1. Product Specifications
Core Features
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV300E-7BG352I
- Logic Capacity: 300,000 system gates
- Speed Grade: -7 (high performance)
- Package Type: BG352 (352-pin Ball Grid Array)
- Temperature Grade: Industrial (I) – -40°C to +100°C
Detailed Technical Specifications
- CLB Array: 24 x 32 Configurable Logic Blocks
- Total CLBs: 768 configurable logic blocks
- Maximum User I/O: 284 pins
- Block SelectRAM: 32 blocks (4K bits each)
- Total On-Chip Memory: 131,072 bits
- Dedicated Multipliers: 16 x 16-bit hardware multipliers
- DLLs (Delay Locked Loops): 8 for precise clock management
- Core Supply Voltage: 1.8V ±5%
- I/O Supply Voltage: 3.3V/2.5V/1.8V compatible
- Ball Pitch: 1.0mm BGA spacing
Performance Characteristics
- Maximum System Frequency: Up to 200+ MHz
- High-Speed I/O Standards: LVDS, SSTL-2, SSTL-3, HSTL, GTL+
- Advanced Routing Resources: Hex lines and long lines for high-performance routing
- Fast Carry Chains: Optimized arithmetic and DSP processing capabilities
- Low-Skew Clock Networks: Global and regional clock distribution
- Pin-to-Pin Delay: As low as 4.1ns for high-speed applications
Package Specifications
- Package Dimensions: 19mm x 19mm
- Total Ball Count: 352 balls
- Ball Arrangement: Regular grid pattern
- Body Thickness: 1.2mm nominal
- Thermal Resistance: θJA = 12°C/W with adequate airflow
2. Price Information
The XCV300E-7BG352I pricing reflects its industrial-grade qualification and specialized BGA packaging:
Pricing Structure
- Small Volume (1-9 units): Premium industrial pricing – contact distributors
- Medium Volume (10-49 units): Volume discounts available
- Large Volume (50-99 units): Competitive quantity pricing
- Production Volume (100+ units): Best pricing with long-term agreements
- Development Samples: Limited quantities available for evaluation
Procurement Information
- Standard Lead Time: 12-18 weeks for regular orders
- Express Delivery: Available for urgent requirements (additional cost)
- Lifecycle Status: Active product with stable supply chain
- Long-term Support: Industrial product lifecycle management
- Minimum Order Quantity: Varies by distributor
For current XCV300E-7BG352I pricing and availability, contact authorized Xilinx distributors such as Arrow Electronics, Avnet, Digi-Key, Mouser Electronics, or Future Electronics.
3. Documents & Media
Essential Technical Documentation
- Product Datasheet: Complete electrical specifications and timing parameters
- BG352 Package Documentation: Mechanical drawings, ball-out diagrams, and footprint specifications
- Pin Assignment Guide: Comprehensive I/O banking and pin mapping information
- AC/DC Characteristics: Detailed electrical specifications and operating conditions
- Configuration Guide: Programming modes, bitstream generation, and configuration procedures
Design Implementation Resources
- PCB Design Guidelines: BGA layout best practices and routing recommendations
- Thermal Management Guide: Heat dissipation strategies and thermal simulation models
- Signal Integrity Application Notes: High-speed design considerations and guidelines
- Power Distribution Guidelines: Decoupling strategies and power sequencing requirements
- Assembly and Test Procedures: BGA soldering profiles and inspection techniques
Software Development Resources
- Xilinx ISE Design Suite: Complete FPGA development environment and synthesis tools
- Vivado Design Suite: Advanced implementation and timing analysis capabilities
- Constraint Templates: UCF and XDC files for design implementation
- Simulation Models: VHDL, Verilog, and VITAL timing models
- LogiCORE IP Catalog: Pre-verified intellectual property blocks and reference designs
Educational and Training Materials
- Getting Started Guides: Step-by-step tutorials for new users
- Video Training Series: Online courses and implementation tutorials
- Application Notes Collection: Design techniques and optimization strategies
- Webinar Recordings: Technical presentations and Q&A sessions
- Design Examples: Complete reference designs with source code
4. Related Resources
Development and Prototyping Tools
- Evaluation Boards: Development platforms featuring the XCV300E-7BG352I
- Custom Prototype Boards: Third-party solutions for BGA prototyping
- Programming Hardware: Platform Cable USB and other JTAG programming tools
- Debug and Analysis Tools: ChipScope Pro integrated logic analyzer
- Socket Solutions: BGA test sockets and adapters for development
Complementary Components
- Configuration Memory Devices:
- Serial Flash: AT45DB series, M25P series
- Parallel Flash: StrataFlash, Platform Flash
- Configuration PROMs: XC18V series
- Power Management Solutions:
- Multi-output switching regulators
- Linear regulators for low-noise applications
- Power sequencing controllers
- Voltage monitoring ICs
- Clock Generation and Distribution:
- Low-jitter crystal oscillators
- PLL-based clock generators
- Clock buffer and distribution networks
- Differential clock drivers
Interface and Connectivity
- Level Translation: Voltage level shifters for mixed-voltage systems
- Signal Conditioning: Line drivers, receivers, and isolation circuits
- Communication Interfaces: UART, SPI, I2C controller ICs
- High-Speed Interfaces: SERDES transceivers and protocol controllers
Professional Services and Support
- Xilinx Alliance Program: Certified design service partners
- Training and Certification: Formal FPGA design courses and examinations
- Design Consulting: Expert assistance for complex implementations
- Technical Support: Regional field application engineers and online support
- Third-Party IP Vendors: Specialized IP cores and design services
5. Environmental & Export Classifications
Industrial Environmental Specifications
