1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-6FGG256C
- Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Cost-optimized performance grade)
- Temperature Grade: Commercial (C-TEMP)
- Technology Node: 0.18μm 6-layer metal CMOS process
- Series: Virtex®-E
Logic Resources & Performance
- System Gates: 411,955 gates
- Logic Gates: 82,944K gates
- Logic Elements/Cells: 6,912 cells
- LABs/CLBs: 1,536 Configurable Logic Blocks
- Total RAM Bits: 131,072 bits embedded block RAM
- Number of I/O: 176 user I/O pins
- Maximum Frequency: 357MHz internal performance (speed grade -6)
Package & Physical Specifications
- Package Type: 256-Pin FGG (Fine-pitch Grid Array)
- Package Designation: FGG256 (Fine-pitch Grid Array with 256 pins)
- Package Dimensions: Compact FBGA footprint
- Pin Count: 256 pins
- Mounting Type: Surface Mount
- Ball Pitch: Fine-pitch for high-density applications
Electrical Specifications
- Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
- I/O Voltage (VCCIO): Configurable based on I/O standards
- Operating Temperature Range: 0°C ~ 85°C (Commercial grade)
- Power Consumption: Optimized low-power 1.8V operation
- Voltage Supply Range: 1.71V ~ 1.89V
Compact Package Advantages
- Space Efficiency: High logic density in minimal PCB footprint
- Fine-Pitch Design: Maximum pin utilization in compact form factor
- Cost-Effective Assembly: Standard FBGA assembly processes
- Thermal Performance: Efficient heat dissipation through ball grid array
- Signal Integrity: Short interconnects for improved electrical performance
2. Price Information
Market Status & Availability
- Product Status: Obsolete/Legacy component (End-of-Life)
- Current Availability: Good stock levels from multiple distributors
- Stock Status: Active inventory available:
- Ovaga Technologies: Large stock available
- OMO Electronic: Stock available, can ship immediately
- Various distributors: Multiple sourcing options
Cost-Effective Positioning
- Speed Grade Advantage: Lower cost compared to -7 and -8 speed grades
- Commercial Grade Savings: Reduced cost vs industrial temperature variants
- Compact Package Benefits: Lower assembly costs due to smaller footprint
- Legacy Pricing: Competitive pricing for existing design support
Pricing Strategy
- Performance-Cost Optimization: 357MHz performance at significant cost savings
- Volume Availability: Good stock levels enable competitive volume pricing
- Commercial Grade Economics: Cost-effective for controlled environment applications
- Package Efficiency: Cost benefits from compact, standard FBGA assembly
Sourcing Recommendations
- Primary Sources: Multiple distributors with confirmed stock availability
- Secondary Sources: Electronic component brokers with verified inventory
- Quality Assurance: Original AMD Xilinx parts with full traceability
- Warranty Coverage: Standard 1-year warranty from authorized distributors
3. Documents & Media
Technical Documentation
- Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- 99-Page Datasheet: Comprehensive technical specifications available
- User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
- Configuration Manual: Virtex-E Configuration User Guide
- Package Documentation: 256-Pin FGG FBGA package specifications
Design Resources
- Pinout Information: Detailed 256-Pin FGG FBGA pinout diagrams
- Configuration Details: Pinout configuration on page 28 and 69 of datasheet
- Package Outline: Dimensional data on page 70 of datasheet
- Part Numbering: System details on pages 2-5 of datasheet
- IBIS Models: Signal integrity simulation models for compact package design
Compact Design Documentation
- PCB Layout Guidelines: Design rules for fine-pitch FBGA mounting
- Assembly Instructions: SMT assembly guidelines for 256-pin FBGA
- Thermal Management: Heat dissipation strategies for compact packages
- Signal Integrity: Design practices for high-density routing
- Package Models: Thermal and electrical package models
Speed Grade Specific Resources
- Timing Specifications: Speed grade -6 specific timing characteristics (357MHz)
- Performance Optimization: Guidelines for cost-effective design implementation
- Power Analysis: Speed grade -6 power consumption in commercial conditions
- Application Guidelines: Optimal use cases for moderate-speed applications
Media & Support Files
- Product Images: High-resolution package photos and dimensional drawings
- Block Diagrams: Internal architecture and signal flow diagrams
- Performance Charts: Speed grade comparison and commercial temperature operation
- Application Examples: Commercial application reference designs
4. Related Resources
Development Tools & Software
- Primary Development Suite: ISE Design Suite (Recommended for Virtex-E)
- ISE Foundation or ISE WebPack
- XST (Xilinx Synthesis Technology)
- Place and Route (PAR) tools with speed grade -6 timing optimization
- TRCE timing analyzer with commercial temperature models
- Configuration Tools: iMPACT programming software
- Simulation Support: ModelSim, ISim integration with FGG256 models
Hardware Development Resources
- Programming Hardware:
- Xilinx Platform Cable USB/Parallel
- JTAG programming interfaces for FBGA packages
- Boundary scan test equipment for 256-pin FBGA
- Development Platforms: Limited availability (legacy products)
