XCV50E-6PQ240C – Xilinx Virtex-E FPGA | Commercial Grade Field Programmable Gate Array

1. Product Specifications

Key Technical Specifications

Part Number: XCV50E-6PQ240C
Manufacturer: Xilinx (now AMD Xilinx)
Product Family: Virtex-E 1.8V FPGAs
Package Type: 240-Pin PQFP (Plastic Quad Flat Pack)
Speed Grade: -6 (6ns pin-to-pin delay)
Temperature Grade: Commercial (C) – 0°C to +85°C

Detailed Technical Parameters

• System Gates: 71,693 gates
• Logic Cells: 1,728 configurable logic blocks (CLBs)
• CLB Array: 384 CLBs architecture
• Total CLBs: 384 LABs/CLBs
• User I/O Pins: 158 I/O ports
• Total Pin Count: 240 pins
• Core Voltage: 1.8V ± 5%
• I/O Voltage: 2.5V/3.3V compatible with SelectI/O+ technology
• Process Technology: 0.18μm 6-layer metal CMOS
• Maximum Operating Frequency: 357MHz
• RAM Capacity: 8kB maximum RAM

Performance Characteristics

• Pin-to-Pin Delay: 6ns (speed grade -6)
• Clock-to-Out Delay: Optimized for high-speed commercial applications
• Setup Time: Industry-leading performance specifications
• Power Consumption: Low power 1.8V operation
• Signal Integrity: Enhanced with Xilinx SelectI/O+ technology
• Operating Temperature: 0°C to +85°C (Commercial grade)

Package Details

• Package Type: 240-PQFP (Plastic Quad Flat Pack)
• Mounting Type: Surface Mount
• Pin Pitch: 0.5mm
• Package Size: Standard 240-PQFP footprint
• Lead Finish: Compatible with lead-free soldering processes

2. Pricing Information

Current Market Pricing

Pricing varies based on quantity, supplier, and market conditions:

• Small Quantities (1-99 units): Request quote from authorized distributors
• Medium Volume (100-999 units): Volume pricing available
• Large Volume (1000+ units): Significant volume discounts available
• OEM/Contract Pricing: Negotiable for large commitments

Stock Availability

Based on current market intelligence, the XCV50E-6PQ240C shows strong availability:

• New original, 2796 pcs Stock Available from multiple suppliers
• Lead Times: 2-6 weeks for standard quantities
• Express Options: Expedited shipping available
• Global Availability: Worldwide distributor network

Price Factors

Factors affecting XCV50E-6PQ240C pricing:

• Market demand fluctuations
• Silicon wafer availability
• Distributor inventory levels
• Order quantity and terms
• Geographic location and shipping

Note: Due to semiconductor market volatility, contact authorized distributors for current pricing and lead times.

3. Documents & Media

Official Technical Documentation

Core Documentation:

• Datasheet: Virtex-E FPGA family complete specifications
• User Guide: Comprehensive design and implementation guide
• Application Notes: Design optimization and best practices
• Errata: Known issues and workarounds
• Migration Guide: Transition paths from other FPGA families

Design Resources:

• Pin Assignment Guide: Complete pinout documentation
• PCB Layout Guidelines: Board design recommendations
• Power Distribution Guide: Power supply design specifications
• Thermal Management: Heat dissipation guidelines

CAD and Design Files

Electronic Design Files:

• Symbol Libraries: Schematic symbols for major EDA tools
  • Altium Designer compatible symbols
  • Eagle CAD library files
  • KiCad symbol libraries
  • OrCAD component database
• PCB Footprints: Standard 240-PQFP land patterns
• 3D Models: STEP files for mechanical verification
• IBIS Models: Signal integrity simulation models

Software and Development Tools

Primary Development Environment:

• ISE Design Suite: Legacy development platform for Virtex-E
• WebPACK: Free development tools
• Foundation Series: Entry-level design environment
• Alliance Series: Professional development platform

Programming and Configuration:

• iMPACT: Programming and configuration software
• ChipScope Pro: On-chip debugging and analysis
• Timing Analyzer: Static timing analysis tools
• FPGA Editor: Low-level design editing

Reference Designs and IP

Available IP Cores:

• Communication Interfaces: UART, SPI, I2C controllers
• Memory Controllers: SDRAM, SRAM, Flash interfaces
• Digital Signal Processing: FIR filters, FFT processors
• Bus Interfaces: PCI, VME, custom protocols

4. Related Resources

Development Boards and Kits

Recommended Development Platforms:

• Spartan-3 Starter Kit: Entry-level development platform
• Virtex-E Evaluation Boards: Professional development tools
• Custom Carrier Boards: Application-specific development platforms
• Third-party Development Boards: Various vendor solutions

Compatible Components

Essential Support Components:

• Configuration Memory:
  • XC18V series PROMs
  • Platform Flash memory devices
  • Serial configuration options
• Clock Management:
  • Crystal oscillators (various frequencies)
  • Clock distribution networks
  • PLL and DLL resources
• Power Management:
  • 1.8V core power supplies
  • 3.3V/2.5V I/O power supplies
  • Power sequencing circuits

Software Ecosystem

Design Entry Options:

