Product Specifications
Core Device Architecture
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV50E-6CSG144C
- System Gates: 50,000 equivalent gates
- Configurable Logic Blocks (CLBs): 576 logic cells
- User I/O Pins: 97 available I/O connections
- Package Type: CSG144 (Chip Scale Grid Array)
- Speed Grade: -6 (standard performance grade)
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
Package and Physical Specifications
- Package Format: 144-ball Chip Scale Grid Array
- Package Dimensions: 10mm x 10mm x 1.2mm
- Ball Pitch: 0.8mm ultra-fine pitch for high-density routing
- Ball Count: 144 solder balls total
- Package Height: Ultra-low profile at 1.2mm maximum
- Substrate: Advanced organic substrate for reliable interconnection
- Mounting: Surface mount technology optimized for automated assembly
Memory Architecture and Capacity
- Block RAM: 32 Kbits total embedded block memory
- Block RAM Organization: 4 independent dual-port memory blocks
- Block RAM Configuration: 8K x 1 or 4K x 2 bit configurations
- Distributed RAM: User-configurable from CLB lookup table resources
- Configuration Storage: SRAM-based for rapid reconfiguration capability
- Memory Performance: True dual-port operation with independent clock domains
Performance and Electrical Characteristics
- Maximum Operating Frequency: Up to 175 MHz (speed grade -6)
- Core Supply Voltage: 2.5V ยฑ5% regulation tolerance
- I/O Supply Voltage: 3.3V nominal with multiple standard support
- Static Power Consumption: Low quiescent current for battery applications
- Dynamic Power: Optimized for portable and embedded applications
- Propagation Delay: Balanced timing for mainstream applications
Advanced Programmable Logic Features
- Clock Management: Four Delay Locked Loops (DLLs) for precise timing control
- I/O Standards Support: LVDS, LVCMOS, GTL, SSTL, and HSTL compatibility
- Boundary Scan: Complete IEEE 1149.1 JTAG implementation for testability
- Arithmetic Processing: Dedicated carry chain logic for efficient computation
- Configuration Security: Bitstream encryption and readback protection options
- Hot-Swap Capability: Live insertion and removal support for system flexibility
Compact Package Advantages
- Space Efficiency: 10mm x 10mm footprint for miniaturized designs
- High I/O Density: 97 I/O pins in ultra-compact package
- Low Profile: 1.2mm height for thin form factor applications
- Thermal Performance: Excellent heat dissipation despite small size
- Assembly Friendly: Compatible with standard SMT processes
Pricing Information
Market Pricing Structure for XCV50E-6CSG144C
Volume-Based Pricing Tiers:
- Engineering Samples (1-9 units): Premium pricing for evaluation and prototyping
- Development Quantities (10-49 units): Reduced rates for design validation phases
- Pilot Production (50-249 units): Volume pricing for initial manufacturing runs
- Full Production (250+ units): Maximum discounts with long-term supply commitments
Competitive Pricing Factors
- Compact Package Premium: CSG144 package commands slight premium over larger packages
- Space-Saving Value: Cost offset by reduced PCB area and system miniaturization
- Commercial Temperature: Standard temperature range for cost optimization
- Mature Technology: Established manufacturing processes supporting competitive pricing
- High Integration: Excellent price-performance ratio for compact applications
Authorized Distribution Channels
- Digi-Key Electronics: Comprehensive inventory with fast delivery for prototyping
- Mouser Electronics: Technical design support and comprehensive product information
- Arrow Electronics: Volume pricing programs and supply chain optimization
- Avnet: Design services integration and comprehensive technical support
- Future Electronics: Global distribution with specialized compact device expertise
Cost-Effective Design Strategies
- System Miniaturization: Leverage compact package for overall system cost reduction
- PCB Area Savings: Reduce board size and layer count requirements
- Assembly Optimization: Fine-pitch capabilities enable high-density designs
- Volume Planning: Long-term commitments for better pricing structures
Contact authorized distributors for current XCV50E-6CSG144C pricing, availability, and volume discount programs specific to compact device applications.
