XCV50E-6PQ240I – Xilinx Virtex-E FPGA | High-Performance Field Programmable Gate Array

1. Product Specifications

Key Technical Specifications

Part Number: XCV50E-6PQ240I
Manufacturer: Xilinx (now AMD Xilinx)
Product Family: Virtex-E 1.8V FPGAs
Package Type: 240-Pin PQFP (Plastic Quad Flat Pack)
Speed Grade: -6 (6ns pin-to-pin delay)
Operating Temperature: Industrial grade

Detailed Technical Parameters

• System Gates: Approximately 50,000 gates
• Logic Cells: 1,728 configurable logic blocks (CLBs)
• CLB Array: 16 x 24 architecture
• User I/O Pins: 158 I/O ports
• Core Voltage: 1.8V ± 5%
• I/O Voltage: 2.5V/3.3V compatible
• Process Technology: 0.18μm 6-layer metal CMOS
• Maximum Operating Frequency: Up to 357 MHz
• Pin Count: 240 pins in PQFP package
• Package Dimensions: Standard 240-PQFP footprint

Performance Characteristics

• Pin-to-Pin Delay: 6ns (speed grade -6)
• Clock-to-Out Delay: Optimized for high-speed applications
• Setup Time: Industry-leading performance
• Power Consumption: Low power 1.8V operation
• Signal Integrity: Enhanced with SelectI/O+ technology

2. Pricing Information

Current Market Pricing

Pricing varies based on quantity and supplier. Contact authorized distributors for current pricing:

• Small Quantities (1-99 units): Request quote from authorized distributors
• Volume Pricing (100+ units): Significant discounts available
• OEM/Contract Pricing: Available for large volume commitments

Stock Availability

Based on current market data, the XCV50E-6PQ240I shows good availability from multiple distributors:

• New original components in stock at various suppliers
• Typical lead times: 2-4 weeks for standard quantities
• Express shipping options available

Note: Prices fluctuate based on market conditions. Contact suppliers directly for current pricing and availability.

3. Documents & Media

Official Documentation

Technical Documentation:

• Datasheet: XCV50E family datasheet (PDF available from Xilinx/AMD)
• User Guide: Virtex-E FPGA User Guide
• Application Notes: Various application-specific documentation
• Design Guidelines: PCB layout and design recommendations

CAD Resources:

• Symbol Libraries: Available for Altium Designer, Eagle, KiCad, OrCAD
• PCB Footprints: Standard 240-PQFP footprint files
• 3D Models: STEP files for mechanical design
• IBIS Models: Signal integrity simulation models

Software Support:

• Development Tools: Xilinx ISE Design Suite
• Programming: iMPACT programming software
• Simulation: ModelSim integration support

Programming and Configuration

• Configuration Methods: JTAG, SelectMAP, Serial
• Configuration Memory: External PROM or flash memory
• Partial Reconfiguration: Supported for advanced applications
• Design Entry: VHDL, Verilog, schematic capture

4. Related Resources

Development Tools and Software

Xilinx Design Software:

• ISE Design Suite: Primary development environment
• Foundation Series: Entry-level design tools
• Alliance Series: Advanced development platform
• ChipScope Pro: On-chip debugging and analysis

Compatible Components

Recommended Support Components:

• Configuration PROMs: XC18V series
• Clock Management: DCM and PLL resources
• Memory Interfaces: SDRAM, DDR, SRAM controllers
• Communication Interfaces: UART, SPI, I2C implementations

Application Examples

Common Use Cases:

• Digital Signal Processing: Filter implementation, FFT processing
• Communications: Protocol processing, software-defined radio
• Industrial Control: Motor control, automation systems
• Prototyping: ASIC prototyping and verification
• Aerospace/Defense: Mission-critical applications

Training and Support

• Xilinx University Program: Educational resources and support
• Online Training: Web-based learning modules
• Technical Support: Comprehensive support through AMD Xilinx
• Community Forums: User community and knowledge base

5. Environmental & Export Classifications

Environmental Compliance

RoHS Compliance:

• ✅ RoHS Compliant: Meets EU RoHS directive requirements
• ✅ Lead-Free: Compatible with lead-free soldering processes
• ✅ Halogen-Free: Environmentally friendly packaging materials

Environmental Standards:

• Operating Temperature Range: 0°C to +85°C (commercial grade)
• Storage Temperature: -65°C to +150°C
• Humidity: Up to 95% non-condensing
• Vibration Resistance: Per JEDEC standards
• Shock Resistance: Industry standard specifications

Quality and Reliability

Quality Certifications:

• ISO 9001: Quality management system certified
• ISO 14001: Environmental management certified
• JEDEC Standards: Full compliance with industry standards
• Automotive Grade: Available in automotive-qualified versions

Reliability Metrics:

• MTBF: >1M hours under normal operating conditions
• ESD Protection: Human Body Model (HBM) and Machine Model (MM)
• Latch-up Immunity: >100mA per JEDEC standard
• Endurance: >10,000 configuration cycles minimum

Export and Trade Compliance

Export Classification:

• ECCN (Export Control Classification Number): Check current regulations
• Country of Origin: Manufactured in various Xilinx facilities
• REACH Compliance: Compliant with EU REACH regulation
• WEEE Directive: Compliant with European waste regulations

Trade Considerations:

• ROHS Certificate: Available upon request
• Conflict Minerals: Xilinx conflict minerals reporting available
• Supply Chain: Authorized distributor network worldwide
• Anti-Counterfeiting: Purchase only from authorized distributors

Packaging and Handling

ESD Protection:

• ESD Sensitive: Handle with appropriate ESD precautions
• Packaging: Anti-static tubes or trays
• Moisture Sensitivity: Level 3 per JEDEC J-STD-020
• Baking Requirements: If moisture exposure occurs

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Why Choose XCV50E-6PQ240I?

The XCV50E-6PQ240I FPGA represents proven technology from Xilinx’s successful Virtex-E family, offering exceptional value for applications requiring reliable, high-performance programmable logic. With its robust 158 I/O configuration and mature development ecosystem, this FPGA continues to serve critical applications across multiple industries.

Key Benefits:

• ✅ Proven Reliability: Mature, field-tested technology
• ✅ Cost-Effective: Competitive pricing for performance delivered
• ✅ Design Flexibility: Extensive I/O options and logic capacity
• ✅ Tool Support: Comprehensive development tool ecosystem
• ✅ Global Availability: Worldwide distributor network

For technical support, pricing, and availability information, contact authorized Xilinx distributors or visit the official AMD Xilinx website.