1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-6PQG240C
- Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Cost-optimized performance grade)
- Temperature Grade: Commercial (C-TEMP)
- Technology Node: 0.18ฮผm 6-layer metal CMOS process
- Series: Virtexยฎ-E
Logic Resources & Performance
- System Gates: 411,955 gates
- Logic Gates: 82,944K gates
- Logic Elements/Cells: 6,912 cells
- LABs/CLBs: 1,536 Configurable Logic Blocks
- Total RAM Bits: 131,072 bits embedded block RAM
- Number of I/O: 158 user I/O pins
- Maximum Frequency: 357MHz internal performance (speed grade -6)
Package & Physical Specifications
- Package Type: 240-Pin HSPQFP EP (Heat Sink Plastic Quad Flat Pack with Exposed Pad)
- Package Designation: PQG240 (Plastic Quad with “G” variant specification)
- Pin Count: 240 pins
- Package Classification: 240-BFQFP
- Mounting Type: Surface Mount
- Thermal Enhancement: Exposed pad for improved heat dissipation
Electrical Specifications
- Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
- I/O Voltage (VCCIO): Configurable based on I/O standards
- Operating Temperature Range: 0ยฐC ~ 85ยฐC (Commercial grade)
- Power Consumption: Optimized low-power 1.8V operation
- Voltage Supply Range: 1.71V ~ 1.89V
Speed Grade -6 Characteristics
- Performance Level: Cost-optimized speed grade
- Internal Clock Frequency: 357MHz maximum
- Speed Comparison: 89% of -7 speed grade performance at reduced cost
- Application Suitability: Ideal for moderate-speed applications
- Power Efficiency: Lower power consumption compared to higher speed grades
2. Price Information
Market Status & Availability
- Product Status: Obsolete/Legacy component (End-of-Life)
- Current Availability: Excellent stock levels from multiple distributors
- Stock Status: Strong inventory availability:
- 2,668 pieces available (Xilinx-ADM)
- 2,826 pieces available (IC-Components)
- 528 pieces available (FPGAkey)
Pricing Advantages
- Speed Grade Benefits: Lower cost compared to -7 and -8 speed grades
- Commercial Grade Savings: Reduced cost vs industrial temperature variants
- Legacy Pricing: Potential cost advantages for existing design maintenance
- Volume Availability: Substantial stock enables volume pricing
Cost Optimization Strategy
- Performance vs Cost: 357MHz performance at significant cost savings
- Application Match: Perfect for applications not requiring maximum speed
- Design Economics: Optimal choice for cost-sensitive commercial applications
- Supply Chain: Multiple distributors ensure competitive pricing
Sourcing Recommendations
- Primary Sources: Multiple distributors with confirmed stock
- Secondary Sources: Electronic component brokers with verified inventory
- Quality Assurance: Original AMD Xilinx parts with full traceability
- Warranty: Standard 1-year warranty from authorized distributors
3. Documents & Media
Technical Documentation
- Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
- Configuration Manual: Virtex-E Configuration User Guide
- Package Documentation: 240-Pin HSPQFP EP package specifications
Design Resources
- Pinout Information: Detailed 240-Pin HSPQFP EP pinout diagrams
- IBIS Models: Signal integrity simulation models for board design
- BSDL Files: Boundary scan description language files for testing
- Package Models: Thermal and electrical package models with exposed pad data
- Footprint Libraries: PCB layout footprints for major CAD tools
Speed Grade Specific Documentation
- Timing Specifications: Speed grade -6 specific timing characteristics
- Performance Analysis: 357MHz vs 400MHz (-7) performance comparison
- Power Analysis: Speed grade -6 power consumption data
- Application Guidelines: Optimal applications for speed grade -6 devices
Development Documentation
- Programming Guides: Device configuration and programming procedures
- Application Notes: Virtex-E implementation guidelines for moderate-speed applications
- Reference Designs: Example designs optimized for speed grade -6 performance
- Migration Guides: Transition paths from legacy to current FPGA families
Media & Support Files
- Product Images: High-resolution package photos showing exposed pad
- Block Diagrams: Internal architecture and signal flow diagrams
- Performance Charts: Speed grade comparison and power consumption data
- Thermal Analysis: Heat dissipation characteristics with exposed pad design
4. Related Resources
Development Tools & Software
- Primary Development Suite: ISE Design Suite (Recommended for Virtex-E)
- ISE Foundation or ISE WebPack
- XST (Xilinx Synthesis Technology)
- Place and Route (PAR) tools with speed grade -6 optimization
- TRCE timing analyzer with -6 grade timing models
- Configuration Tools: iMPACT programming software
- Simulation Support: ModelSim, ISim integration with timing models
Hardware Development Resources
- Programming Hardware:
- Xilinx Platform Cable USB/Parallel
- JTAG programming interfaces
- Boundary scan test equipment for 240-pin QFP
- Development Platforms: Limited availability (legacy products)
- Socket Solutions: 240-pin QFP socket adapters for prototyping
Compatible Components
- Configuration Memory:
- Xilinx Serial PROMs
- Platform Flash configuration devices
- External SPI flash memory solutions
- Power Management:
- 1.8V core voltage regulators optimized for moderate performance
- Commercial-grade power supply solutions
- Clock Management: Standard oscillators for 357MHz applications
Speed Grade Optimization
- Design Considerations: Optimizing designs for 357MHz performance
- Power Management: Leveraging lower power consumption of speed grade -6
- Cost Analysis: Performance vs cost trade-off analysis
- Application Matching: Identifying suitable applications for moderate speed
Modern Migration Path
Recommended Alternatives for New Designs:
- Artix-7 Series: XC7A35T, XC7A50T (Higher performance, lower power)
- Spartan-7 Series: XC7S25, XC7S50 (Cost-optimized modern alternatives)
- Zynq-7000: XC7Z010, XC7Z020 (For embedded processing applications)
- MAX 10: Intel alternative for cost-sensitive applications
Technical Support Resources
- Legacy Support: Technical assistance for speed grade -6 applications
- Performance Consulting: Guidance on speed grade selection
- Community Resources: FPGA forums and cost-optimization communities
- Training Materials: Speed grade optimization and cost-effective design practices
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
- Lead-Free Availability: Limited lead-free versions may be available
- REACH Regulation: EU REACH regulation compliance required
- Environmental Standards: Commercial electronic component classification
Temperature & Operating Conditions
- Operating Temperature: 0ยฐC ~ 85ยฐC (Commercial grade specification)
- Commercial Grade Applications: Optimized for controlled environment use
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Thermal Management: Enhanced with exposed pad design
Reliability & Quality Standards
- Quality Grade: Commercial standard qualification
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Reliability Testing: JEDEC standard commercial qualification
- Package Reliability: QFP package with enhanced thermal performance
- Qualification Standards: Commercial temperature cycling and stress testing
Export Control & Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Packaging & Handling
- Package Standards: Surface mount QFP with exposed thermal pad
- Anti-Static Requirements: ESD protective packaging mandatory
- Moisture Control: Dry pack shipping in moisture barrier bags
- Physical Protection: Anti-static handling for QFP packages
- Traceability: Full lot traceability for quality assurance
Commercial Applications
Ideal Applications:
- Consumer electronics (cost-sensitive)
- Office and commercial equipment
- Telecommunications (moderate speed requirements)
- Industrial equipment (controlled environments)
- Educational and development platforms
- Prototyping and evaluation systems
Environmental Advantages:
- Commercial temperature range (0ยฐC to 85ยฐC)
- Cost-effective for controlled environment applications
- Lower power consumption compared to higher speed grades
- Enhanced thermal management with exposed pad
Compliance Certifications
- ISO Standards: Manufacturing under ISO 9001 quality systems
- IPC Standards: Package and assembly standards compliance
- JEDEC Standards: Commercial grade electronic component specifications
- UL Recognition: Component recognition for commercial applications
Disposal & Environmental Impact
- WEEE Directive: Compliance with waste electrical equipment directive
- Conflict Minerals: Responsible sourcing compliance where applicable
- Recycling Programs: Electronic waste recycling participation
- Material Content: Silicon, copper, lead (legacy), and standard materials
- Environmental Impact: Commercial-grade environmental specifications
Cost-Optimized Commercial FPGA Notice: The XCV300E-6PQG240C represents an excellent balance of performance and cost for commercial applications. The speed grade -6 provides 357MHz performance at significant cost savings compared to higher speed grades, making it ideal for applications where moderate performance meets budget constraints. The commercial temperature range (0ยฐC to 85ยฐC) is perfect for office, consumer, and controlled industrial environments. The 158 I/O pins in the 240-pin HSPQFP EP package with exposed pad provide good I/O capability with enhanced thermal performance. This legacy product offers excellent value for existing designs and cost-sensitive applications, though migration to current FPGA families is recommended for new projects requiring modern development tools and long-term support.
