1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-6PQ240I
- Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Cost-optimized performance grade)
- Temperature Grade: Industrial (I-TEMP)
- Technology Node: 0.18μm 6-layer metal CMOS process
- Series: Virtex®-E
Logic Resources & Performance
- System Gates: 411,955 gates
- Logic Gates: 82,944K gates
- Logic Elements/Cells: 6,912 cells
- LABs/CLBs: 1,536 Configurable Logic Blocks
- Total RAM Bits: 131,072 bits embedded block RAM
- Number of I/O: 158 user I/O pins
- Maximum Frequency: 357MHz internal performance (speed grade -6)
Package & Physical Specifications
- Package Type: 240-Pin HSPQFP EP (Heat Sink Plastic Quad Flat Pack with Exposed Pad)
- Package Designation: PQ240 (Standard Plastic Quad package)
- Pin Count: 240 pins
- Package Classification: 240QFP
- Mounting Type: Surface Mount
- Package Size: Standard QFP footprint
Electrical Specifications
- Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
- I/O Voltage (VCCIO): Configurable based on I/O standards
- Operating Temperature Range: -40°C ~ 100°C (Industrial grade)
- Power Consumption: Optimized low-power 1.8V operation
- Voltage Supply Range: 1.71V ~ 1.89V
Industrial Grade Characteristics
- Extended Temperature Range: -40°C to +100°C operation
- Speed Grade -6 Benefits: 357MHz performance at reduced cost
- Harsh Environment Capability: Automotive, outdoor, and industrial applications
- Reliability: Enhanced qualification for demanding environments
- Cost Optimization: Lower cost than higher speed grades with industrial temperature range
2. Price Information
Market Status & Availability
- Product Status: Obsolete/Legacy component (End-of-Life)
- Current Availability: Limited stock from distributors and component brokers
- Lead Time: 2-8 weeks typical delivery depending on supplier
- Stock Status: Periodic availability from various suppliers
Cost-Effective Positioning
- Speed Grade Advantage: Lower cost compared to -7 and -8 speed grades
- Industrial Value: Extended temperature range at competitive pricing
- Performance Balance: 357MHz sufficient for many industrial applications
- Budget Optimization: Ideal for cost-sensitive projects requiring industrial qualification
Pricing Strategy
- Legacy Component Economics: Pricing varies significantly based on remaining inventory
- Industrial Grade Premium: Higher cost than commercial grade due to extended qualification
- Speed Grade Savings: Cost reduction compared to higher performance variants
- Volume Considerations: Limited quantities may affect pricing structure
Sourcing Recommendations
- Primary Sources: Authorized AMD/Xilinx distributors with remaining stock
- Secondary Sources: Electronic component brokers specializing in legacy products
- Quality Verification: Ensure original AMD Xilinx parts with full traceability
- Warranty Coverage: Typically 1-year warranty from authorized distributors
3. Documents & Media
Technical Documentation
- Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
- Configuration Manual: Virtex-E Configuration User Guide
- Package Documentation: 240-Pin HSPQFP EP package specifications
Design Resources
- Pinout Information: Detailed 240-Pin HSPQFP EP pinout diagrams
- IBIS Models: Signal integrity simulation models for board design
- BSDL Files: Boundary scan description language files for testing
- Package Models: Thermal and electrical package models
- Footprint Libraries: PCB layout footprints for major CAD tools
Industrial Application Documentation
- Temperature Specifications: Industrial grade (-40°C to +100°C) performance data
- Reliability Analysis: Extended temperature qualification reports
- Environmental Testing: Industrial grade qualification test results
- Automotive Guidelines: Application notes for automotive environments
Speed Grade Specific Resources
- Timing Specifications: Speed grade -6 specific timing characteristics
- Performance Optimization: Guidelines for 357MHz design implementation
- Power Analysis: Speed grade -6 power consumption in industrial conditions
- Cost-Performance Analysis: Trade-off analysis for speed grade selection
Media & Support Files
- Product Images: High-resolution package photos and dimensional drawings
- Block Diagrams: Internal architecture and signal flow diagrams
- Performance Charts: Speed grade comparison and industrial temperature operation
- Application Examples: Industrial application reference designs
4. Related Resources
Development Tools & Software
- Primary Development Suite: ISE Design Suite (Recommended for Virtex-E)
- ISE Foundation or ISE WebPack
- XST (Xilinx Synthesis Technology)
- Place and Route (PAR) tools with speed grade -6 timing models
- TRCE timing analyzer with industrial temperature derating
- Configuration Tools: iMPACT programming software
- Simulation Support: ModelSim, ISim integration with industrial timing models
Hardware Development Resources
- Programming Hardware:
- Xilinx Platform Cable USB/Parallel
- JTAG programming interfaces for industrial environments
- Boundary scan test equipment for 240-pin QFP
- Development Platforms: Limited availability (legacy products)
- Socket Solutions: 240-pin QFP socket adapters for prototyping
