance: -6 speed grade provides optimal balance of performance and power consumption
- Commercial Temperature: Wide operating range suitable for most application environments
Supply Chain and Lifecycle Benefits
- Mature Product: Stable pricing and reliable supply chain with established manufacturing
- Global Availability: Worldwide distribution through authorized channel partners
- Long-term Support: Extended product lifecycle with comprehensive technical documentation
- Volume Scalability: Suitable for both prototype development and high-volume production
Design Considerations and Implementation Guidelines
Thermal Management Recommendations
- Heat Dissipation: Calculate junction temperature for continuous operation scenarios
- Air Flow Requirements: Natural convection versus forced air cooling considerations
- Heat Sink Selection: Thermal interface materials and heat sink attachment methods
- Thermal Monitoring: Temperature sensing and thermal protection strategies
Power Supply Design Guidelines
- Voltage Regulation: Clean, well-regulated power supplies with appropriate decoupling
- Power Sequencing: Proper startup and shutdown sequences for reliable operation
- Noise Considerations: Power supply filtering and isolation for noise-sensitive applications
- Current Requirements: Static and dynamic current consumption planning and measurement
PCB Layout Best Practices
- Signal Integrity: High-speed design practices and transmission line considerations
- Power Distribution: Adequate power and ground plane design for clean power delivery
- EMI Considerations: Electromagnetic interference mitigation and shielding strategies
- Component Placement: Optimal placement for thermal management and signal routing
Configuration and Programming Strategies
- Configuration Methods: Selection of appropriate configuration mode for application requirements
- Security Considerations: Bitstream protection and intellectual property security
- Multi-boot Capability: Fail-safe configuration and remote update strategies
- Test and Debug: In-system programming and debugging access planning
Technical Support and Procurement
For detailed technical specifications, current commercial pricing, and comprehensive application support for the XCV50E-6PQG240C, contact your regional authorized Xilinx distributor or visit the official Xilinx product support portal for access to the most current technical documentation, design resources, and engineering assistance.
Professional Design Services
- Application Consulting: Expert guidance for optimal device selection and implementation
- Design Review Services: Professional evaluation of circuit design and implementation
- Prototype Development: Rapid prototyping and proof-of-concept development support
- Production Support: Manufacturing test and quality assurance consultation
Supply Chain Management
- Inventory Planning: Demand forecasting and supply chain optimization
- Quality Programs: Additional screening and testing options for critical applications
- Lifecycle Management: Product obsolescence planning and migration strategies
- Global Logistics: Worldwide distribution and inventory management services
This comprehensive product description provides detailed information about the XCV50E-6PQG240C FPGA for professional design and procurement decisions. For the most current technical specifications, pricing, and support resources, consult official Xilinx documentation and authorized distribution partners.
