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XCV400E-7FGG676C FPGA – High-Performance Virtex-E Field Programmable Gate Array

Original price was: $20.00.Current price is: $19.00.

The XCV400E-7FGG676C is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family, engineered for high-performance digital signal processing and embedded applications. This advanced programmable logic device delivers exceptional computational power with 129.6K gates and operates at speeds up to 400MHz, making it an ideal solution for demanding industrial, telecommunications, and aerospace applications.

Product Specifications

Core Architecture

  • Family: AMD Xilinx Virtex-E Series
  • Logic Capacity: 129.6K gates
  • Logic Cells: 10,800 cells
  • Operating Frequency: 400MHz maximum
  • Process Technology: 0.18ฮผm CMOS
  • Supply Voltage: 1.8V core voltage
  • I/O Count: 404 user I/O pins

Package Details

  • Package Type: FBGA (Fine Ball Grid Array)
  • Pin Count: 676 pins
  • Package Code: FGG676C
  • Lead Status: RoHS compliant
  • Speed Grade: -7 (commercial temperature range)

Memory and Resources

  • CLBs (Configurable Logic Blocks): Advanced architecture for flexible logic implementation
  • Block RAM: Integrated memory blocks for data storage
  • Multipliers: Dedicated multiplication resources
  • Clock Management: Advanced clock distribution networks

Operating Conditions

  • Temperature Range: Commercial (0ยฐC to +85ยฐC)
  • Junction Temperature: Up to +125ยฐC
  • Power Consumption: Optimized for high-performance applications

Price Information

The XCV400E-7FGG676C is available through authorized distributors and electronic component suppliers worldwide. Pricing varies based on quantity, lead time, and supplier. For current pricing and availability:

  • Stock Status: Available from multiple distributors
  • Lead Time: Typically 1-2 weeks for standard quantities
  • Minimum Order: Varies by distributor
  • Volume Pricing: Available for large quantity orders

Contact authorized distributors for current pricing and delivery schedules

Documents & Media

Technical Documentation

  • Datasheet: Complete electrical and mechanical specifications
  • Application Notes: Design guidelines and best practices
  • User Guide: Comprehensive implementation instructions
  • Development Tools: ISE/Vivado compatibility documentation

Design Resources

  • IBIS Models: Signal integrity simulation models
  • Package Models: 3D mechanical drawings and footprints
  • Reference Designs: Example implementations and code
  • Pinout Files: Complete pin assignment documentation

Software Support

  • Xilinx ISE: Legacy development environment support
  • Vivado Design Suite: Modern FPGA design tools
  • IP Cores: Pre-verified intellectual property blocks
  • Simulation Models: Behavioral and timing models

Related Resources

Development Tools

  • Programming Cables: JTAG and configuration interfaces
  • Evaluation Boards: Development and prototyping platforms
  • Debug Tools: ChipScope and logic analyzer integration
  • Configuration Devices: Serial and parallel configuration memories

Compatible Products

  • XCV400E-6FGG676C: Lower speed grade alternative
  • XCV400E-8FGG676C: Higher speed grade option
  • XCV600E-7FGG676C: Higher capacity Virtex-E device
  • Configuration Memories: Compatible PROM and Flash devices

Application Areas

  • Digital Signal Processing: High-speed filtering and transformation
  • Communications: Protocol processing and baseband functions
  • Industrial Control: Real-time control and automation
  • Aerospace & Defense: Mission-critical embedded systems
  • Test & Measurement: High-speed data acquisition and analysis

Design Support

  • Technical Support: AMD Xilinx customer support services
  • Training Resources: Online courses and workshops
  • Community Forums: Developer community and knowledge base
  • Application Engineers: Regional technical assistance

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: Fully compliant with RoHS directive
  • REACH Regulation: Compliant with European chemical regulations
  • Lead-Free: Pb-free package and assembly processes
  • Halogen-Free: Environmentally friendly materials

Export Control Information

  • ECCN: Export Control Classification Number as applicable
  • Country of Origin: Manufacturing location disclosure
  • Export Restrictions: Subject to applicable export regulations
  • Dual-Use: Technology export compliance requirements

Quality Standards

  • ISO 9001: Quality management system certification
  • Automotive: AEC-Q100 qualified versions available
  • Reliability: Comprehensive qualification and testing
  • Traceability: Full supply chain documentation

Packaging & Handling

  • Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
  • ESD Protection: Electrostatic discharge handling requirements
  • Storage: Temperature and humidity storage conditions
  • Shipping: Anti-static packaging and handling procedures

The XCV400E-7FGG676C represents AMD Xilinx’s commitment to delivering high-performance, reliable FPGA solutions for next-generation embedded systems. With its robust feature set, comprehensive development ecosystem, and proven reliability, this device enables engineers to implement complex digital designs with confidence and efficiency.