Compatible Components
- Configuration Memory:
- Xilinx Serial PROMs (industrial temperature rated)
- Platform Flash configuration devices
- External flash memory solutions for extended temperature
- Power Management:
- Industrial grade 1.8V core voltage regulators
- Extended temperature power supply solutions
- Clock Management: Industrial grade oscillators and clock distribution
Industrial Design Considerations
- Thermal Management: Heat dissipation strategies for extended temperature operation
- Board Design: PCB layout considerations for industrial environments
- Signal Integrity: Design practices for harsh environment operation
- Power Distribution: Robust power delivery for industrial applications
Modern Migration Path
Recommended Alternatives for New Designs:
- Artix-7 Series: XC7A35T, XC7A50T (Higher performance, extended temperature)
- Spartan-7 Series: XC7S25, XC7S50 (Cost-optimized with industrial temperature options)
- Zynq-7000: XC7Z010, XC7Z020 (For embedded processing in industrial applications)
- Automotive Series: Zynq UltraScale+ for automotive applications
Technical Support Resources
- Legacy Support: Technical assistance for industrial applications
- Migration Consulting: Guidance for transitioning to current families
- Industrial Application Support: Specialized support for harsh environment designs
- Community Resources: Industrial FPGA design forums and communities
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
- Lead-Free Availability: Limited lead-free versions may be available
- REACH Regulation: EU REACH regulation compliance required for European markets
- Environmental Standards: Industrial electronic component classification
Temperature & Operating Conditions
- Operating Temperature: -40°C ~ 100°C (Industrial grade specification)
- Extended Temperature Qualification: Full industrial temperature range testing
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Thermal Characteristics: Qualified for extended temperature cycling
Reliability & Quality Standards
- Quality Grade: Industrial standard qualification
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Reliability Testing: Extended JEDEC standard industrial qualification
- Temperature Cycling: Enhanced qualification for -40°C to +100°C operation
- Qualification Standards: Automotive and industrial application testing
Export Control & Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Packaging & Handling
- Package Standards: Surface mount QFP with industrial grade marking
- Anti-Static Requirements: ESD protective packaging mandatory
- Moisture Control: Dry pack shipping in moisture barrier bags
- Physical Protection: Anti-static handling for QFP packages
- Traceability: Full lot traceability for industrial applications
Industrial Applications
Ideal Applications:
- Automotive electronics (extended temperature range)
- Industrial automation and control systems
- Outdoor telecommunications equipment
- Oil and gas industry instrumentation
- Mining and heavy equipment control
- Military and aerospace applications (industrial temp range)
- Railway and transportation systems
Environmental Advantages:
- Extended temperature operation (-40°C to +100°C)
- Industrial grade reliability and qualification
- Cost-effective solution for harsh environments
- Proven technology with extensive field history
Compliance Certifications
- ISO Standards: Manufacturing under ISO 9001 quality systems
- IPC Standards: Package and assembly standards compliance
- JEDEC Standards: Industrial grade electronic component specifications
- Automotive Standards: AEC-Q100 compatible qualification testing
Disposal & Environmental Impact
- WEEE Directive: Compliance with waste electrical equipment directive
- Conflict Minerals: Responsible sourcing compliance where applicable
- Recycling Programs: Electronic waste recycling participation
- Material Content: Silicon, copper, lead (legacy), and standard materials
- Environmental Impact: Industrial-grade environmental specifications
Regional Compliance
- North America: FCC compliance for electronic equipment
- Europe: CE marking requirements for industrial equipment
- Asia Pacific: Local industrial equipment regulations
- Automotive: Meets automotive electronics environmental requirements
Cost-Effective Industrial FPGA Notice: The XCV300E-6PQ240I provides an excellent solution for applications requiring industrial temperature operation (-40°C to +100°C) while maintaining cost-effectiveness through speed grade -6 selection. The 357MHz performance is suitable for many industrial applications where maximum speed is not critical, offering significant cost savings compared to higher speed grades. The 158 I/O pins in the standard 240-pin HSPQFP EP package provide adequate connectivity for moderate complexity industrial designs. This legacy product represents proven technology with extensive field history in harsh environments, making it ideal for existing industrial designs and cost-sensitive applications requiring extended temperature operation. For new designs, migration to current FPGA families with modern development tools and long-term support is recommended.
