XCV300E-7FG256I – Xilinx Virtex-E Compact Industrial FPGA Product Description

1. Product Specifications

Core Features

• Manufacturer: Xilinx (now AMD)
• Part Number: XCV300E-7FG256I
• Family: Virtex-E 1.8V FPGAs
• Temperature Grade: Industrial (I-TEMP)
• Speed Grade: -7 (High-performance grade)
• Technology Node: 0.18μm 6-layer metal CMOS process
• Series: Virtex®-E

Logic Resources & Performance

• System Gates: 411,955 gates
• Logic Gates: 82,944K gates
• Logic Elements/Cells: 6,912 cells
• LABs/CLBs: 1,536 Configurable Logic Blocks
• Total RAM Bits: 131,072 bits embedded block RAM
• Number of I/O: 176 user I/O pins
• Maximum Frequency: 400MHz internal performance

Package & Physical Specifications

• Package Type: 256-FBGA (Fine-pitch Ball Grid Array)
• Package Dimensions: 17mm × 17mm (Compact footprint)
• Pin Count: 256 pins
• Package Classification: 256-BGA
• Mounting Type: Surface Mount
• Packaging: Tray packaging

Electrical Specifications

• Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
• I/O Voltage (VCCIO): Configurable based on I/O standards
• Operating Temperature Range: -40°C ~ 100°C (TJ – Junction Temperature)
• Power Consumption: Optimized low-power 1.8V operation
• Voltage Supply Range: 1.71V ~ 1.89V

Advanced Features

• Configuration: SRAM-based reconfigurable architecture
• I/O Standards: Multiple supported including LVTTL, LVCMOS, GTL, SSTL
• SelectI/O+ Technology: Advanced flexible I/O interface capabilities
• Memory Architecture: Embedded block RAM and distributed RAM
• Routing Resources: Hierarchical routing for complex designs
• Configuration Modes: Serial, parallel, and SelectMAP configuration

2. Price Information

Market Status & Availability

• Product Status: Obsolete/Legacy component (End-of-Life)
• Current Availability: Limited stock from distributors and brokers
• Stock Status: Various distributors report available inventory
• Lead Time: 2-8 weeks typical delivery

Pricing Structure

• Reference Pricing: $17.65 – $59.16 USD (1+ pieces)
• Price Variability: Significant fluctuation due to legacy status
• Volume Considerations: Bulk pricing available for larger quantities
• Minimum Order: 1+ pieces available from most suppliers

Cost Advantages

• Compact Package Benefits: Lower assembly costs due to smaller footprint
• Industrial Grade Value: Extended temperature range at competitive pricing
• Space Savings: Reduced PCB area requirements
• Legacy Pricing: Potential cost advantages for existing designs

Sourcing Recommendations

• Primary Sources: Authorized AMD/Xilinx distributors
• Secondary Sources: Verified electronic component brokers
• Quality Assurance: Original parts with manufacturer certification
• Warranty: Typically 1-year warranty from authorized distributors

3. Documents & Media

Technical Documentation

• Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
• User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
• Configuration Manual: Virtex-E Configuration User Guide
• Package Documentation: 256-FBGA package specifications and thermal data

Design Resources

• Pinout Information: Detailed 256-BGA package pinout diagrams
• IBIS Models: Signal integrity simulation models for board design
• BSDL Files: Boundary scan description language files for testing
• Package Models: Thermal and electrical package models
• Footprint Libraries: PCB layout footprints for major CAD tools (17×17mm)

Development Documentation

• Programming Guides: Device configuration and programming procedures
• Application Notes: Virtex-E specific implementation guidelines
• Reference Designs: Example designs optimized for compact packages
• Migration Guides: Transition paths to current FPGA families

Media & Support Files

• Product Images: High-resolution package photos and technical drawings
• Block Diagrams: Internal architecture and signal flow diagrams
• Performance Charts: Speed grades and power consumption characteristics
• Thermal Analysis: Junction temperature and thermal resistance data (17×17mm package)

4. Related Resources

Development Tools & Software

• Primary Development Suite: ISE Design Suite (Recommended for Virtex-E)
  • ISE Foundation or ISE WebPack
  • XST (Xilinx Synthesis Technology)
  • Place and Route (PAR) tools optimized for compact packages
  • TRCE timing analyzer
• Configuration Tools: iMPACT programming software
• Simulation Support: ModelSim, ISim integration

