1. Product Specifications
Core Features
- Manufacturer: Xilinx (now AMD)
- Part Number: XCV300E-6FG456I
- Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Cost-optimized performance grade)
- Temperature Grade: Industrial (I-TEMP)
- Technology Node: 0.18ฮผm 6-layer metal CMOS process
- Series: Virtexยฎ-E
Logic Resources & Performance
- System Gates: 411,955 gates
- Logic Gates: 82,944K gates
- Logic Elements/Cells: 6,912 cells
- LABs/CLBs: 1,536 Configurable Logic Blocks
- Total RAM Bits: 131,072 bits embedded block RAM
- Number of I/O: 312 user I/O pins (Maximum in XCV300E family)
- Maximum Frequency: 357MHz internal performance (speed grade -6)
Package & Physical Specifications
- Package Type: 456-Pin FBGA (Fine-pitch Ball Grid Array)
- Package Designation: FG456 (Fine-pitch Grid Array with 456 pins)
- Package Classification: 456-BBGA
- Package Dimensions: 23mm ร 23mm
- Pin Count: 456 pins total
- Mounting Type: Surface Mount
- Ball Pitch: Fine-pitch for high I/O density
Electrical Specifications
- Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
- I/O Voltage (VCCIO): Configurable based on I/O standards
- Operating Temperature Range: -40ยฐC ~ 100ยฐC (Industrial grade)
- Power Consumption: Optimized low-power 1.8V operation
- Voltage Supply Range: 1.71V ~ 1.89V
High I/O Industrial Characteristics
- Maximum I/O Count: 312 user I/O pins (highest in XCV300E family)
- Extended Temperature Range: -40ยฐC to +100ยฐC operation
- Speed Grade -6 Benefits: 357MHz performance at reduced cost
- Industrial Reliability: Enhanced qualification for demanding environments
- Cost-Performance Optimization: Maximum I/O at budget-friendly pricing
2. Price Information
Market Status & Availability
- Product Status: Obsolete/Legacy component (End-of-Life)
- Lifecycle Status: Obsolete (confirmed by multiple distributors)
- Current Availability: Available from multiple distributors and brokers
- Stock Status: Active inventory from various suppliers:
- 12 distributors available (Octopart)
- BOSER Technology: Immediate shipping available
- FPGAkey: Real-time market intelligence
- DigiKey: Standard availability
Cost-Effective High I/O Positioning
- Speed Grade Advantage: Lower cost compared to -7 and -8 speed grades
- Industrial Value: Extended temperature range with competitive pricing
- Maximum I/O Benefits: 312 I/O pins at cost-effective price point
- Performance Balance: 357MHz sufficient for most industrial I/O applications
Pricing Strategy
- Legacy Component Economics: Pricing varies based on remaining inventory
- Industrial Grade Premium: Higher cost than commercial grade due to extended qualification
- I/O Density Value: Maximum connectivity for XCV300E family at reasonable cost
- Volume Considerations: Multiple suppliers enable competitive pricing
Sourcing Recommendations
- Primary Sources: Multiple authorized distributors with confirmed stock
- Secondary Sources: Electronic component brokers specializing in legacy industrial components
- Quality Verification: Ensure original AMD Xilinx parts with full traceability
- Warranty Coverage: Typically 1-year warranty from authorized distributors
3. Documents & Media
Technical Documentation
- Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
- Configuration Manual: Virtex-E Configuration User Guide
- Package Documentation: 456-Pin FBGA package specifications and thermal data
Design Resources
- Pinout Information: Detailed 456-Pin FBGA pinout diagrams showing all 312 I/O pins
- IBIS Models: Signal integrity simulation models for high I/O density design
- BSDL Files: Boundary scan description language files for testing
- Package Models: Thermal and electrical package models for 456-pin FBGA
- Footprint Libraries: PCB layout footprints for major CAD tools (23ร23mm package)
High I/O Design Documentation
- I/O Planning: Guidelines for utilizing 312 I/O pins effectively
- Signal Integrity: Design practices for high I/O density applications
- Power Distribution: Power delivery strategies for maximum I/O utilization
- Industrial Guidelines: Application notes for harsh environment I/O design
Speed Grade Specific Resources
- Timing Specifications: Speed grade -6 specific timing characteristics (357MHz)
- Performance Optimization: Guidelines for cost-effective high I/O design implementation
- Power Analysis: Speed grade -6 power consumption with maximum I/O utilization
- Industrial Applications: Use cases for moderate-speed, high I/O industrial systems
Media & Support Files
- Product Images: High-resolution package photos showing 456-pin FBGA
- Block Diagrams: Internal architecture and I/O structure diagrams
- Performance Charts: Speed grade comparison and industrial temperature operation
- Application Examples: High I/O industrial application reference designs
4. Related Resources
Development Tools & Software
- Primary Development Suite: ISE Design Suite (Recommended for Virtex-E)
- ISE Foundation or ISE WebPack
- XST (Xilinx Synthesis Technology)
- Place and Route (PAR) tools with speed grade -6 and high I/O optimization
- TRCE timing analyzer with industrial temperature derating
- Configuration Tools: iMPACT programming software
- Simulation Support: ModelSim, ISim integration with 456-pin FBGA models
Hardware Development Resources
- Programming Hardware:
- Xilinx Platform Cable USB/Parallel
- JTAG programming interfaces for industrial environments
- Boundary scan test equipment for 456-pin FBGA
- Development Platforms: Limited availability (legacy products)
- Socket Solutions: 456-pin FBGA socket adapters for prototyping
Compatible Components
- Configuration Memory:
- Xilinx Serial PROMs (industrial temperature rated)
- Platform Flash configuration devices
