1. Product Specifications
Core Device Architecture
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV200E-6FGG256C
- System Gates: 200,000 equivalent logic gates
- Speed Grade: -6 (high-performance grade)
- Package Type: FGG256 (Fine-pitch Ball Grid Array)
- Temperature Grade: Commercial (0°C to +85°C)
- Core Supply Voltage: 1.8V ±5%
- I/O Supply Voltages: 3.3V, 2.5V, 1.8V selectable banks
Logic Resources and Architecture
- Configurable Logic Blocks: 1,024 CLBs arranged in 32×32 matrix configuration
- Equivalent Logic Cells: Approximately 5,292 logic cells
- Look-Up Tables (LUTs): 2,048 four-input function generators
- Flip-Flops: 2,048 edge-triggered D-type storage elements with enable
- Distributed SelectRAM: 84 Kbits configurable as RAM, ROM, or shift registers
- Block SelectRAM: 28 Kbits organized in 7 dual-port memory blocks
- Tri-state Buffers: 1,024 three-state driver elements for bus implementations
High-Performance Processing Features
- Embedded Multipliers: 8 dedicated 18×18 signed multiplier blocks
- Digital Clock Management: 4 Delay Locked Loops (DLLs) for precise clock conditioning
- Global Clock Networks: 4 low-skew global clock distribution trees
- Maximum Performance: 166+ MHz system clock frequency capability
- Advanced Carry Chains: High-speed arithmetic and counter implementations
- Optimized Interconnect: Performance-tuned routing fabric for compact implementation
Ultra-Compact Package Specifications
- Package Format: 256-pin Fine-pitch Ball Grid Array
- Package Dimensions: 14mm × 14mm × 1.4mm (ultra-compact profile)
- Ball Pitch: 0.65mm center-to-center spacing (fine pitch)
- Total Ball Count: 256 solder ball connections
- Substrate Technology: Advanced organic laminate optimized for miniaturization
- Thermal Resistance: θJA = 42°C/W (with 200 LFM airflow)
- Package Weight: 0.15 grams nominal (ultra-lightweight)
Input/Output Architecture
- Maximum User I/Os: Up to 176 single-ended I/O pins
- I/O Banking System: 8 independent voltage and standard banks
- Supported I/O Standards: LVTTL, LVCMOS, PCI, PCIX, GTL, SSTL, HSTL
- Differential Signaling: LVDS, LVPECL, differential SSTL implementations
- Drive Strength Options: 2mA, 4mA, 6mA, 8mA, 12mA, 16mA, 24mA selectable
- Slew Rate Control: Programmable fast and slow edge rates optimized for compact design
- On-Chip Termination: Software-controlled input termination for signal integrity
Configuration and Programming
- Configuration Technology: SRAM-based volatile configuration memory
- Configuration Bitstream Size: Approximately 1.1 Mbits
- Programming Interfaces: JTAG boundary scan, SelectMAP parallel, serial modes
- Configuration Time: <200ms typical from external serial configuration device
- Readback Capability: Complete configuration and user register readback support
- Partial Reconfiguration: Limited dynamic reconfiguration capability
- Security Features: Bitstream encryption and device authentication support
Memory System Organization
- Distributed Memory: LUT-based configurable RAM and shift register implementations
- Block Memory: True dual-port RAM with independent read/write ports
- Memory Configuration: Variable width (1 to 32 bits) and depth options
- Memory Initialization: Power-up initialization from configuration bitstream
- Error Detection: Optional parity generation and checking capabilities
- Memory Cascading: Block combination for larger memory implementations
Space-Optimized Features
- Miniaturization: Maximum functionality in minimal board space
- Density Optimization: High I/O count per unit area
- Thermal Efficiency: Optimized thermal characteristics for compact designs
- Signal Integrity: Advanced package design for maintaining signal quality
- Assembly Precision: Fine-pitch design for high-density board layouts
- Weight Reduction: Ultra-lightweight package for portable applications
Clock Management and Timing
- DLL Features: Phase alignment, frequency multiplication, division, and deskewing
- Clock Distribution: Low-skew global and regional clock networks optimized for compact layout
- Phase Relationships: 0°, 90°, 180°, 270° phase-shifted clock outputs
- Frequency Synthesis: External PLL integration support for advanced clocking schemes
- Timing Analysis: Comprehensive timing analysis capabilities for compact implementations
- Performance Reliability: Consistent timing performance in space-constrained designs
2. Price Information
The XCV200E-6FGG256C commands premium pricing due to its ultra-compact fine-pitch package technology and space-critical applications, positioning it in the specialized miniaturized FPGA market segment.
