1. Product Specifications
Core Device Architecture
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV200E-6PQG240C
- System Gates: 200,000 equivalent logic gates
- Speed Grade: -6 (high-performance grade)
- Package Type: PQG240 (Plastic Quad Flat Package with Ground Leads)
- Temperature Grade: Commercial (0°C to +85°C)
- Core Supply Voltage: 1.8V ±5%
- I/O Supply Voltages: 3.3V, 2.5V, 1.8V selectable banks
Logic Resources and Architecture
- Configurable Logic Blocks: 1,024 CLBs arranged in 32×32 matrix configuration
- Equivalent Logic Cells: Approximately 5,292 logic cells
- Look-Up Tables (LUTs): 2,048 four-input function generators
- Flip-Flops: 2,048 edge-triggered D-type storage elements with enable
- Distributed SelectRAM: 84 Kbits configurable as RAM, ROM, or shift registers
- Block SelectRAM: 28 Kbits organized in 7 dual-port memory blocks
- Tri-state Buffers: 1,024 three-state driver elements for bus implementations
High-Performance Processing Features
- Embedded Multipliers: 8 dedicated 18×18 signed multiplier blocks
- Digital Clock Management: 4 Delay Locked Loops (DLLs) for precise clock conditioning
- Global Clock Networks: 4 low-skew global clock distribution trees
- Maximum Performance: 166+ MHz system clock frequency capability
- Advanced Carry Chains: High-speed arithmetic and counter implementations
- Optimized Routing: Performance-tuned interconnect fabric for reliable timing closure
Package and Physical Specifications
- Package Format: 240-pin Plastic Quad Flat Package with Ground Leads
- Package Dimensions: 32mm × 32mm × 3.4mm
- Lead Pitch: 0.5mm center-to-center spacing
- Total Pin Count: 240 leads with enhanced ground connectivity
- Package Technology: Advanced plastic molding with integrated ground leads for improved performance
- Thermal Resistance: θJA = 35°C/W (with 200 LFM airflow)
- Package Weight: 2.5 grams nominal
Input/Output Architecture
- Maximum User I/Os: Up to 166 single-ended I/O pins
- I/O Banking System: 8 independent voltage and standard banks
- Supported I/O Standards: LVTTL, LVCMOS, PCI, PCIX, GTL, SSTL, HSTL
- Differential Signaling: LVDS, LVPECL, differential SSTL implementations
- Drive Strength Options: 2mA, 4mA, 6mA, 8mA, 12mA, 16mA, 24mA selectable
- Slew Rate Control: Programmable fast and slow edge rates for signal integrity optimization
- On-Chip Termination: Software-controlled input termination for enhanced signal quality
Configuration and Programming
- Configuration Technology: SRAM-based volatile configuration memory
- Configuration Bitstream Size: Approximately 1.1 Mbits
- Programming Interfaces: JTAG boundary scan, SelectMAP parallel, serial modes
- Configuration Time: <200ms typical from external serial configuration device
- Readback Capability: Complete configuration and user register readback support
- Partial Reconfiguration: Limited dynamic reconfiguration capability
- Security Features: Bitstream encryption and device authentication support
Memory System Organization
- Distributed Memory: LUT-based configurable RAM and shift register implementations
- Block Memory: True dual-port RAM with independent read/write ports and clock domains
- Memory Configuration: Variable width (1 to 32 bits) and depth options
- Memory Initialization: Power-up initialization from configuration bitstream data
- Error Detection: Optional parity generation and checking capabilities
- Memory Cascading: Block combination for larger memory structure implementations
Clock Management and Timing
- DLL Features: Phase alignment, frequency multiplication, division, and clock deskewing
- Clock Distribution: Low-skew global and regional clock distribution networks
- Phase Relationships: 0°, 90°, 180°, 270° phase-shifted clock outputs available
- Frequency Synthesis: External PLL integration support for advanced clocking schemes
- Timing Analysis: Advanced timing analysis and optimization capabilities
- Performance Optimization: Optimized for reliable high-frequency operation and timing closure
Enhanced Package Features
- Ground Leads: Dedicated ground leads for improved electrical performance
- Thermal Performance: Enhanced thermal characteristics through ground lead integration
- Signal Integrity: Improved signal integrity through enhanced ground connectivity
- EMI Reduction: Reduced electromagnetic interference through better grounding
- Power Distribution: Enhanced power distribution network for stable operation
- Assembly Reliability: Improved solder joint reliability with ground lead design
2. Price Information
The XCV200E-6PQG240C is positioned in the mainstream high-performance commercial FPGA market, offering excellent value for applications requiring reliable high-speed operation with enhanced package characteristics.
