XCV50E-6FGG256C – Xilinx Virtex-E FPGA | 256-Pin FBGA Field Programmable Gate Array

1. Product Specifications

Core Technical Specifications

Part Number: XCV50E-6FGG256C
Manufacturer: AMD Xilinx (formerly Xilinx)
Product Family: Virtex-E 1.8V FPGAs
Package Type: 256-Pin Fine-Pitch Ball Grid Array (FBGA)
Speed Grade: -6 (6ns pin-to-pin delay)
Temperature Grade: Commercial/Industrial

Detailed Performance Parameters

• System Gates: Approximately 71,693 total system gates
• Logic Cells: 1,728 configurable logic blocks (CLBs) organized in 16 x 24 array
• Maximum Operating Frequency: Up to 357 MHz
• Core Voltage: 1.8V ± 5%
• I/O Voltage: 2.5V/3.3V SelectI/O+ compatible
• Process Technology: 0.18μm 6-layer metal CMOS
• Pin Count: 256 pins in FBGA configuration
• I/O Pins: 176 user I/O pins available

Advanced Features

• Architecture: Optimized place-and-route efficiency
• Memory: SelectRAM+ distributed and block RAM
• Clock Management: Digital Clock Manager (DCM) support
• Configuration: Multiple configuration modes (JTAG, SelectMAP, Serial)
• Reconfiguration: Support for partial reconfiguration
• Design Security: Readback protection capabilities

Package Characteristics

• Package Type: 256-pin Fine-pitch Ball Grid Array (FBGA)
• Ball Pitch: Standard FBGA spacing
• Package Size: Industry-standard 256-FBGA footprint
• Thermal Performance: Enhanced thermal characteristics
• Pin-to-Pin Delay: 6ns (speed grade -6)

2. Pricing Information

Current Market Analysis

Important Note: The XCV50E-6FGG256C is marked as “NOT RECOMMENDED for NEW DESIGN” by AMD Xilinx, indicating this device is in legacy status for maintenance and replacement applications only.

Pricing Structure

Legacy Component Pricing:

• Small Quantities (1-99 units): Contact authorized distributors for current pricing
• Volume Pricing (100+ units): Quantity discounts available from stock
• OEM/Legacy Support: Special pricing for long-term maintenance contracts

Current Stock Availability

Based on distributor data:

• Stock Status: New original components available – 2,770 pieces in stock from major distributors
• Lead Times: Immediate to 2-4 weeks depending on quantity
• Sourcing: Multiple authorized distributors maintain inventory

Key Suppliers:

• Authorized Xilinx/AMD distributors
• Specialty legacy component suppliers
• OEM maintenance stock providers

Note: As a legacy component, pricing may be higher than current-generation alternatives. Contact suppliers for competitive quotes and availability.

3. Documents & Media

Official Technical Documentation

Primary Documentation:

• Datasheet: Virtex-E FPGA family complete datasheet (PDF)
• User Guide: Comprehensive Virtex-E FPGA configuration and usage guide
• Application Notes: Legacy application notes for Virtex-E family
• Migration Guide: Transition recommendations to current FPGA families

Design Resources:

• CAD Libraries: Symbol and footprint libraries for major EDA tools
• PCB Footprints: 256-FBGA package footprint files
• 3D Models: STEP and IGES models for mechanical design
• IBIS Models: Signal integrity simulation models

Software and Development Tools

Legacy Development Environment:

• ISE Design Suite: Primary development platform (Foundation Series™ or Alliance Series™)
• Design Entry: Support for schematic diagrams and HDLs (VHDL/Verilog)
• Programming Tools: iMPACT configuration software
• Simulation: ModelSim integration support

Important Notes:

• Not supported in latest Vivado Design Suite
• Legacy ISE software remains available for download
• ChipScope Pro for on-chip debugging

Configuration and Programming

Configuration Methods:

• JTAG: Ideal for on-board debugging and flexible reconfiguration
• SelectMAP: Fast parallel configuration for production systems
• Serial Configuration: Standard serial programming interface
• Boundary Scan: IEEE 1149.1 compliant

4. Related Resources

Application Areas

Primary Applications:

• Legacy System Maintenance: Ideal for fixing, upgrading, or keeping older systems running
• Communication Systems: Digital signal processing for filtering and encoding
• Aerospace and Defense: Navigation systems and satellite communication requiring high reliability
• Industrial Control: Automation systems and process control
• ASIC Prototyping: Design verification and testing platform

Compatible Components and Alternatives

Legacy Support Components:

• Configuration PROMs: XC18V series for configuration storage
• Development Boards: Legacy Virtex-E evaluation platforms
• Support Chips: Level shifters, clock generators, memory interfaces