Hardware Development Resources

• Programming Hardware:
  • Xilinx Platform Cable USB/Parallel
  • JTAG programming interfaces
  • Boundary scan test equipment
• Evaluation Platforms: Limited availability (legacy products)
• Socket Solutions: 256-BGA socket adapters for prototyping

Compatible Components

• Configuration Memory:
  • Xilinx Serial PROMs
  • Platform Flash configuration devices
  • External SPI flash memory solutions
• Power Management:
  • Compact 1.8V core voltage regulators
  • Multi-voltage I/O supply solutions
• Clock Management: Compact oscillators and clock distribution circuits

Space-Optimized Design Considerations

• PCB Layout: Compact routing strategies for 17×17mm package
• Thermal Management: Heat dissipation in small form factors
• Signal Integrity: High-density routing considerations
• Power Distribution: Efficient power delivery in compact designs

Modern Migration Path

Recommended Alternatives for New Designs:

• Artix-7 Series: XC7A25T, XC7A35T (Similar logic density, smaller packages)
• Spartan-7 Series: XC7S25, XC7S50 (Cost-optimized compact alternatives)
• Zynq-7000: XC7Z010, XC7Z020 (For embedded processing in small packages)
• MAX 10: Intel alternative for compact FPGA applications

Technical Support Resources

• Legacy Support: Technical assistance for pinout and migration
• Community Resources: FPGA forums and compact design communities
• Third-party Support: Independent design consultation for space-constrained applications
• Training Materials: Compact FPGA design best practices

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
• Lead-Free Availability: Limited lead-free versions may be available
• REACH Regulation: EU REACH regulation compliance required
• Environmental Standards: Industrial electronic component classification

Temperature & Operating Conditions

• Operating Temperature: -40°C ~ 100°C (TJ – Junction Temperature)
• Industrial Grade Specification: Extended temperature range for harsh environments
• Storage Temperature: -65°C to +150°C
• Relative Humidity: 5% to 95% non-condensing
• Thermal Characteristics: Enhanced thermal performance in compact package

Reliability & Quality Standards

• Moisture Sensitivity Level: MSL 3 (168 hours at 30°C/60% RH)
• Quality Grade: Industrial standard qualification
• ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
• Reliability Testing: JEDEC standard industrial qualification
• Qualification Standards: Extended temperature cycling and stress testing

Export Control & Classifications

• ECCN (Export Control Classification Number): 3A001.a.7.a
• HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
• Country of Origin: Manufacturing location dependent
• Export Restrictions: Subject to US Export Administration Regulations (EAR)

Packaging & Handling

• Package Standards: Surface mount BGA packaging with compact footprint
• Anti-Static Requirements: ESD protective packaging mandatory
• Moisture Control: Dry pack shipping in moisture barrier bags
• Physical Protection: Impact-resistant packaging for ball grid arrays
• Traceability: Full lot traceability for quality and reliability

Industrial Applications

Ideal Applications:

• Automotive electronics (industrial grade)
• Industrial automation systems
• Outdoor telecommunications equipment
• Military and aerospace applications (industrial temp range)
• Harsh environment data acquisition
• Embedded control systems

Environmental Advantages:

• Extended temperature operation (-40°C to +100°C)
• Compact footprint for space-constrained applications
• Industrial grade reliability and qualification
• Enhanced thermal performance

Compliance Certifications

• ISO Standards: Manufacturing under ISO 9001 quality systems
• IPC Standards: Package and assembly standards compliance
• JEDEC Standards: Industrial grade electronic component specifications
• UL Recognition: Component recognition for industrial applications

Disposal & Environmental Impact

• WEEE Directive: Compliance with waste electrical equipment directive
• Conflict Minerals: Responsible sourcing compliance
• Recycling Programs: Electronic waste recycling participation
• Material Content: Silicon, copper, gold, and standard electronic materials
• Environmental Impact: Compact package reduces material usage

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Compact Industrial FPGA Notice: The XCV300E-7FG256I offers the optimal balance of high-performance FPGA capabilities and compact form factor with industrial temperature qualification. The 17×17mm package provides significant space savings compared to larger variants while maintaining the full logic capacity of the XCV300E family. The 176 I/O pins, while fewer than larger packages, are often sufficient for many embedded applications. This legacy product is ideal for existing designs requiring industrial temperature range operation in space-constrained environments. For new designs, consider migrating to current FPGA families that offer better performance, lower power, and modern development tool support.