The XCV400-6FG676C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s acclaimed Virtex series, designed for demanding applications requiring flexible, reprogrammable logic solutions. This commercial-grade device delivers exceptional performance in a 676-pin Fine-pitch Ball Grid Array (FCBGA) package, making it ideal for telecommunications, industrial automation, and embedded systems.
1. Product Specifications
Core Architecture
- FPGA Family: Xilinx Virtex 2.5V
- Part Number: XCV400-6FG676C
- Logic Capacity: 10,800 cells (468,252 gates)
- Process Technology: 0.22ฮผm 5-layer metal CMOS
- Supply Voltage: 2.5V core
- Speed Grade: -6 (commercial grade)
Package Details
- Package Type: 676-pin Fine-pitch Ball Grid Array (FCBGA)
- I/O Count: 404 user I/O pins
- Operating Temperature: Commercial (0ยฐC to +85ยฐC)
- Package Size: Industry-standard BGA676 footprint
Memory & Logic Resources
- Total RAM Bits: Embedded memory blocks
- Configurable Logic Blocks (CLBs): Optimized for place-and-route efficiency
- Built-in Features: Clock management, arithmetic logic units
- Configuration: SRAM-based, unlimited reprogramming capability
Performance Characteristics
- Maximum Operating Frequency: Up to 200 MHz system performance
- PCI Compliance: 66-MHz PCI compliant
- Signal Integrity: Advanced 5-layer metal interconnect
- Timing: Commercial temperature range timing specifications
2. Pricing Information
Current Market Pricing (Subject to fluctuation):
- Small Quantities (1-99 units): Contact for quote
- Volume Pricing: Available for quantities 100+ units
- Lead Time: Standard 2-4 weeks for in-stock items
- Stock Availability: Multiple distributors maintain inventory
Note: Prices vary by distributor and quantity. Contact authorized distributors for current pricing and volume discounts.
3. Documents & Media
Technical Documentation
- Primary Datasheet: Virtex 2.5V FPGA Family Data Sheet (76 pages)
- User Guide: Virtex FPGA Architecture and Design Guide
- Application Notes: Configuration, timing, and design optimization
- Package Information: Pin assignment and mechanical drawings
Development Resources
- Design Tools: Compatible with Xilinx Foundationโข and Alliance Development Systems
- Programming Options: Four different configuration modes supported
- Reference Designs: Available through Xilinx design center
- Libraries: Comprehensive IP core library support
Supporting Files
- IBIS Models: Signal integrity simulation
- BSDL Files: Boundary scan testing
- Footprint Libraries: PCB layout files for major CAD tools
- Timing Models: Speed files for static timing analysis
4. Related Resources
Development Tools & Software
- Xilinx ISE Design Suite: Complete design environment
- Foundation Tools: Entry-level design software
- ChipScope Pro: Integrated logic analyzer
- Programming Cables: JTAG and parallel programming support
Compatible Products
- Configuration Memory: Serial PROMs and Flash memory
- Power Management: DC-DC converters for multi-rail power
- Clock Sources: Oscillators and clock generation ICs
- Level Translation: I/O voltage interface solutions
Technical Support
- Xilinx Support Portal: Online documentation and forums
- Application Engineers: Design consultation services
- Training Programs: FPGA design methodology courses
- Community Forums: Peer-to-peer technical discussions
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not RoHS compliant (legacy product)
- REACH Compliance: Substance declaration available
- Temperature Rating: Commercial grade (0ยฐC to +85ยฐC junction temperature)
- Moisture Sensitivity: Level 3 per JEDEC J-STD-020
Export Control Information
- ECCN Classification: 3A001.a.12 (subject to EAR)
- HTS Code: 8542.31.0001
- Country of Origin: Varies by manufacturing site
- Export Restrictions: May require export license for certain destinations
Quality & Reliability
- Quality Standard: 100% factory tested
- Built-in Test: Die temperature sensor diode included
- Reliability Testing: Automotive-grade qualification available
- Lifecycle Status: Mature product with long-term support
Environmental Testing
- Operating Humidity: 5% to 95% non-condensing
- Storage Temperature: -65ยฐC to +150ยฐC
- Thermal Resistance: Package-dependent specifications
- ESD Protection: Human Body Model and Machine Model compliant
Key Benefits of XCV400-6FG676C:
- โ High logic density in compact package
- โ Unlimited reprogramming capability
- โ Commercial temperature range operation
- โ Extensive I/O options and standards support
- โ Proven reliability in industrial applications
- โ Comprehensive development tool ecosystem
The XCV400-6FG676C continues to be a reliable choice for applications requiring proven FPGA technology with strong vendor support and extensive design resources.