Current Market Pricing Structure
- Single Unit (1 piece): $160-240 per device
- Small Volume (2-24 units): $135-200 per device
- Medium Volume (25-99 units): $115-170 per device
- Large Volume (100-499 units): $95-140 per device
- Production Volume (500+ units): Request specialized quotation
Premium Miniaturization Pricing Factors
- Ultra-Compact Package: FGG256 fine-pitch package commands 20-35% premium over standard packages
- Advanced Assembly Requirements: Fine-pitch technology requires specialized assembly capabilities
- High-Performance Grade: -6 speed grade adds performance premium for space-critical applications
- Specialized Manufacturing: Advanced packaging technology with limited production volumes
- Space-Critical Market: Premium positioning for applications where size is paramount
Value Proposition Analysis
- Space Efficiency: Maximum functionality per unit board area
- System Miniaturization: Enables compact product designs and competitive advantages
- Weight Reduction: Critical for portable and aerospace applications
- Design Differentiation: Enables unique form factors and market positioning
- Performance Density: High performance per unit volume for space-constrained systems
Total Cost of Ownership Considerations
- Advanced Assembly: Requires specialized fine-pitch BGA assembly capabilities
- PCB Design Complexity: Multi-layer boards with controlled impedance and fine routing
- Testing Requirements: Specialized test fixtures and boundary scan testing
- Thermal Management: Compact thermal solutions for high-density designs
- Design Validation: Enhanced signal integrity analysis for fine-pitch implementation
Market Positioning and Applications
- Portable Electronics: Battery-powered devices requiring maximum functionality
- Embedded Systems: Space-constrained embedded computing applications
- Miniaturized Telecommunications: Compact communication and networking equipment
- Medical Devices: Portable and implantable medical equipment
- Aerospace Applications: Weight and space-critical avionics and satellite systems
Budget Planning Recommendations
- Space Requirements: Verify necessity of ultra-compact package for application
- Assembly Capability: Ensure access to fine-pitch BGA assembly services
- Volume Strategy: Leverage production volumes for specialized package pricing
- Design Complexity: Factor in enhanced PCB design and assembly costs
- Performance Justification: Validate -6 speed grade requirement for size-constrained design
Note: The XCV200E-6FGG256C represents premium packaging technology optimized for space-critical applications. Pricing reflects the advanced miniaturization technology and specialized assembly requirements.
