1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-7FG456C
- Family: Virtex-E 1.8V FPGAs
- Temperature Grade: Commercial (C-TEMP)
- Speed Grade: -7 (High-performance grade)
- Technology Node: 0.18ฮผm 6-layer metal CMOS process
- Series: Virtexยฎ-E
Logic Resources & Performance
- System Gates: 411,955 gates
- Logic Gates: 82,944K gates
- Logic Elements/Cells: 6,912 cells
- LABs/CLBs: 1,536 Configurable Logic Blocks
- Total RAM Bits: 131,072 bits embedded block RAM
- Number of I/O: 312 user I/O pins
- Maximum Frequency: 400MHz internal performance
Package & Physical Specifications
- Package Type: 456-FBGA (Fine-pitch Ball Grid Array)
- Package Dimensions: 23mm ร 23mm
- Pin Count: 456 pins
- Package Classification: 456-BBGA
- Mounting Type: Surface Mount
- Standard Package Quantity: 60 units per tray
Electrical Specifications
- Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
- I/O Voltage (VCCIO): Configurable based on I/O standards
- Operating Temperature Range: 0ยฐC ~ 85ยฐC (TJ – Junction Temperature)
- Power Consumption: Optimized low-power 1.8V operation
- Voltage Supply Range: 1.71V ~ 1.89V
Key Technical Features
- Configuration: SRAM-based reconfigurable architecture
- I/O Standards: Multiple supported including LVTTL, LVCMOS, GTL, SSTL
- SelectI/O+ Technology: Advanced flexible I/O interface capabilities
- Memory: Embedded block RAM and distributed RAM
- Routing: Hierarchical routing resources for complex designs
2. Price Information
Market Status
- Product Status: Legacy/End-of-Life component
- Availability: Good stock levels available from multiple distributors
- Current Inventory: Various distributors report substantial stock
- 2,656 pieces available (Xilinx-ADM)
- 6,544 pieces available (Heisener)
- 159 pieces available (Silitech)
Pricing Structure
- Price Stability: Moderate fluctuation due to legacy status
- Volume Pricing: Available for bulk orders
- Lead Time: 1-4 weeks typical delivery
- Minimum Order: 1+ pieces available
- Reference Pricing: $100-120+ USD (subject to quantity and supplier)
Cost Advantage
- Commercial Grade Benefits: Lower cost compared to Industrial grade (XCV300E-7FG456I)
- Temperature Trade-off: Reduced temperature range for cost savings
- Suitable Applications: Office, consumer, and controlled environment applications
Sourcing Recommendations
- Primary Sources: Authorized AMD/Xilinx distributors
- Secondary Sources: Verified electronic component brokers
- Quality Assurance: Original parts with manufacturer traceability
- Warranty: Typically 1-year warranty from distributors
3. Documents & Media
Technical Documentation
- Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
- Configuration Manual: Virtex-E Configuration User Guide
- Package Documentation: 456-FBGA package specifications and thermal characteristics
Design Resources
- Pinout Information: Detailed 456-BBGA package pinout diagrams
- IBIS Models: Signal integrity simulation models for board design
- BSDL Files: Boundary scan description language files for testing
- Package Models: Thermal and electrical package models
- Footprint Libraries: PCB layout footprints for major CAD tools
Development Documentation
- Programming Guides: Device configuration and programming documentation
- Application Notes: Virtex-E specific implementation guidelines
- Reference Designs: Example designs and code templates
- Migration Guides: Upgrade paths to current FPGA families
Media & Support Files
- Product Images: High-resolution package photos and technical drawings
- Block Diagrams: Internal architecture and signal flow diagrams
- Performance Charts: Speed grades and power consumption data
- Thermal Analysis: Junction temperature and thermal resistance specifications
4. Related Resources
Development Tools & Software
- Primary Development Suite: ISE Design Suite (Recommended)
- ISE Foundation or ISE WebPack
- XST (Xilinx Synthesis Technology)
- Place and Route (PAR) tools
- TRCE timing analyzer
- Configuration Tools: iMPACT programming software
- Simulation Support: ModelSim, ISim integration
Hardware Development Resources
- Programming Hardware:
- Xilinx Platform Cable USB/Parallel
- JTAG programming interfaces
- Boundary scan test equipment
- Evaluation Platforms: Limited availability (legacy products)
- Socket Solutions: BGA socket adapters for prototyping
Compatible Components
- Configuration Memory:
- Xilinx Serial PROMs
- Platform Flash configuration devices
- External flash memory solutions
- Power Management:
- 1.8V core voltage regulators
- Multiple VCCIO supply options
- Clock Management: Crystal oscillators and clock distribution
Modern Migration Path
Recommended Alternatives for New Designs:
- Artix-7 Series: XC7A35T, XC7A50T (Similar logic density)
- Spartan-7 Series: XC7S50, XC7S75 (Cost-optimized alternatives)
- Zynq-7000: For embedded processing requirements
- Kintex-7: For higher performance applications
Technical Support
- Legacy Support: Technical assistance for existing designs
- Migration Support: Guidance for transitioning to current families
- Community Resources: FPGA forums and user communities
- Third-party Support: Independent design consultation services
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
- Lead-Free Availability: Limited lead-free versions may be available
- REACH Regulation: EU REACH regulation awareness required
- Environmental Standards: Standard commercial electronic component classification
Temperature & Operating Conditions
- Operating Temperature: 0ยฐC ~ 85ยฐC (TJ – Junction Temperature)
- Commercial Grade Specification: Optimized for controlled environment applications
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Standard atmospheric pressure applications
Reliability & Quality Standards
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Quality Grade: Commercial standard qualification
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Reliability Testing: JEDEC standard commercial qualification
Export Control & Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Packaging & Handling
- Package Standards: Surface mount BGA packaging
- Anti-Static Requirements: ESD protective packaging mandatory
- Moisture Control: Dry pack shipping in moisture barrier bags
- Physical Protection: Impact-resistant packaging for ball grid arrays
- Traceability: Full lot traceability for quality control
Environmental Applications
Suitable Environments:
- Office and commercial buildings
- Consumer electronics applications
- Controlled temperature data centers
- Indoor industrial equipment
- Laboratory and test equipment
Not Recommended For:
- Outdoor installations
- Automotive applications (use Industrial grade)
- Extreme temperature environments
- Military applications
- Harsh industrial environments
Compliance Certifications
- ISO Standards: Manufacturing under ISO 9001 quality systems
- IPC Standards: Package and assembly standards compliance
- JEDEC Standards: Standard electronic component specifications
- UL Recognition: Component recognition where applicable
Disposal & Recycling
- WEEE Directive: Compliance with waste electrical equipment directive
- Conflict Minerals: Responsible sourcing compliance
- Recycling Programs: Participate in electronic waste recycling programs
- Material Content: Silicon, copper, gold, and standard electronic materials
Commercial Grade Notice: The XCV300E-7FG456C is a commercial temperature grade FPGA optimized for cost-sensitive applications in controlled environments. The operating temperature range of 0ยฐC to 85ยฐC makes it ideal for office, consumer, and indoor applications where extreme temperature conditions are not expected. For applications requiring extended temperature ranges (-40ยฐC to +100ยฐC), consider the industrial grade variant XCV300E-7FG456I. This legacy product is not recommended for new designs; migration to current FPGA families is advised for new projects.