Documents & Media
Comprehensive Technical Documentation
- Product Datasheet: Complete electrical specifications, timing parameters, and operating limits
- User Guide: Detailed design implementation manual with compact package considerations
- Application Notes: Design methodologies optimized for space-constrained applications
- Package Documentation: Mechanical drawings, thermal characteristics, and assembly specifications
- Design Advisory: Known characteristics, limitations, and recommended design practices
Compact Package Design Resources
- Pin Assignment Files: Complete pinout documentation optimized for high-density routing
- IBIS Models: Signal integrity simulation models for fine-pitch BGA design
- Thermal Analysis Models: Junction-to-ambient thermal resistance data
- Power Estimation Tools: Accurate power consumption modeling for battery applications
- Assembly Guidelines: SMT placement and soldering recommendations for 0.8mm pitch
PCB Design Support for Compact Applications
- High-Density Layout Guidelines: Routing strategies for 0.8mm ball pitch
- Via-in-Pad Design: Techniques for ultra-compact PCB implementations
- Multi-Layer Routing: Strategies for maximizing routing density
- Impedance Control: Signal integrity in high-density layouts
- Thermal Management: Heat dissipation strategies for compact packages
Development Software and Tools
- Xilinx ISE Design Suite: Professional FPGA development environment
- WebPACK Edition: Free development tools for educational and evaluation use
- ChipScope Pro: Real-time debugging and signal analysis capabilities
- System Generator: MATLAB/Simulink integration for DSP applications
- Compact Design Tools: Specialized utilities for space-constrained implementations
Educational and Reference Materials
- Compact Design Tutorials: Step-by-step guides for miniaturized implementations
- Video Training Series: Specialized content for high-density design techniques
- Application Examples: Reference designs for portable and embedded applications
- Best Practices Guide: Proven methodologies for compact FPGA implementations
Related Resources
Development Platforms for Compact Applications
- Mini Evaluation Boards: Compact development platforms featuring XCV50E-6CSG144C
- Prototype Modules: Ultra-compact development systems for proof-of-concept
- Breadboard Adapters: CSG144-to-DIP conversion modules for prototyping
- Embedded Development Kits: Complete systems for portable application development
Compatible Product Ecosystem
- XCV50E Package Alternatives: Comparison with FG256 and PQ240 package options
- XCV100E-6CSG144C: Higher gate count option in same compact package
- Spartan Compact Series: Cost-optimized alternatives for volume applications
- CoolRunner CPLD: Complementary logic devices for ultra-low power applications
Configuration Solutions for Compact Systems
- XC18V Compact PROMs: Space-efficient configuration memory devices
- XCF Platform Flash: Miniaturized in-system programmable configuration
- Embedded Configuration: On-board configuration storage solutions
- Serial Configuration: SPI and I2C configuration for minimal pin count
Specialized IP Cores for Compact Applications
- Low-Power IP Cores: Power-optimized building blocks for battery applications
- Communication IP: Compact protocol stacks and interface controllers
- Memory Interface IP: Space-efficient memory controllers and interfaces
- Sensor Interface IP: Specialized cores for embedded sensor applications
- Wireless Communication IP: Compact RF and wireless protocol implementations
Technical Support for Compact Design
- Miniaturization Expertise: Specialized support for space-constrained designs
- Thermal Analysis Services: Heat dissipation modeling for compact packages
- EMC Design Support: Electromagnetic compatibility in high-density layouts
- Assembly Process Support: SMT guidelines for fine-pitch component placement
Design Services for Compact Applications
- PCB Layout Services: Specialized high-density routing expertise
- Thermal Simulation: Advanced thermal modeling and analysis
- Signal Integrity Analysis: High-speed design verification for compact layouts
- Manufacturing Support: Assembly process optimization and yield improvement
Related Applications and Markets
Portable and Mobile Electronics
- Handheld test and measurement instruments
- Portable medical devices and diagnostic equipment
- Mobile communication devices and accessories
- Battery-powered data acquisition systems
Embedded and IoT Applications
- Industrial IoT sensors and edge computing nodes
- Embedded vision and image processing systems
- Wireless sensor networks and data loggers
- Smart home and building automation devices
Consumer Electronics
- Wearable technology and fitness devices
- Compact gaming and entertainment systems
- Digital cameras and imaging devices
- Smart appliances and connected devices
Aerospace and Defense
- Miniaturized avionics and navigation systems
- Portable tactical communication equipment
- Unmanned vehicle control systems
- Space-constrained satellite applications
Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Directive Compliance: Lead-free manufacturing with halogen-free options available
- WEEE Directive: Waste electrical and electronic equipment regulations fully satisfied
- REACH Compliance: European Union chemical safety requirements completely met
- Conflict Minerals: Responsible sourcing with comprehensive supply chain traceability
- Green Manufacturing: Environmentally sustainable production processes implemented
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- Schedule B Export Number: 8542.39.0001 for United States export documentation
- HTS Import Classification: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location varies by production facility
- Export License Requirements: Destination and application-dependent restrictions
Quality and Manufacturing Standards
- Production Standards: ISO 9001:2015 certified manufacturing facilities worldwide
- Temperature Grade: Commercial (-C designation) for 0ยฐC to +85ยฐC operation
