Product Specifications
The XCV400E-6FG676C0773 is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E family, designed for demanding digital signal processing and logic-intensive applications.
Technical Specifications
Core Performance:
- Part Number: XCV400E-6FG676C0773
- Manufacturer: Xilinx (now AMD)
- Family: Virtex-E Series
- Logic Elements: 10,800 cells
- System Gates: 129,600 gates (569,952 total gates)
- Speed Grade: -6 (357MHz maximum frequency)
- Process Technology: 0.18ฮผm advanced CMOS
- Supply Voltage: 1.8V (1.71V ~ 1.89V)
Memory & I/O:
- Total RAM Bits: 163,840 bits
- Block RAM: 20kB
- I/O Count: 404 user I/O pins
- Configuration Logic Blocks (CLBs): 2,400
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- Package Size: FG676 (1mm ball pitch)
Operating Conditions:
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Mounting Type: Surface Mount Technology (SMT)
- Package Dimensions: 27mm ร 27mm
Architecture Features:
- Advanced 5-layer-metal interconnect architecture
- Eight on-board Delay Locked Loops (DLLs)
- Programmable clock management with frequency multiplication/division
- High-speed routing resources for optimal performance
- Compatible with ISE and early Vivado design tools
Price Information
Current Market Pricing (2025):
- Availability: In stock at authorized distributors
- Quantity Available: Multiple suppliers report stock levels ranging from 83 to 359 pieces
- Pricing: Request quote (RFQ) from authorized distributors
- Lead Time: Typically 2-4 days via express shipping (DHL/FedEx/UPS)
- MOQ: Varies by distributor (typically 1+ pieces)
Authorized Distributors:
- IC-Components Ltd
- Kynix Semiconductor
- Xinvry Electronics
- FPGAkey
- Multiple other electronic component distributors
Payment Options:
- Bank transfer (T/T in advance)
- PayPal
- Credit card
- Various supplier-specific payment methods
Documents & Media
Technical Documentation:
- Datasheet: Virtex-E FPGA datasheet (DS003.pdf)
- User Guide: Virtex-E Configuration Guide
- Application Notes: Power management and thermal considerations
- Package Information: FG676 package mechanical drawings
- Pin Configuration: Complete pinout diagrams and ball map
Software & Tools:
- Design Software: ISE Design Suite (legacy support)
- Programming Tools: JTAG configuration support
- Simulation Models: VHDL/Verilog behavioral models available
- ECAD Models: Footprint libraries for major PCB design tools
Development Resources:
- Reference designs and example projects
- Power supply design guidelines
- PCB layout recommendations for BGA packages
- Signal integrity design considerations
Related Resources
Family Alternatives:
- XCV400E-8FG676C: Higher speed grade (-8) variant
- XCV400E-7FG676I: Industrial temperature range version
- XCV400E-6BG560C: Smaller BGA package option
- XCV400E-6PQ240C: PQFP package alternative
Development Tools:
- Software: Xilinx ISE Design Suite (for legacy support)
- Programming: JTAG configuration cables
- Evaluation Boards: Third-party development boards available
- Design Kits: Reference schematics and layout files
Application Areas:
- Digital signal processing (DSP) applications
- High-speed data processing systems
- Communications infrastructure
- Industrial automation and control
- Test and measurement equipment
- Legacy system upgrades and maintenance
Technical Support:
- Community forums and knowledge base
- Application engineering support through distributors
- Replacement and cross-reference services
- Custom design consultation available
Environmental & Export Classifications
Environmental Compliance:
- RoHS Status: Not Compliant (legacy device with lead content)
- Lead Content: Contains lead in package materials (pre-RoHS device)
- JESD-609 Code: Standard marking for lead-containing components
- Environmental Rating: Commercial grade (standard environmental conditions)
Export Classifications:
- Country of Origin: Manufactured in various facilities globally
- Export Control: Subject to standard semiconductor export regulations
- ECCN Classification: Check current export control lists for specific classification
- Shipping: Standard electronic component shipping regulations apply
Quality & Reliability:
- Quality Grade: Commercial grade components
- Reliability Testing: Meets Xilinx standard reliability specifications
- Lifecycle Status: Legacy/Mature product (not recommended for new designs)
- Support Timeline: Extended support available for existing designs
Packaging & Handling:
- ESD Protection: Anti-static packaging required
- Storage Conditions: Controlled temperature and humidity
- Handling Precautions: BGA packages require careful handling
- Moisture Sensitivity: Level 3 moisture sensitivity rating
Certifications:
- ISO 9001 manufacturing quality standards
- Industry standard semiconductor reliability testing
- Compliance with applicable safety and environmental regulations
The XCV400E-6FG676C0773 represents proven FPGA technology from Xilinx’s Virtex-E family, offering reliable performance for legacy applications and long-term design support. While not recommended for new designs due to its mature status, it remains an excellent choice for replacement, upgrade, and maintenance applications requiring its specific capabilities and proven reliability.