- Socket Solutions: 256-pin FBGA socket adapters for prototyping
Compatible Components
- Configuration Memory:
- Xilinx Serial PROMs for commercial applications
- Platform Flash configuration devices
- External SPI flash memory solutions
- Power Management:
- Commercial-grade 1.8V core voltage regulators
- Compact power supply solutions for space-constrained designs
- Clock Management: Standard oscillators for 357MHz commercial applications
Compact Design Considerations
- PCB Layout: High-density routing strategies for FGG256 package
- Assembly Process: SMT assembly best practices for fine-pitch FBGA
- Thermal Management: Heat dissipation in space-constrained commercial designs
- Signal Integrity: Managing trace routing in compact form factors
- Cost Optimization: Balancing performance with budget constraints
Modern Migration Path
Recommended Alternatives for New Designs:
- Artix-7 Series: XC7A35T, XC7A50T (Higher performance, compact packages)
- Spartan-7 Series: XC7S25, XC7S50 (Cost-optimized with compact form factors)
- Zynq-7000: XC7Z010, XC7Z020 (For embedded processing in compact designs)
- MAX 10: Intel alternative for cost-sensitive compact applications
Technical Support Resources
- Legacy Support: Technical assistance for compact FPGA applications
- Migration Consulting: Guidance for transitioning to current families
- Community Resources: FPGA forums and compact design communities
- Training Materials: Compact FPGA design optimization and cost-effective practices
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
- Lead-Free Availability: Limited lead-free versions may be available
- REACH Regulation: EU REACH regulation compliance required
- Environmental Standards: Commercial electronic component classification
Temperature & Operating Conditions
- Operating Temperature: 0°C ~ 85°C (Commercial grade specification)
- Commercial Grade Applications: Optimized for controlled environment use
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Thermal Characteristics: Efficient heat dissipation through FBGA design
Reliability & Quality Standards
- Quality Grade: Commercial standard qualification
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Reliability Testing: JEDEC standard commercial qualification
- Package Reliability: FBGA package with proven assembly reliability
- Qualification Standards: Commercial temperature cycling and stress testing
Export Control & Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Packaging & Handling
- Package Standards: Surface mount FBGA with fine-pitch ball grid
- Anti-Static Requirements: ESD protective packaging mandatory
- Moisture Control: Dry pack shipping in moisture barrier bags
- Physical Protection: Anti-static handling for FBGA packages
- Traceability: Full lot traceability for commercial applications
Commercial Applications
Ideal Applications:
- Consumer electronics (space-constrained designs)
- Office and commercial equipment
- Telecommunications (commercial environments)
- Industrial equipment (controlled environments)
- Educational and development platforms
- Compact embedded systems
Environmental Advantages:
- Commercial temperature range (0°C to 85°C)
- Compact form factor for space-constrained applications
- Cost-effective for controlled environment designs
- Efficient thermal management through FBGA package
Compliance Certifications
- ISO Standards: Manufacturing under ISO 9001 quality systems
- IPC Standards: Package and assembly standards compliance
- JEDEC Standards: Commercial grade electronic component specifications
- Assembly Standards: Standard FBGA assembly process compatibility
Disposal & Environmental Impact
- WEEE Directive: Compliance with waste electrical equipment directive
- Conflict Minerals: Responsible sourcing compliance where applicable
- Recycling Programs: Electronic waste recycling participation
- Material Content: Silicon, copper, lead (legacy), and standard materials
- Environmental Impact: Commercial-grade environmental specifications
Regional Compliance
- North America: FCC compliance for commercial electronic equipment
- Europe: CE marking requirements for commercial equipment
- Asia Pacific: Local commercial equipment regulations
- Commercial Standards: Meets commercial electronics environmental requirements
Compact Commercial FPGA Notice: The XCV300E-6FGG256C represents an excellent choice for space-constrained commercial applications requiring moderate performance at cost-effective pricing. The fine-pitch 256-pin FBGA package provides optimal logic density in a compact footprint, making it ideal for applications where board space is at a premium. The speed grade -6 delivers 357MHz performance at significant cost savings compared to higher speed grades, while the 176 I/O pins provide adequate connectivity for many commercial designs. The commercial temperature range (0°C to 85°C) is perfect for office, consumer, and controlled industrial environments. This legacy product offers proven technology with good availability from multiple distributors, making it an excellent choice for existing designs and cost-sensitive applications requiring compact form factors. For new designs, migration to current FPGA families with modern development tools and enhanced performance is recommended.
