1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-6PQG240C
- Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Cost-optimized performance grade)
- Temperature Grade: Commercial (C-TEMP)
- Technology Node: 0.18μm 6-layer metal CMOS process
- Series: Virtex®-E
Logic Resources & Performance
- System Gates: 411,955 gates
- Logic Gates: 82,944K gates
- Logic Elements/Cells: 6,912 cells
- LABs/CLBs: 1,536 Configurable Logic Blocks
- Total RAM Bits: 131,072 bits embedded block RAM
- Number of I/O: 158 user I/O pins
- Maximum Frequency: 357MHz internal performance (speed grade -6)
Package & Physical Specifications
- Package Type: 240-Pin HSPQFP EP (Heat Sink Plastic Quad Flat Pack with Exposed Pad)
- Package Designation: PQG240 (Plastic Quad with “G” variant specification)
- Pin Count: 240 pins
- Package Classification: 240-BFQFP
- Mounting Type: Surface Mount
- Thermal Enhancement: Exposed pad for improved heat dissipation
Electrical Specifications
- Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
- I/O Voltage (VCCIO): Configurable based on I/O standards
- Operating Temperature Range: 0°C ~ 85°C (Commercial grade)
- Power Consumption: Optimized low-power 1.8V operation
- Voltage Supply Range: 1.71V ~ 1.89V
Speed Grade -6 Characteristics
- Performance Level: Cost-optimized speed grade
- Internal Clock Frequency: 357MHz maximum
- Speed Comparison: 89% of -7 speed grade performance at reduced cost
- Application Suitability: Ideal for moderate-speed applications
- Power Efficiency: Lower power consumption compared to higher speed grades
2. Price Information
Market Status & Availability
- Product Status: Obsolete/Legacy component (End-of-Life)
- Current Availability: Excellent stock levels from multiple distributors
- Stock Status: Strong inventory availability:
- 2,668 pieces available (Xilinx-ADM)
- 2,826 pieces available (IC-Components)
- 528 pieces available (FPGAkey)
Pricing Advantages
- Speed Grade Benefits: Lower cost compared to -7 and -8 speed grades
- Commercial Grade Savings: Reduced cost vs industrial temperature variants
- Legacy Pricing: Potential cost advantages for existing design maintenance
- Volume Availability: Substantial stock enables volume pricing
Cost Optimization Strategy
- Performance vs Cost: 357MHz performance at significant cost savings
- Application Match: Perfect for applications not requiring maximum speed
- Design Economics: Optimal choice for cost-sensitive commercial applications
- Supply Chain: Multiple distributors ensure competitive pricing
Sourcing Recommendations
- Primary Sources: Multiple distributors with confirmed stock
- Secondary Sources: Electronic component brokers with verified inventory
- Quality Assurance: Original AMD Xilinx parts with full traceability
- Warranty: Standard 1-year warranty from authorized distributors
3. Documents & Media
Technical Documentation
- Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
- Configuration Manual: Virtex-E Configuration User Guide
- Package Documentation: 240-Pin HSPQFP EP package specifications
Design Resources
- Pinout Information: Detailed 240-Pin HSPQFP EP pinout diagrams
- IBIS Models: Signal integrity simulation models for board design
- BSDL Files: Boundary scan description language files for testing
- Package Models: Thermal and electrical package models with exposed pad data
- Footprint Libraries: PCB layout footprints for major CAD tools
Speed Grade Specific Documentation
- Timing Specifications: Speed grade -6 specific timing characteristics
- Performance Analysis: 357MHz vs 400MHz (-7) performance comparison
- Power Analysis: Speed grade -6 power consumption data
- Application Guidelines: Optimal applications for speed grade -6 devices
Development Documentation
- Programming Guides: Device configuration and programming procedures
- Application Notes: Virtex-E implementation guidelines for moderate-speed applications
- Reference Designs: Example designs optimized for speed grade -6 performance
- Migration Guides: Transition paths from legacy to current FPGA families
Media & Support Files
- Product Images: High-resolution package photos showing exposed pad
- Block Diagrams: Internal architecture and signal flow diagrams
- Performance Charts: Speed grade comparison and power consumption data
- Thermal Analysis: Heat dissipation characteristics with exposed pad design
4. Related Resources
Development Tools & Software
- Primary Development Suite: ISE Design Suite (Recommended for Virtex-E)
- ISE Foundation or ISE WebPack
- XST (Xilinx Synthesis Technology)
- Place and Route (PAR) tools with speed grade -6 optimization
- TRCE timing analyzer with -6 grade timing models
- Configuration Tools: iMPACT programming software
- Simulation Support: ModelSim, ISim integration with timing models
Hardware Development Resources
- Programming Hardware:
- Xilinx Platform Cable USB/Parallel
- JTAG programming interfaces
- Boundary scan test equipment for 240-pin QFP
- Development Platforms: Limited availability (legacy products)
- Socket Solutions: 240-pin QFP socket adapters for prototyping
Compatible Components
- Configuration Memory:
- Xilinx Serial PROMs
- Platform Flash configuration devices
- External SPI flash memory solutions
- Power Management:
- 1.8V core voltage regulators optimized for moderate performance
- Commercial-grade power supply solutions
- Clock Management: Standard oscillators for 357MHz applications
Speed Grade Optimization
- Design Considerations: Optimizing designs for 357MHz performance
- Power Management: Leveraging lower power consumption of speed grade -6
- Cost Analysis: Performance vs cost trade-off analysis
- Application Matching: Identifying suitable applications for moderate speed
Modern Migration Path
Recommended Alternatives for New Designs:
- Artix-7 Series: XC7A35T, XC7A50T (Higher performance, lower power)
- Spartan-7 Series: XC7S25, XC7S50 (Cost-optimized modern alternatives)
- Zynq-7000: XC7Z010, XC7Z020 (For embedded processing applications)
- MAX 10: Intel alternative for cost-sensitive applications
Technical Support Resources
- Legacy Support: Technical assistance for speed grade -6 applications
- Performance Consulting: Guidance on speed grade selection
- Community Resources: FPGA forums and cost-optimization communities
- Training Materials: Speed grade optimization and cost-effective design practices
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
- Lead-Free Availability: Limited lead-free versions may be available
- REACH Regulation: EU REACH regulation compliance required
- Environmental Standards: Commercial electronic component classification
Temperature & Operating Conditions
- Operating Temperature: 0°C ~ 85°C (Commercial grade specification)
- Commercial Grade Applications: Optimized for controlled environment use
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Thermal Management: Enhanced with exposed pad design
Reliability & Quality Standards
- Quality Grade: Commercial standard qualification
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Reliability Testing: JEDEC standard commercial qualification
- Package Reliability: QFP package with enhanced thermal performance
- Qualification Standards: Commercial temperature cycling and stress testing
Export Control & Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Packaging & Handling
- Package Standards: Surface mount QFP with exposed thermal pad
- Anti-Static Requirements: ESD protective packaging mandatory
- Moisture Control: Dry pack shipping in moisture barrier bags
- Physical Protection: Anti-static handling for QFP packages
- Traceability: Full lot traceability for quality assurance
Commercial Applications
Ideal Applications:
- Consumer electronics (cost-sensitive)
- Office and commercial equipment
- Telecommunications (moderate speed requirements)
- Industrial equipment (controlled environments)
- Educational and development platforms
- Prototyping and evaluation systems
Environmental Advantages:
- Commercial temperature range (0°C to 85°C)
- Cost-effective for controlled environment applications
- Lower power consumption compared to higher speed grades
- Enhanced thermal management with exposed pad
Compliance Certifications
- ISO Standards: Manufacturing under ISO 9001 quality systems
- IPC Standards: Package and assembly standards compliance
- JEDEC Standards: Commercial grade electronic component specifications
- UL Recognition: Component recognition for commercial applications
Disposal & Environmental Impact
- WEEE Directive: Compliance with waste electrical equipment directive
- Conflict Minerals: Responsible sourcing compliance where applicable
- Recycling Programs: Electronic waste recycling participation
- Material Content: Silicon, copper, lead (legacy), and standard materials
- Environmental Impact: Commercial-grade environmental specifications
Cost-Optimized Commercial FPGA Notice: The XCV300E-6PQG240C represents an excellent balance of performance and cost for commercial applications. The speed grade -6 provides 357MHz performance at significant cost savings compared to higher speed grades, making it ideal for applications where moderate performance meets budget constraints. The commercial temperature range (0°C to 85°C) is perfect for office, consumer, and controlled industrial environments. The 158 I/O pins in the 240-pin HSPQFP EP package with exposed pad provide good I/O capability with enhanced thermal performance. This legacy product offers excellent value for existing designs and cost-sensitive applications, though migration to current FPGA families is recommended for new projects requiring modern development tools and long-term support.
