1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-7FG456I
- Family: Virtex-E 1.8V FPGAs
- Speed Grade: -7 (High-performance grade)
- Technology Node: 0.18μm 6-layer metal CMOS process
- Series: Virtex®-E
Logic Resources
- System Gates: 411,955 gates
- Logic Elements/Cells: 6,912 cells
- LABs/CLBs: 1,536 Configurable Logic Blocks
- Total RAM Bits: 131,072 bits embedded memory
- Number of I/O: 312 user I/O pins
Package & Physical Specifications
- Package Type: 456-FBGA (Fine-pitch Ball Grid Array)
- Package Dimensions: 23mm × 23mm
- Pin Count: 456 pins
- Mounting Type: Surface Mount
- Package Classification: 456-BBGA
Electrical Specifications
- Core Voltage (VCCINT): 1.71V ~ 1.89V (Typical 1.8V)
- I/O Voltage (VCCIO): Configurable based on I/O standards
- Operating Temperature Range: -40°C to +100°C (TJ – Junction Temperature)
- Power Consumption: Optimized low-power 1.8V operation
Performance Characteristics
- Maximum Frequency: High-speed operation (speed grade -7)
- I/O Standards: Multiple supported including LVTTL, LVCMOS, GTL, SSTL
- Configuration: SRAM-based reconfigurable architecture
- SelectI/O+ Technology: Advanced I/O interface capabilities
2. Price Information
Legacy Product Notice: The XCV300E-7FG456I is classified as OBSOLETE and NOT RECOMMENDED FOR NEW DESIGN.
Market Status & Pricing
- Product Status: End-of-Life/Legacy component
- Availability: Limited stock from distributors and brokers
- Price Variability: Significant price fluctuations due to scarcity
- Lead Time: Extended lead times (4-12+ weeks)
- Minimum Order: Typically 1+ pieces available
Pricing Factors
- Stock Availability: Some distributors report stock of 2849+ pieces
- Market Demand: High demand for legacy replacements
- Supplier Type: Authorized vs. independent distributors
- Condition: New original vs. refurbished options
Recommended Sourcing
- Primary Sources: Authorized Xilinx/AMD distributors
- Secondary Sources: Verified electronic component brokers
- Quality Assurance: Original AMD Xilinx parts with guaranteed quality and test reports
- Warranty: Typically 1-year warranty coverage
3. Documents & Media
Technical Documentation
- Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
- Configuration Manual: Virtex-E Configuration User Guide
- Package Documentation: 456-FBGA package specifications and thermal data
Design Files & Resources
- Pinout Information: 456-BBGA package pinout showing pin layout and functions
- IBIS Models: Signal integrity simulation models
- BSDL Files: Boundary scan description language files
- Footprint Files: PCB layout footprints for major CAD tools
Software Documentation
- Tool Compatibility: ISE Design Suite (primary), limited Vivado support
- Programming Guides: Device programming and configuration guides
- Application Notes: Virtex-E specific design implementation notes
- Reference Designs: Legacy example designs and tutorials
Media Resources
- Product Images: Package photos and dimensional drawings
- Block Diagrams: Internal architecture diagrams
- Performance Charts: Speed and power consumption characteristics
- Thermal Analysis: Package thermal resistance data
4. Related Resources
Development Tools & Software
- Primary Tool Suite: ISE Design Suite (Recommended for Virtex-E)
- ISE Foundation or ISE WebPack
- XST synthesis tool
- Place and Route (PAR) tools
- Timing analyzer (TRCE)
- Programming Tools: iMPACT configuration software
- Simulation: ModelSim, ISim integration support
Hardware Development Resources
- Evaluation Boards: Limited availability (discontinued)
- Programming Hardware:
- Xilinx Platform Cable USB/Parallel
- JTAG programming interfaces
- In-system programming solutions
- Socket Solutions: Available from specialized suppliers for prototyping
Compatible Components
- Configuration Memory:
- Serial PROMs for configuration storage
- Platform Flash configuration devices
- Power Management: 1.8V core regulators and 3.3V I/O supplies
- Clock Sources: Oscillators and clock management devices
Modern Alternatives & Migration Path
Recommended Replacements for New Designs:
- Artix-7 Series: XC7A35T, XC7A50T (Similar logic capacity)
- Spartan-7 Series: XC7S50, XC7S75 (Cost-effective alternatives)
- Zynq-7000: For applications requiring embedded processing
- Migration Tools: Xilinx provides migration guides from Virtex-E to current families
Technical Support Resources
- Legacy Support: Technical support available for pinout information, application notes, and replacement guidance
- Community Forums: Xilinx community and legacy FPGA forums
- Third-party Resources: Independent FPGA design consultants
- Training Materials: ISE design flow training and documentation
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS 2002/95/EC compliant versions available
- Lead-Free Status: Lead-free (Pb-free) options available
- REACH Regulation: EU REACH regulation compliant
- Halogen-Free: Halogen-free versions for environmental requirements
Operating Environmental Conditions
- Operating Temperature: -40°C to +100°C (TJ – Junction Temperature)
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Thermal Characteristics: Package thermal resistance specified in datasheet
Reliability & Quality Standards
- Quality Grade: Industrial standard qualification
- Reliability Testing: JEDEC standard reliability testing
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Qualification Standards: Automotive and industrial application qualified
Export Control & Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Packaging & Handling Standards
- Moisture Sensitivity Level: MSL 3 (168 hours at 30°C/60% RH)
- ESD Protection: Anti-static packaging with ESD protection during shipping
- Package Marking: Standard device marking with part number and date codes
- Traceability: Full manufacturing lot traceability for quality control
Environmental Certifications
- ISO 14001: Environmental management system compliance
- Conflict Minerals: Conflict-free minerals compliance where applicable
- WEEE Directive: Waste electrical and electronic equipment directive compliance
- Green Initiative: Part of Xilinx’s environmental sustainability program
Shipping & Storage
- Anti-Static Requirements: ESD protective packaging with Faraday cage performance
- Temperature Control: Controlled temperature during shipping and storage
- Humidity Control: Moisture barrier bags for sensitive components
- Physical Protection: Impact-resistant packaging for BGA devices
Important Legacy Notice: The XCV300E-7FG456I is an obsolete product not recommended for new designs. Current availability is limited to existing inventory from distributors and brokers. For new projects, consider migrating to modern FPGA families from AMD/Xilinx’s current portfolio such as Artix-7, Spartan-7, or Zynq-7000 series devices. Always verify current specifications, availability, and pricing with authorized distributors before placing orders.
