Product Specifications
Core Features
- Device Family: Xilinx Virtex-E Series
- Logic Cells: 300,000 system gates
- Speed Grade: -6 (high-performance grade)
- Package Type: FG456 (Fine-pitch Ball Grid Array)
- Temperature Grade: C (Commercial, 0°C to +85°C)
- Supply Voltage: 1.8V core, 3.3V I/O
- I/O Pins: 404 user I/O pins
- Configuration Memory: SRAM-based
- Block RAM: 73,728 bits distributed RAM
- Multipliers: Dedicated 18×18 multiplier blocks
Performance Specifications
- Maximum Operating Frequency: Up to 200 MHz
- Power Consumption: Optimized for low power operation
- Pin Count: 456 pins in BGA package
- Package Dimensions: 23mm x 23mm footprint
Price
The XCV300E-6FG456C pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing information. Volume discounts are typically available for orders of 100+ units. Lead times may vary depending on market conditions and inventory availability.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and timing specifications
- User Guide: Configuration and implementation guidelines
- Application Notes: Design optimization recommendations
- PCB Layout Guidelines: Package-specific routing recommendations
- Power Management Guide: Supply sequencing and decoupling requirements
Development Resources
- Reference Designs: Sample implementations and code examples
- Simulation Models: SPICE and behavioral models
- Constraint Files: Timing and placement constraints
- Evaluation Boards: Development platforms featuring the XCV300E-6FG456C
Related Resources
Compatible Tools
- Xilinx ISE Design Suite: Complete development environment
- ModelSim: HDL simulation and verification
- Synplify: Advanced synthesis tools
- ChipScope: Real-time verification and debugging
Complementary Products
- Configuration Devices: Platform Flash PROMs
- Power Management ICs: Dedicated FPGA power solutions
- Clock Generation: Low-jitter clock synthesizers
- Interface Components: Level translators and I/O expanders
Support Resources
- Technical Support: Access to Xilinx application engineers
- Community Forums: User discussion and troubleshooting
- Training Materials: Online courses and webinars
- Design Services: Third-party implementation partners
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package options available
- REACH Regulation: Full material disclosure compliance
- Operating Temperature: 0°C to +85°C (Commercial grade)
- Storage Temperature: -65°C to +150°C
- Humidity Rating: 85% RH non-condensing
Export Classifications
- ECCN: 3A001.a.7 (Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufactured in various global facilities
- Export License: May require export authorization for certain destinations
Quality Standards
- Automotive Qualified: AEC-Q100 grade options available
- ISO Certification: Manufacturing to ISO 9001 standards
- Reliability Testing: HTOL, HTDR, and ESD qualification
- Package Quality: JEDEC standards compliance
The XCV300E-6FG456C represents a proven solution for applications requiring high logic density, superior performance, and reliable operation in commercial environments. Its comprehensive ecosystem support and extensive documentation make it an excellent choice for both prototyping and production deployment.
