1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-7PQG240I
- Family: Virtex-E 1.8V FPGAs
- System Gates: 82,944K gates
- Logic Cells: 6,912 cells
- Speed Grade: -7 (400MHz maximum frequency)
- Technology Node: 0.18ฮผm 6-layer metal CMOS process
Package & Pinout
- Package Type: 240-Pin HSPQFP EP (Heat Sink Plastic Quad Flat Pack with Exposed Pad)
- Pin Count: 240 pins
- Package Dimensions: Standard HSPQFP footprint
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
Electrical Specifications
- Core Voltage (VCCINT): 1.8V ยฑ5%
- I/O Voltage (VCCIO): Configurable (1.8V to 3.3V)
- Power Consumption: Optimized for low power operation
- Operating Frequency: Up to 400MHz
Memory & I/O Features
- Configurable Logic Blocks (CLBs): Advanced architecture with enhanced routing
- Block RAM: Embedded memory blocks for data storage
- I/O Standards: Multiple supported including LVTTL, LVCMOS, GTL, SSTL
- SelectI/O Technology: Flexible I/O interface support
- IEEE 1149.1 JTAG: Boundary scan support
2. Price Information
Important Note: The XCV300E-7PQG240I is classified as NOT RECOMMENDED FOR NEW DESIGN and is considered a legacy product.
Pricing Structure
- Market Status: Legacy/Obsolete – Limited availability
- Price Range: Varies significantly based on supplier and remaining inventory
- Minimum Order: Typically available in single units from distributors
- Lead Time: Extended lead times due to end-of-life status
Recommended Sources
- Authorized Xilinx/AMD distributors
- Electronic component brokers with verified stock
- Surplus inventory suppliers
- Contact suppliers directly for current availability and pricing
3. Documents & Media
Technical Documentation
- Official Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E FPGA User Guide
- Configuration Guide: Virtex-E Configuration Guide
- Package Information: 240-pin HSPQFP package specifications
Design Resources
- Development Tools:
- ISE Design Suite (Legacy)
- Foundation software (Legacy)
- Vivado Design Suite (Limited support)
- Reference Designs: Available through Xilinx legacy support
- Application Notes: XAPP series documentation for Virtex-E
- Pinout Files: Available in IBIS, BSDL formats
Download Links
- Datasheet PDF available from authorized distributors
- Technical documentation through AMD/Xilinx support portal
- Legacy design files and examples
4. Related Resources
Development Tools
- Primary Tool: ISE Design Suite (Recommended for Virtex-E)
- Synthesis Tools: XST (Xilinx Synthesis Technology)
- Place & Route: Xilinx PAR tools
- Timing Analysis: TRCE static timing analyzer
- Programming Tools: iMPACT for device programming
Hardware Resources
- Evaluation Boards: Limited availability (legacy products)
- Development Kits: Xilinx Virtex-E evaluation platforms (discontinued)
- Programming Cables: Xilinx Platform Cable (USB/Parallel)
- Socket Solutions: Available from third-party suppliers
Software Compatibility
- Operating Systems: Windows 7/10, Linux (legacy versions)
- File Formats: EDIF, VHDL, Verilog support
- Simulation: ModelSim, ISim integration
- Third-Party Tools: Synopsys, Mentor Graphics compatibility
Alternative Products
Recommended Modern Equivalents:
- Artix-7 Series: XC7A35T, XC7A50T (Pin-compatible alternatives)
- Spartan-7 Series: XC7S50, XC7S75 (Cost-effective options)
- Zynq-7000: For applications requiring ARM processing
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS 2002/95/EC compliant (Pb-free available)
- REACH Regulation: EU REACH compliant
- Halogen Status: Halogen-free versions available
- Environmental Standard: IPC/JEDEC J-STD-020 moisture sensitivity
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Thermal Resistance: ฮธJA specified in package datasheet
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US Export Administration Regulations
Reliability Standards
- Quality Grade: Industrial standard
- MTBF: Specified in reliability reports
- Qualification Standards: AEC-Q100 (automotive applications)
- ESD Protection: Human Body Model (HBM) tested
Packaging Standards
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Anti-Static Packaging: ESD protective packaging
- Traceability: Full lot traceability for quality control
- Lead-Free: Available in lead-free (Pb-free) versions
Note: The XCV300E-7PQG240I is a legacy product not recommended for new designs. For new projects, consider modern FPGA alternatives from AMD/Xilinx’s current product portfolio. Always verify current specifications and availability with authorized distributors.