• Hardware Description Languages:
  • VHDL synthesis and simulation
  • Verilog HDL support
  • SystemVerilog compatibility
• Graphical Design Entry:
  • Schematic capture tools
  • Block diagram design
  • State machine editors

Simulation and Verification:

• ModelSim: Industry-standard simulator
• ISIM: Integrated simulation environment
• Third-party Simulators: VCS, NC-Sim compatibility

Application Examples

Common Use Cases:

• Digital Signal Processing:
  • Real-time filter implementations
  • FFT/DFT processing engines
  • Digital communication systems
• Industrial Control:
  • Motor control applications
  • Process automation systems
  • Safety-critical controllers
• Communications:
  • Protocol processing engines
  • Software-defined radio
  • Network packet processing
• Prototyping:
  • ASIC prototyping and verification
  • Algorithm development platforms
  • System-level integration testing

Training and Educational Resources

Learning Resources:

• Xilinx University Program: Academic support and curriculum
• Online Training Modules: Self-paced learning courses
• Webinar Series: Regular technical presentations
• User Forums: Community support and knowledge sharing
• Application Notes: Detailed implementation guides

5. Environmental & Export Classifications

Environmental Compliance Standards

RoHS and Environmental Compliance:

• ✅ RoHS Compliant: Meets EU RoHS directive 2011/65/EU
• ✅ Lead-Free Compatible: Suitable for lead-free soldering processes
• ✅ Halogen-Free Options: Environmentally conscious packaging
• ✅ REACH Compliant: Meets EU chemical regulation requirements

Environmental Operating Conditions:

• Operating Temperature: 0°C to +85°C (Commercial grade)
• Junction Temperature: -40°C to +125°C maximum
• Storage Temperature: -65°C to +150°C
• Relative Humidity: 5% to 95% non-condensing
• Altitude: Up to 2000 meters operational

Quality and Reliability Standards

Quality Certifications:

• ISO 9001:2015: Quality management system certified
• ISO 14001: Environmental management system
• TS 16949: Automotive quality standard (where applicable)
• AS9100: Aerospace quality standard compliance

Reliability Specifications:

• MTBF: >1,000,000 hours under normal conditions
• ESD Protection:
  • Human Body Model (HBM): >2000V
  • Machine Model (MM): >200V
  • Charged Device Model (CDM): >1000V
• Latch-up Immunity: >100mA per JEDEC JESD78
• Configuration Cycles: >10,000 minimum guaranteed
• Data Retention: >20 years at 55°C

Export Control and Trade Compliance

Export Classification:

• ECCN (Export Control Classification Number): Check current US BIS regulations
• Country of Origin: Various Xilinx manufacturing facilities
• Dual-Use Technology: Subject to export licensing requirements
• End-Use Restrictions: Military and sensitive applications may require licenses

International Compliance:

• WEEE Directive: Compliant with EU electronic waste regulations
• ROHS Certificate: Available upon request from distributors
• Conflict Minerals: Xilinx conflict minerals report available
• Trade Compliance: Follow all applicable import/export regulations

Packaging and Handling Requirements

ESD and Moisture Sensitivity:

• ESD Classification: ESD sensitive device – Class 1C
• Moisture Sensitivity Level: MSL 3 per JEDEC J-STD-020
• Floor Life: 168 hours at ≤30°C/60% RH after bag opening
• Baking Requirements: 125°C for 24 hours if floor life exceeded

Packaging Standards:

• Primary Packaging: Anti-static tubes or trays
• Secondary Packaging: Moisture barrier bags with desiccant
• Shipping Packaging: ESD protective containers
• Labeling: Full traceability with date codes and lot numbers

Supply Chain and Authentication

Anti-Counterfeiting Measures:

• Authorized Distributor Network: Purchase only from verified sources
• Authentication Services: Xilinx part authentication available
• Traceability: Full supply chain documentation
• Quality Assurance: 100% electrical testing and inspection

Supply Chain Responsibility:

• Supplier Code of Conduct: Ethical sourcing practices
• Conflict-Free Minerals: Compliance with conflict minerals regulations
• Environmental Stewardship: Sustainable manufacturing practices
• Social Responsibility: Fair labor practices throughout supply chain

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Why Choose XCV50E-6PQ240C?

The XCV50E-6PQ240C FPGA represents a mature, reliable solution from Xilinx’s successful Virtex-E family, offering exceptional value for commercial applications requiring proven programmable logic technology. With its commercial temperature rating and robust feature set, this FPGA continues to serve critical applications across multiple industries.

Key Advantages:

• ✅ Commercial Grade Reliability: 0°C to +85°C operation
• ✅ Proven Technology: Field-tested Virtex-E architecture
• ✅ Cost-Effective Solution: Competitive price-to-performance ratio
• ✅ Design Flexibility: 384 CLBs with 71,693 gates
• ✅ Comprehensive Toolchain: Mature development environment
• ✅ Global Support: Worldwide distributor and technical support network

Target Applications:

• Commercial and industrial control systems
• Communications infrastructure equipment
• Test and measurement instruments
• Digital signal processing applications
• ASIC prototyping and verification platforms

For technical support, current pricing, and availability information, contact authorized Xilinx distributors or visit the official AMD Xilinx website for the latest documentation and resources.