Current Market Pricing Structure
- Single Unit (1 piece): $140-200 per device
- Small Volume (2-24 units): $115-165 per device
- Medium Volume (25-99 units): $95-140 per device
- Large Volume (100-499 units): $80-115 per device
- Production Volume (500+ units): Request competitive quotation
Balanced Performance Pricing Factors
- High-Performance Speed: -6 grade offers excellent performance at competitive pricing
- Enhanced Package: PQG240 package with ground leads provides added value
- Commercial Temperature: Standard pricing tier for 0°C to +85°C operation
- Mature Technology: Established manufacturing processes enable cost-effective production
- Balanced Positioning: Optimal balance between performance and cost-effectiveness
Value Proposition Analysis
- Performance-Cost Balance: Excellent performance per dollar in 200K gate segment
- Enhanced Package Benefits: Ground leads provide improved electrical characteristics
- Design Reliability: Proven technology with established design methodologies
- Ecosystem Maturity: Comprehensive tool support and IP library availability
- Supply Stability: Reliable supply chain with predictable availability
Total Cost of Ownership Benefits
- Reliable Performance: Consistent timing closure reduces development time
- Enhanced Signal Integrity: Ground leads reduce PCB design complexity
- Proven Technology: Established design flows minimize development risks
- Tool Compatibility: Mature ISE tool support reduces learning curve
- IP Availability: Extensive IP library reduces development costs
Market Positioning and Applications
- Telecommunications: Reliable packet processing and protocol implementation
- Digital Signal Processing: Real-time signal processing with consistent performance
- Embedded Computing: Balanced performance for embedded system applications
- Industrial Automation: Reliable control and monitoring system implementations
- Consumer Electronics: Cost-effective high-performance consumer applications
Budget Planning Considerations
- Performance Requirements: Verify -6 speed grade meets application timing needs
- Package Benefits: Consider enhanced electrical characteristics of PQG240 package
- Volume Strategy: Leverage volume pricing for production quantities
- Development Efficiency: Factor in reduced development time with proven technology
- Long-term Availability: Consider mature product lifecycle for production planning
Note: The XCV200E-6PQG240C provides an optimal balance of performance, reliability, and cost-effectiveness. The enhanced PQG240 package with ground leads offers improved electrical characteristics while maintaining competitive pricing.
3. Documents & Media
Essential Technical Documentation
- Complete Product Datasheet: Comprehensive electrical specifications, timing parameters, and operating characteristics
- Package and Pinout Guide: Detailed pin assignments, ground lead configuration, and package dimensions
- Design Implementation Manual: Implementation methodology, timing closure strategies, and optimization techniques
- Electrical Characteristics: DC parameters, AC timing specifications, and power consumption analysis
- Configuration and Programming Guide: Bitstream formats, programming interfaces, and configuration procedures
Enhanced Package Design Resources
- PQG240 Package Guidelines: Specific design considerations for packages with ground leads
- Signal Integrity Benefits: Documentation on electrical performance improvements with ground leads
- Thermal Design Guidelines: Enhanced thermal management strategies for PQG240 package
- PCB Layout Recommendations: Layout techniques optimized for ground lead packages
- Assembly Guidelines: Professional assembly procedures for PQG240 package mounting
Design Implementation Resources
- User Constraint File Templates: UCF examples and timing constraint guidelines
- Package Library Components: CAD symbols and footprints for major design automation tools
- PCB Design Guidelines: Layout recommendations, routing techniques, and thermal considerations
- Signal Integrity Models: IBIS models for accurate signal integrity simulation and analysis
- SPICE Circuit Models: Detailed electrical models for circuit simulation and validation
Performance Optimization Materials
- Timing Closure Guidelines: Strategies for achieving reliable timing closure with -6 speed grade
- Performance Optimization Manual: Resource utilization and speed optimization techniques
- Design Pattern Documentation: Proven architectural approaches for balanced performance