- Operating Temperature Range: -40°C to +100°C (Industrial grade)
- Storage Temperature Range: -65°C to +150°C
- Relative Humidity: 5% to 85% RH (non-condensing)
- Altitude: Up to 2000 meters above sea level
- Thermal Cycling: 1000+ cycles per JEDEC JESD22-A104
- Temperature Shock: Compliant with MIL-STD-883 Method 1011
- Vibration Tolerance: 20g peak, 10-2000 Hz per MIL-STD-883
Environmental and Chemical Compliance
- RoHS Directive Compliance: Lead-free manufacturing and materials
- REACH Regulation: European chemical safety compliance
- Conflict Minerals Reporting: SEC compliant mineral sourcing
- ISO 14001 Certification: Environmental management system compliance
- WEEE Directive: Waste electrical and electronic equipment compliance
- California Proposition 65: Chemical disclosure compliance
- China RoHS: Administrative measure on pollution control compliance
Quality and Reliability Standards
- Industrial Quality Grade: Fully qualified for harsh environment applications
- MTBF (Mean Time Between Failures): >1,000,000 hours at 55°C
- Package Moisture Sensitivity Level: MSL Level 3 per JEDEC J-STD-020
- ESD Protection Level: Class 1C (>1500V) per JEDEC JS-001
- Latch-up Immunity: >100mA per JEDEC JESD78
- Electromigration: Qualified per JEDEC standards
- Burn-in Testing: Available for high-reliability applications
Export Control and Trade Classifications
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS) Code: 8542.31.0001
- Country of Origin: Varies based on manufacturing facility
- U.S. Export Administration Regulations (EAR): Subject to EAR 15 CFR Parts 730-774
- International Trade Compliance: ITAR non-controlled item
- Dual-Use Technology: Subject to export licensing requirements in some countries
Packaging and Storage Requirements
- Moisture Sensitivity: Requires dry pack storage and handling
- Vacuum-Sealed Packaging: Moisture barrier bags with desiccant
- Shelf Life: 12 months in original sealed packaging
- Floor Life: 168 hours at <30°C/60% RH after bag opening
- Baking Procedures: 125°C for 24 hours if moisture exposure exceeded
- Handling Precautions: ESD-sensitive device requiring proper handling procedures
Target Applications and Markets
The XCV300E-7BG352I excels in demanding industrial applications requiring high reliability:
Industrial Automation
- Process Control Systems: Chemical, pharmaceutical, and food processing
- Factory Automation: Robotics control and machine vision systems
- Motor Control: Advanced AC/DC motor drive systems
- Safety Systems: Functional safety applications up to SIL-3
Aerospace and Defense
- Avionics Systems: Flight management and navigation systems
- Radar Processing: Signal processing and beam forming applications
- Electronic Warfare: Communications intelligence and countermeasures
- Satellite Systems: On-board processing and communication payloads
Transportation Systems
- Railway Applications: Signaling, control, and communication systems
- Automotive Electronics: ADAS, powertrain control, and infotainment
- Marine Systems: Navigation, radar, and communication equipment
- Traffic Management: Intelligent transportation systems
Energy and Utilities
- Smart Grid Infrastructure: Advanced metering and grid automation
- Renewable Energy: Solar inverters and wind turbine controllers
- Power Generation: Turbine control and monitoring systems
- Energy Storage: Battery management and power conversion systems
Performance Advantages
The XCV300E-7BG352I offers compelling advantages for industrial applications:
- Extended Temperature Operation: Reliable performance from -40°C to +100°C
- Compact BG352 Package: Space-efficient 19mm x 19mm form factor
- High I/O Density: 284 user I/O pins for complex interface requirements
- Industrial-Grade Reliability: Extensive qualification testing for harsh environments
- High-Speed Performance: -7 speed grade for demanding timing requirements
- Flexible Architecture: Reconfigurable logic for adaptable system designs
- Proven Technology: Mature Virtex-E architecture with extensive field history
Design Considerations
PCB Design Guidelines
- Layer Stack-up: Minimum 6-layer PCB recommended for signal integrity
- Via Technology: Microvias preferred for high-density routing
- Impedance Control: 50Ω single-ended and 100Ω differential
- Power Planes: Dedicated planes for core and I/O power distribution
- Thermal Management: Thermal vias and heat spreading techniques
Power Supply Design
- Multiple Voltage Rails: 1.8V core, 3.3V/2.5V I/O supplies required
- Current Requirements: Core: 1.5A typical, I/O: 0.5A typical
- Sequencing: Core voltage must be applied before I/O voltages
- Filtering: Low-ESR capacitors for power supply decoupling
- Monitoring: Voltage supervision recommended for system reliability
Conclusion
The XCV300E-7BG352I represents an exceptional industrial-grade FPGA solution that combines high performance, reliability, and compact packaging for demanding applications. Its extended temperature range, robust qualification, and comprehensive development ecosystem make it an ideal choice for engineers developing systems that must operate reliably in challenging industrial environments. With proven field reliability, extensive technical support, and long-term availability, the XCV300E-7BG352I enables successful implementation of complex digital systems across diverse industrial markets.
The combination of 300,000 system gates, 284 I/O pins, and industrial temperature qualification in a compact 19mm x 19mm package makes the XCV300E-7BG352I a versatile solution for space-constrained applications requiring high functionality and reliability.
For the latest XCV300E-7BG352I technical specifications, design resources, and availability information, consult official Xilinx documentation and authorized distribution partners.