- External flash memory solutions for extended temperature
- Power Management:
- Industrial grade 1.8V core voltage regulators
- Multiple VCCIO supply solutions for diverse I/O requirements
- Clock Management: Industrial grade oscillators and clock distribution for high I/O systems
High I/O Design Considerations
- PCB Layout: Design strategies for 312 I/O pins in 456-FBGA package
- Signal Integrity: Managing signal quality with maximum I/O utilization
- Thermal Management: Heat dissipation with high I/O activity
- Power Distribution: Efficient power delivery for 312 I/O pins
- EMI/EMC: Managing electromagnetic interference with high I/O count
Modern Migration Path
Recommended Alternatives for New Designs:
- Artix-7 Series: XC7A100T, XC7A200T (Higher performance, more I/O, industrial temperature)
- Kintex-7 Series: XC7K160T, XC7K325T (High I/O density with superior performance)
- Zynq-7000: XC7Z045, XC7Z100 (For embedded processing with high I/O requirements)
- Automotive Series: Zynq UltraScale+ for automotive high I/O applications
Technical Support Resources
- Legacy Support: Technical assistance for high I/O industrial applications
- Migration Consulting: Guidance for transitioning to current high I/O families
- Industrial Application Support: Specialized support for harsh environment designs
- Community Resources: Industrial FPGA design forums and high I/O communities
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
- Lead-Free Availability: Limited lead-free versions may be available
- REACH Regulation: EU REACH regulation compliance required for European markets
- Environmental Standards: Industrial electronic component classification
Temperature & Operating Conditions
- Operating Temperature: -40ยฐC ~ 100ยฐC (Industrial grade specification)
- Extended Temperature Qualification: Full industrial temperature range testing
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Thermal Characteristics: Qualified for extended temperature cycling with high I/O activity
Reliability & Quality Standards
- Quality Grade: Industrial standard qualification
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Reliability Testing: Extended JEDEC standard industrial qualification
- Temperature Cycling: Enhanced qualification for -40ยฐC to +100ยฐC operation
- High I/O Qualification: Testing for maximum I/O pin utilization in industrial conditions
Export Control & Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.a
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Packaging & Handling
- Package Standards: Surface mount FBGA with industrial grade marking
- Anti-Static Requirements: ESD protective packaging mandatory
- Moisture Control: Dry pack shipping in moisture barrier bags
- Physical Protection: Anti-static handling for 456-pin FBGA packages
- Traceability: Full lot traceability for industrial applications
Industrial Applications
Ideal Applications:
- Industrial Automation: High I/O control systems and interfaces
- Automotive Electronics: Extended temperature automotive control units
- Telecommunications: Outdoor equipment with high connectivity requirements
- Medical Equipment: Industrial-grade medical instrumentation
- Aerospace & Defense: High I/O avionics and control systems
- Oil & Gas: Instrumentation and control in harsh environments
- Railway Systems: High I/O transportation control systems
Environmental Advantages:
- Extended temperature operation (-40ยฐC to +100ยฐC)
- Maximum I/O density (312 pins) for complex interface requirements
- Industrial grade reliability and qualification
- Cost-effective solution for high I/O harsh environments
Compliance Certifications
- ISO Standards: Manufacturing under ISO 9001 quality systems
- IPC Standards: Package and assembly standards compliance
- JEDEC Standards: Industrial grade electronic component specifications
- Automotive Standards: AEC-Q100 compatible qualification testing
Disposal & Environmental Impact
- WEEE Directive: Compliance with waste electrical equipment directive
- Conflict Minerals: Responsible sourcing compliance where applicable
- Recycling Programs: Electronic waste recycling participation
- Material Content: Silicon, copper, lead (legacy), and standard materials
- Environmental Impact: Industrial-grade environmental specifications
Regional Compliance
- North America: FCC compliance for industrial electronic equipment
- Europe: CE marking requirements for industrial equipment
- Asia Pacific: Local industrial equipment regulations
- Automotive: Meets automotive electronics environmental requirements
High I/O Industrial FPGA Notice: The XCV300E-6FG456I provides the ultimate solution for applications requiring maximum I/O connectivity (312 pins) with industrial temperature operation (-40ยฐC to +100ยฐC) while maintaining cost-effectiveness through speed grade -6 selection. This variant offers the highest I/O count in the XCV300E family, making it ideal for complex industrial interface applications, control systems, and data acquisition systems. The 357MHz performance is well-suited for most industrial I/O applications where maximum connectivity is more critical than absolute speed. The proven 456-pin FBGA package provides excellent signal integrity and thermal performance for high I/O density designs. This legacy product represents mature, field-proven technology with extensive history in harsh industrial environments, making it perfect for existing high I/O industrial designs and new cost-sensitive applications requiring maximum connectivity with extended temperature operation. For new designs, migration to current FPGA families with modern development tools, higher performance, and long-term support is recommended.