- Power Management Guidelines: Power optimization strategies for efficient operation
- Signal Quality Best Practices: Techniques for maintaining signal integrity in high-speed designs
Software Tool Integration
- ISE Design Suite Integration: Complete tool flow documentation and optimization settings
- Synthesis Optimization: Logic synthesis techniques for balanced performance and area
- Implementation and Routing: Place and route strategies for reliable timing closure
- Simulation and Verification: Behavioral modeling and verification methodologies
- Debug Tool Integration: ChipScope Pro usage for real-time debugging and analysis
Quality and Reliability Documentation
- Device Qualification Reports: Reliability testing data and qualification standards
- Manufacturing Quality: Statistical process control and quality assurance procedures
- Known Issues and Errata: Device limitations, design considerations, and workarounds
- Thermal Analysis Guidelines: Junction temperature management and cooling requirements
- Package Reliability: Enhanced reliability characteristics of ground lead packages
4. Related Resources
Software Development Environment
- Xilinx ISE Design Suite: Complete integrated development environment (versions 8.1i through 14.7)
- ISE WebPACK Free Edition: No-cost development software with full XCV200E-6PQG240C support
- Third-Party Synthesis Tools: Synopsys Synplify Pro, Mentor Graphics Precision RTL synthesis
- Simulation and Verification: ModelSim, Questa, VCS, NC-Verilog, Active-HDL compatibility
- Static Timing Analysis: Synopsys PrimeTime and Cadence Tempus integration support
Hardware Development Infrastructure
- Programming and Configuration: Platform Cable USB, Parallel Cable IV, JTAG programming solutions
- Development Platforms: Third-party evaluation boards and custom development systems
- Socket and Test Solutions: QFP sockets, programming adapters, and production test fixtures
- Debug and Analysis Tools: ChipScope Pro integrated logic analyzer and signal capture
- Production Programming: Automated test equipment and high-volume manufacturing programming
Device Family and Package Alternatives
- Speed Grade Variants: XCV200E-7PQG240C, XCV200E-5PQG240C for different performance requirements
- Package Alternatives: XCV200E-6 available in BG352, FG456, PQ240 packages
- Logic Density Options: XCV100E-6PQG240C, XCV300E-6PQG240C for different capacity needs
- Temperature Variants: XCV200E-6PQG240I industrial grade for extended temperature operation
- Configuration Support: XC18V01, XC18V02, XC18V04 serial configuration PROMs
Intellectual Property and Core Ecosystem
- Xilinx LogiCORE IP: Comprehensive library of pre-verified and optimized IP cores
- CORE Generator System: Parameterizable IP core generation and customization tools
- Communication and Interface: Ethernet, PCI, USB, UART, SPI, I2C protocol implementations
- Digital Signal Processing: FFT, FIR filters, DDS, mathematical functions, and DSP primitives
- Memory and Storage: External memory controllers, FIFO implementations, and cache systems
Technical Support and Professional Services
- Xilinx Support Center: Online technical support portal and comprehensive knowledge base
- Community Forums: Active user community with peer-to-peer technical assistance and discussion
- Field Application Engineering: Regional technical experts for consultation and design reviews
- Professional Design Services: Implementation consulting, optimization services, and design migration
- Training and Certification: Technical education programs and professional development courses
Technology Migration and Evolution
- Next-Generation Alternatives: Spartan-6, Kintex-7, Artix-7, Zynq-7000 upgrade paths
- Design Migration Tools: Automated design porting utilities and compatibility assessment
- Pin Compatibility Analysis: Drop-in replacement evaluation and upgrade strategies
- Performance Benchmarking: Technology comparison tools for informed migration decisions
- Lifecycle Management: End-of-life planning and long-term availability strategies
Industry Applications and Use Cases
- Telecommunications Infrastructure: Packet processing, switching, and protocol implementation
- Digital Signal Processing: Real-time signal analysis, filtering, and processing applications
- Embedded Computing: High-performance embedded systems and edge computing
- Industrial Automation: Process control, monitoring, and factory automation systems
- Consumer Electronics: Advanced multimedia, communication, and entertainment devices