Migration Path Options:

• Current Xilinx FPGAs: Zynq UltraScale+, Kintex, Artix families
• Pin-Compatible Alternatives: Contact AMD Xilinx for migration recommendations
• Software Migration: ISE to Vivado transition tools available

Technical Support and Community

AMD Xilinx Support:

• Legacy Product Support: Continued support through AMD’s Embedded and Adaptive Computing Group
• Technical Documentation: Maintained archive of Virtex-E resources
• Community Forums: User community support for legacy devices
• Application Engineering: Limited legacy device support available

Third-Party Resources:

• Training Materials: Legacy FPGA design courses and tutorials
• Reference Designs: Open-source Virtex-E implementations
• Consulting Services: Specialized legacy FPGA design services

Design Considerations

When to Use XCV50E-6FGG256C:

• Evaluate logic cell count (1,728), system gates (71,693), clock speed (up to 357 MHz), and I/O support
• Excellent fit for designs within these specifications, especially with robust clock management and SelectRAM+ memory architecture
• Drop-in replacement for existing Virtex-E designs
• Cost-effective for low-volume legacy applications

Migration Recommendations:

• Consider current-generation FPGAs for new designs
• Evaluate performance vs. power advantages of newer devices
• Assess long-term availability and support requirements

5. Environmental & Export Classifications

Environmental Compliance Standards

RoHS and Environmental:

• ✅ RoHS Compliant: Meets EU RoHS directive requirements (legacy status)
• ✅ Lead-Free Compatible: Supports lead-free soldering processes
• ✅ WEEE Directive: Compliant with European waste electrical equipment regulations
• ✅ REACH Compliant: Meets EU chemical safety regulations

Operating Specifications:

• Operating Temperature: 0°C to +85°C (commercial grade)
• Extended Temperature: -40°C to +100°C (industrial grade available)
• Storage Temperature: -65°C to +150°C
• Humidity Tolerance: Up to 95% non-condensing
• Vibration/Shock: Per JEDEC industry standards

Quality and Reliability Metrics

Quality Standards:

• Manufacturing: ISO 9001 certified production facilities
• Quality Control: Comprehensive pre-shipment inspection
• Reliability Testing: JEDEC standard qualification testing
• Package Integrity: BGA ball attach reliability proven

Reliability Characteristics:

• MTBF: >1M hours under normal operating conditions
• ESD Protection: Human Body Model (HBM) >2000V
• Latch-up Immunity: >100mA per JEDEC standard
• Configuration Endurance: >10,000 reconfiguration cycles
• Data Retention: >20 years at 85°C

Export and Trade Classifications

Regulatory Compliance:

• Export Control: Check current ECCN classification
• Country of Origin: Various AMD Xilinx manufacturing facilities
• Conflict Minerals: AMD Xilinx conflict minerals reporting available
• Anti-Counterfeiting: Purchase only from authorized distributors

Trade Considerations:

• Import/Export: Verify current trade regulations
• Documentation: Certificates of compliance available
• Supply Chain: Established global distributor network
• Legacy Support: Long-term availability through authorized channels

Handling and Storage Requirements

ESD Protection:

• ESD Sensitivity: Class 1 ESD sensitive device
• Handling: Proper ESD precautions required
• Packaging: Anti-static trays or tubes
• Storage: Dry storage recommended

Moisture Sensitivity:

• MSL Rating: Moisture Sensitivity Level 3 per JEDEC J-STD-020
• Baking: May require baking if moisture exposure occurs
• Floor Life: Limited floor life after package opening
• Reflow Profile: Standard lead-free reflow compatible

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Why Choose XCV50E-6FGG256C for Legacy Applications?

The XCV50E-6FGG256C FPGA represents mature, field-proven technology ideal for maintaining critical legacy systems. While not recommended for new designs, this device offers unmatched compatibility for existing Virtex-E implementations requiring long-term support.

Legacy Application Benefits:

• ✅ Proven Reliability: Field-tested technology with robust performance history
• ✅ Drop-in Replacement: Pin and software compatible with existing designs
• ✅ Available Inventory: Current stock available from multiple distributors
• ✅ Technical Support: Continued support through AMD Xilinx legacy programs
• ✅ Cost-Effective: Competitive pricing for legacy maintenance applications

Important Considerations:

• ⚠️ Legacy Status: Not recommended for new designs
• ⚠️ Limited Lifecycle: Consider migration path for long-term projects
• ⚠️ Software Support: Requires legacy ISE design tools

For technical support, replacement options, and current availability, contact authorized AMD Xilinx distributors or legacy component specialists.