- Moisture Sensitivity: MSL 3 classification per JEDEC J-STD-020D standards
- Quality Control: 100% electrical testing with optional extended burn-in procedures
- Reliability Qualification: Comprehensive testing including temperature and humidity cycling
Package and Assembly Classifications
- ESD Sensitivity: Class 1C electrostatic discharge sensitive device rating
- Moisture Barrier Packaging: Sealed bags with desiccant for extended storage life
- Baking Requirements: Pre-assembly moisture drive-out procedures specified
- Assembly Compatibility: Lead-free soldering process compatible with standard profiles
- Handling Procedures: Anti-static precautions and proper grounding requirements
International Safety and EMC Certifications
- CE Marking: European conformity declaration for electromagnetic compatibility
- FCC Part 15: United States Federal Communications Commission compliance
- IC (Industry Canada): Canadian electromagnetic compatibility certification
- VCCI (Japan): Voluntary Control Council for Interference standards compliance
- International Standards: IEC 61000 electromagnetic compatibility series compliance
Compact Package Specific Considerations
- Fine-Pitch Assembly: Specialized SMT equipment requirements for 0.8mm pitch
- X-Ray Inspection: Non-destructive testing capabilities for hidden solder joints
- Rework Procedures: Specialized techniques for compact BGA component replacement
- Storage Sensitivity: Enhanced moisture protection due to fine-pitch characteristics
Key Technical Advantages
Space and Size Benefits
- Ultra-Compact Footprint: 10mm x 10mm package for maximum space efficiency
- Low Profile Design: 1.2mm height enables thin form factor applications
- High I/O Density: 97 I/O pins in minimal package area
- Board Space Savings: Significant PCB area reduction compared to larger packages
- System Miniaturization: Enables overall product size reduction
Performance and Functionality Advantages
- Balanced Performance: Speed grade -6 provides optimal price-performance balance
- Embedded Memory: 32 Kbits of dual-port block RAM for data buffering
- Clock Management: Four DLLs for precise timing control in compact systems
- Comprehensive I/O: Multiple voltage standards support in space-efficient package
- Low Power Operation: Optimized for battery-powered and portable applications
Design and Implementation Benefits
- Proven Technology: Mature Virtex-E architecture with extensive field deployment
- Comprehensive Tools: Complete development environment with specialized compact design support
- Pin Efficiency: Optimized pin assignment for maximum utilization in compact package
- Thermal Performance: Excellent heat dissipation despite ultra-small size
- Assembly Compatibility: Standard SMT processes with specialized fine-pitch capabilities
Design Considerations for Compact Applications
PCB Layout and Routing Strategies
- High-Density Routing: Advanced techniques for 0.8mm ball pitch implementation
- Via-in-Pad Technology: Essential for ultra-compact PCB implementations
- Layer Stack-up: Optimized PCB layer configurations for signal integrity
- Impedance Matching: Critical for high-speed signals in compact layouts
- Crosstalk Mitigation: Spacing and shielding in high-density environments
Thermal Management in Compact Packages
- Junction Temperature: Critical monitoring for reliable operation in small packages
- Heat Spreading: Thermal via arrays and copper pour strategies
- Airflow Considerations: Ventilation requirements for compact enclosures
- Thermal Interface: Heat sink attachment methods for miniaturized systems
Power Supply Design for Compact Systems
- Power Delivery: Clean power distribution in space-constrained layouts
- Decoupling Strategy: Optimal capacitor placement for fine-pitch packages
- Noise Reduction: EMI mitigation in high-density electronic environments
- Efficiency Optimization: Power management for battery-operated devices
Assembly and Manufacturing Considerations
- SMT Process Control: Precise placement and soldering for 0.8mm pitch
- Inspection Methods: X-ray and optical inspection for quality assurance
- Rework Capability: Specialized techniques for component replacement
- Yield Optimization: Process improvements for fine-pitch assembly success
Technical Support and Ordering
For comprehensive specifications, current pricing information, and specialized technical support for the XCV50E-6CSG144C, contact your regional authorized Xilinx distributor or access the Xilinx Compact Design Center for the most current documentation, design resources, and miniaturization expertise.
Specialized Design Support Services
- Compact Design Consultation: Expert guidance for space-constrained applications
- Thermal Analysis Services: Advanced thermal modeling and heat dissipation strategies
- High-Density Layout Review: PCB design verification for fine-pitch implementations
- Assembly Process Support: SMT guidelines and yield optimization assistance
Supply Chain and Manufacturing Support
- Inventory Management: Specialized handling for compact device requirements
- Quality Assurance: Additional screening options for critical applications
- Global Distribution: Worldwide availability with expedited delivery options
- Technical Documentation: Comprehensive support materials for compact implementations
Training and Development Resources
- Compact Design Training: Specialized courses for miniaturized FPGA implementations
- Assembly Workshops: Hands-on training for fine-pitch SMT processes
- Design Methodology: Best practices for space-constrained electronic design
- Certification Programs: Professional development for compact system designers
This comprehensive product description covers the essential aspects of the XCV50E-6CSG144C FPGA for space-constrained and portable applications. For the latest technical specifications, compact design resources, and specialized application support, consult official Xilinx documentation and authorized distribution partners specializing in miniaturized electronic solutions.