Standards and Protocol Support
- High-Speed Communication: PCIe, Ethernet, USB, SATA protocol implementations
- Industrial Protocols: Profibus, DeviceNet, EtherCAT, SERCOS fieldbus support
- Memory Interfaces: DDR, SDRAM, SRAM external memory controller implementations
- Video and Multimedia: Video processing, compression, and display interface support
- Wireless Applications: Software-defined radio and baseband processing implementations
Design Methodologies and Best Practices
- HDL Coding Guidelines: VHDL and Verilog coding standards and style recommendations
- Verification and Validation: Testbench development, assertion-based verification, coverage analysis
- Physical Design Optimization: Floorplanning, placement optimization, timing-driven implementation
- Power Optimization: Static and dynamic power reduction techniques and methodologies
- Design for Testability: Built-in self-test, boundary scan, and production test strategies
Assembly and Manufacturing Support
- QFP Assembly Guidelines: Professional assembly techniques for quad flat packages
- Ground Lead Considerations: Special handling for packages with ground leads
- Signal Integrity Validation: Pre-production signal integrity testing and validation
- Quality Control: Enhanced inspection and testing procedures for reliable assembly
- Production Optimization: High-volume manufacturing and test strategy development
5. Environmental & Export Classifications
Comprehensive Environmental Compliance
- RoHS Directive 2011/65/EU: Full compliance with European Restriction of Hazardous Substances
- WEEE Directive 2012/19/EU: Waste Electrical and Electronic Equipment recycling compliance
- REACH Regulation EC 1907/2006: Chemical registration, evaluation, and authorization compliance
- California Proposition 65: Safe Drinking Water and Toxic Enforcement Act compliance
- Conflict Minerals: Dodd-Frank Act Section 1502 responsible sourcing compliance
- Green Manufacturing: Halogen-free materials and environmentally conscious production processes
Operating Environmental Specifications
- Operating Temperature Range: 0°C to +85°C (Commercial temperature grade)
- Enhanced Thermal Performance: Improved thermal characteristics through ground lead design
- Storage Temperature Range: -65°C to +150°C non-operating storage conditions
- Relative Humidity: 5% to 95% non-condensing during operation and storage
- Operating Altitude: Sea level to 2000 meters above sea level
- Atmospheric Pressure: 86 kPa to 106 kPa operational pressure range
- Mechanical Stress: JEDEC JESD22-B103 vibration and B104 shock compliance
Enhanced Reliability and Quality Standards
- Quality Management: ISO 9001:2015 certified manufacturing processes and systems
- Reliability Standards: JEDEC JESD47 stress test qualification methodology
- Mean Time Between Failures: >400,000 hours at 55°C junction temperature
- Accelerated Life Testing: Extended testing at 125°C and 85°C/85% humidity conditions
- Electrostatic Discharge: Class 1 (>2000V HBM, >200V MM) ESD protection
- Latch-up Immunity: >100mA current injection on all I/O pins per JEDEC standards
- Package Reliability: Enhanced reliability through ground lead design improvements
Export Control and International Trade
- Export Control Classification: 3A001.a.7 per US Export Administration Regulations (EAR)
- Harmonized Tariff Schedule: 8542.33.0001 classification for semiconductor integrated circuits
- Bureau of Industry and Security: US Department of Commerce export licensing jurisdiction
- Export License Requirements: May be required for restricted destinations and end-users
- International Traffic in Arms: Not subject to ITAR (International Traffic in Arms Regulations)
- Wassenaar Arrangement: Dual-use technology multilateral export control coordination
- EU Dual-Use Regulation: Council Regulation (EC) No 428/2009 export control compliance
Manufacturing and Supply Chain Information
- Primary Manufacturing: Ireland (Fab 24), Malaysia (AATM), Philippines (ATP)
- Assembly and Test: ISO 14001 environmental management certified facilities
- Supply Chain Security: C-TPAT (Customs-Trade Partnership Against Terrorism) certification
- Country of Origin: Manufacturing location dependent – Ireland, Malaysia, or Philippines
- Certificate of Origin: Available for customs clearance and trade agreement benefits
- Quality Traceability: Complete manufacturing and test record maintenance
Advanced Packaging and Material Standards
- Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020D (168 hours at 30°C/60% RH)
- Enhanced Package Design: PQG240 package with ground leads for improved performance
- Lead-Free Assembly: RoHS-compliant lead-free assembly processes and materials
- Package Marking: Laser marking with part number, date code, and traceability information
- Anti-Static Packaging: ESD-safe packaging with appropriate handling procedures
- Ground Lead Benefits: Enhanced electrical and thermal performance characteristics
Safety and Regulatory Certifications
- UL Component Recognition: UL 1998 Standard for Software in Medical Devices compliance
- CSA Certification: Canadian Standards Association electrical safety approval
- TUV Technical Inspection: European safety standard certification and compliance verification
- FCC Part 15: Electromagnetic compatibility for unintentional radiator devices
- CE Marking: European Conformity declaration available for system integrators
- IEC Safety Standards: IEC 60950-1 information technology equipment safety compliance
Sustainability and Corporate Responsibility
- Carbon Footprint Management: Manufacturing optimization for reduced greenhouse gas emissions
- Renewable Energy Usage: Solar and wind power integration in production facilities
- Water Conservation: Advanced water recycling and conservation in semiconductor fabrication
- Waste Reduction: Zero waste to landfill goals and comprehensive recycling programs
- Supplier Code of Conduct: Responsible Business Alliance (RBA) compliance requirements
- Conflict-Free Sourcing: Ethical sourcing of tantalum, tin, tungsten, and gold
End-of-Life and Recycling Management
- Product Recycling Programs: Manufacturer-sponsored device return and material recovery
- Precious Metal Recovery: Advanced processes for gold, silver, and platinum reclamation
- Electronic Waste Processing: WEEE Directive compliant certified e-waste handling
- Secure Data Destruction: Secure disposal protocols for devices containing sensitive information
- Circular Economy: Design for disassembly and material lifecycle extension principles
- Environmental Impact Assessment: Comprehensive lifecycle environmental impact evaluation
International Standards and Certifications
- ISO 14001: Environmental management system certification for manufacturing facilities
- OHSAS 18001: Occupational health and safety management system compliance
- ISO 45001: Transition to new occupational health and safety management standard
- EMAS Registration: EU Eco-Management and Audit Scheme voluntary participation
- Energy Star Partnership: Energy efficiency program participation and compliance
- EPEAT Registration: Electronic Product Environmental Assessment Tool eligibility
Specialized Application Compliance
- Medical Device Standards: ISO 13485 quality management for medical applications
- Automotive Quality: TS 16949 automotive quality management system principles
- Telecommunications: NEBS (Network Equipment Building System) compliance capability
- Industrial Safety: IEC 61508 functional safety for safety-critical applications
- Aerospace Standards: AS9100 aerospace quality management system considerations
- Defense Applications: MIL-STD compliance potential for military and defense use
Package-Specific Environmental Considerations
- Ground Lead Materials: Environmental compliance of ground lead materials and processes
- Enhanced Thermal Performance: Improved thermal dissipation reducing cooling requirements
- Signal Integrity Benefits: Reduced EMI and improved signal quality
- Assembly Considerations: Environmental impact of specialized assembly processes
- Lifecycle Benefits: Extended device life through improved electrical characteristics
- Recycling Considerations: Ground lead package recycling and material recovery
The XCV200E-6PQG240C delivers reliable high-performance operation with enhanced electrical characteristics through its ground lead package design. As part of the mature Virtex-E family, it provides proven technology with improved signal integrity and thermal performance, making it suitable for applications requiring dependable high-speed operation with enhanced package benefits.
For current availability, detailed specifications, and pricing information for the XCV200E-6PQG240C, please contact authorized Xilinx distributors or access official Xilinx product documentation. The enhanced PQG240 package with ground leads provides additional benefits for signal integrity and thermal management in high-performance applications.
