1. Product Specifications
Core Features
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV300E-6FG256I
- Logic Capacity: 300,000 system gates
- Speed Grade: -6 (high-performance grade)
- Package Type: FG256 (Fine-pitch Ball Grid Array)
- Temperature Range: Industrial (-40ยฐC to +85ยฐC)
- Core Voltage: 1.8V
- I/O Voltage: 3.3V compatible
Detailed Technical Specifications
- CLB Matrix: 32 x 48 Configurable Logic Blocks
- Total CLBs: 1,536
- Logic Cells: Approximately 8,064
- Distributed RAM: 126 Kbits
- Block RAM: 32 Kbits (8 blocks of 4K each)
- User I/Os: Up to 176 available
- Embedded Multipliers: 12 dedicated 18×18 multiplier blocks
- DLL (Delay Locked Loops): 4 available
- Maximum Clock Frequency: Up to 180+ MHz
Package Specifications
- Package Type: 256-pin Fine-pitch Ball Grid Array (FBGA)
- Package Dimensions: 17mm x 17mm
- Ball Pitch: 1.0mm
- Pin Count: 256 total pins
- Thermal Characteristics: ฮธJA = 32ยฐC/W (with airflow)
Memory Architecture
- Distributed SelectRAM: 126 Kbits
- Block SelectRAM: 32 Kbits organized in 8 blocks
- Configuration Memory: SRAM-based
- Configuration Time: <100ms typical
2. Price Information
The XCV300E-6FG256I offers competitive pricing within the mid-range FPGA market segment. Current market pricing typically ranges from $150 to $400 per unit for small quantities, depending on supplier and market conditions. Volume pricing is available with significant discounts for quantities of 50+ units.
Pricing Factors
- Small Quantities (1-9 units): $300-400 per unit
- Medium Volumes (10-99 units): $200-300 per unit
- Large Volumes (100+ units): Contact for quotation
- Long-term Agreements: Additional discounts available
Note: Pricing is subject to availability and market fluctuations. The XCV300E-6FG256I may have limited availability as it is part of a mature product line. Always verify current pricing with authorized Xilinx distributors.
3. Documents & Media
Essential Documentation
- Product Datasheet: Complete electrical specifications and AC/DC characteristics
- Packaging Information: Detailed pinout, package dimensions, and land pattern
- User Guide: Comprehensive design implementation guidelines
- Migration Guide: Upgrade path recommendations and compatibility information
- Errata Document: Known limitations and recommended workarounds
Design Resources
- Pinout Files: Xilinx ISE-compatible pinout information
- IBIS Models: Signal integrity simulation models
- Package Models: 3D mechanical models for PCB design
- Timing Models: Setup and hold timing specifications
- Power Estimation Tools: Power consumption calculation utilities
Application Materials
- Reference Designs: Proven design examples and templates
- Application Notes: Best practices for specific use cases
- White Papers: Technical implementation strategies
- Video Tutorials: Step-by-step design guidance
- Webinar Recordings: Expert-led technical sessions
Software Documentation
- ISE Design Suite: Compatible versions and installation guides
- Synthesis Guidelines: Optimization techniques and methodologies
- Implementation Reports: Timing and resource utilization analysis
- Debug Documentation: ChipScope Pro integration guides
4. Related Resources
Development Software
- Xilinx ISE Design Suite: Primary development environment (versions 8.1i through 14.7)
- WebPACK ISE: Free version supporting the XCV300E-6FG256I
- ModelSim: Third-party simulation and verification
- Synopsys Synplify: Advanced synthesis tools
- Mentor Graphics Precision: Alternative synthesis solution
Development Hardware
- Spartan-3E Starter Kit: Compatible evaluation platform
- Custom Development Boards: Third-party solutions available
- Programming Cables: Parallel Cable IV or USB programming solutions
- JTAG Debuggers: Compatible boundary scan and debug tools
Compatible Devices
- XCV200E-6FG256I: Lower-capacity alternative in same package
- XCV400E-6FG256I: Higher-capacity option in same package
- Configuration Devices: XC18V01, XC18V02, XC18V04 PROMs
- Support Chips: Level translators and clock management ICs
IP Cores and Libraries
- Xilinx Core Generator: Pre-verified IP cores
- LogiCORE IP: DSP, memory, and connectivity cores
- Third-party IP: Partner-provided intellectual property
- Open Source Cores: Community-developed solutions
Technical Support Channels
- Xilinx Support Center: Official technical support portal
- Community Forums: User-to-user technical discussions
- Application Engineers: Direct technical consultation
- Training Programs: Online and instructor-led courses
5. Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Directive: Fully compliant with European hazardous substance restrictions
- WEEE Directive: Waste electrical and electronic equipment compliant
- REACH Regulation: Complies with EU chemical safety requirements
- Green Package: Halogen-free and environmentally responsible materials
- ISO 14001: Manufactured in environmentally certified facilities
Operating Conditions
- Operating Temperature Range: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
- Vibration Resistance: MIL-STD-883 compliant
Reliability & Quality Standards
- Quality Management: ISO 9001:2015 certified manufacturing
- Reliability Standard: JEDEC qualified components
- MTBF Rating: >500,000 hours under standard conditions
- Burn-in Testing: Available for critical applications
- Statistical Quality Control: Six Sigma manufacturing processes
Export Control Classifications
- ECCN Number: 3A001.a.7 (Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export License: May be required for certain destinations
- Dual-Use Technology: Subject to international trade regulations
Packaging & Handling
- ESD Sensitivity: Class 1 (Human Body Model >2000V)
- Moisture Sensitivity Level: MSL-3 (168 hours at 30ยฐC/60% RH)
- Package Marking: Laser-etched part number and date code
- Tray Packaging: Anti-static conductive trays
- Lead-free Terminations: Compatible with lead-free assembly processes
Certifications & Approvals
- UL Recognition: File number E154711
- FCC Part 15: Class B digital device compliance
- CE Marking: European conformity assessment
- Military Standards: MIL-PRF-38535 screening available
- Automotive Grade: Not AEC-Q100 qualified (contact for automotive alternatives)
The XCV300E-6FG256I delivers proven performance and reliability for applications requiring moderate logic density in a compact package. While part of a mature FPGA family, it continues to provide excellent value for embedded systems, legacy system upgrades, and applications where its specific characteristics align with project requirements.
For current availability, technical specifications, and pricing information for the XCV300E-6FG256I, please contact authorized Xilinx distributors or visit the official Xilinx product pages.