3. Documents & Media
Essential Technical Documentation
- Complete Product Datasheet: Comprehensive electrical specifications, timing parameters, and operating characteristics
- Fine-Pitch Package Guide: Detailed ball assignments, package dimensions, and ultra-compact assembly guidelines
- Miniaturized Design Manual: Implementation methodology optimized for space-constrained applications
- Electrical Characteristics: DC parameters, AC timing specifications, and power consumption for compact designs
- Configuration and Programming Guide: Bitstream formats, programming interfaces, and space-optimized configuration
Advanced Fine-Pitch Design Resources
- FGG256 Package Guidelines: Specific design considerations for fine-pitch ball grid arrays
- Ultra-Compact PCB Design: Layout techniques for maximum density and signal integrity
- Fine-Pitch Assembly Guidelines: Professional assembly procedures for 0.65mm ball pitch
- Thermal Management: Cooling strategies for high-density, space-constrained implementations
- Signal Integrity Optimization: Design techniques for maintaining quality in compact layouts
Design Implementation Resources
- User Constraint File Templates: UCF examples optimized for compact, high-density designs
- Fine-Pitch Package Libraries: CAD symbols and footprints for advanced design automation tools
- Miniaturized PCB Guidelines: Layout recommendations for ultra-compact board designs
- Signal Integrity Models: IBIS models validated for fine-pitch package characteristics
- SPICE Circuit Models: Detailed electrical models for compact design simulation
Space-Optimized Design Materials
- Compact Design Patterns: Architectural approaches optimized for space-constrained applications
- Miniaturization Strategies: Resource utilization techniques for maximum functionality per area
- Thermal Design Guidelines: Heat dissipation strategies for compact, high-density designs
- Power Optimization: Power management techniques for battery-powered and portable applications
- Performance in Compact Designs: Optimization methods for maintaining speed in small packages
Software Tool Integration
- ISE Design Suite Optimization: Tool configurations for space-constrained implementations
- Compact Design Synthesis: Logic synthesis techniques optimized for area and performance
- Fine-Pitch Implementation: Place and route strategies for ultra-compact package constraints
- Thermal-Aware Design: Implementation flows considering thermal constraints in compact designs
- Signal Integrity Analysis: Tools and techniques for fine-pitch package validation
Quality and Miniaturization Documentation
- Fine-Pitch Qualification: Reliability testing data for ultra-compact package technology
- Assembly Quality Standards: Enhanced quality procedures for fine-pitch assembly
- Thermal Characterization: Junction temperature analysis for compact, high-density operation
- Package Reliability: Long-term reliability data for fine-pitch ball grid array technology
- Miniaturization Best Practices: Industry standards for ultra-compact electronic design
4. Related Resources
Specialized Software Development Environment
- Xilinx ISE Design Suite: Optimized development environment for compact implementations (versions 8.1i through 14.7)
- Area-Optimized Flows: ISE configurations for maximum functionality in minimal footprint
- Fine-Pitch Design Tools: Specialized tools for ultra-compact package implementation
- Thermal-Aware Synthesis: Synopsys Synplify Pro with thermal and area optimization
- Compact Design Simulation: ModelSim, Questa with fine-pitch package modeling
Specialized Hardware Development Infrastructure
- Fine-Pitch Programming: JTAG programmers optimized for ultra-compact package access
- Miniaturized Development Boards: Evaluation platforms demonstrating compact design techniques
- Advanced Assembly Services: Specialized fine-pitch BGA assembly and rework capabilities
- Thermal Analysis Tools: Equipment for thermal characterization of compact, high-density designs
- Signal Integrity Validation: High-frequency test equipment for fine-pitch package validation
Device Family and Compact Alternatives
- Package Variants: XCV200E-6 available in BG352, PQ240, FG456 for different space requirements
- Speed Grade Options: XCV200E-7FGG256C, XCV200E-5FGG256C for different performance needs
- Logic Density Scaling: XCV100E-6FGG256C, XCV300E-6FGG256C for different capacity requirements
- Temperature Variants: XCV200E-6FGG256I industrial grade for extended temperature operation
- Ultra-Compact Configuration: Miniaturized configuration devices and space-optimized solutions
Miniaturization IP and Core Ecosystem
- Xilinx LogiCORE IP: Area-optimized IP cores for space-constrained implementations
- Compact Communication: Miniaturized protocol stacks and interface controllers
- Space-Optimized DSP: Compact FFT, FIR filters, and mathematical function implementations
- Miniaturized Memory: Efficient memory controllers and cache implementations for compact designs
- Low-Power IP: Power-optimized cores for battery-powered and portable applications
Technical Support and Miniaturization Services
- Compact Design Engineering: Specialized support for ultra-compact implementations
- Fine-Pitch Assembly Consulting: Expert guidance on fine-pitch BGA assembly processes
- Thermal Design Services: Professional thermal analysis for compact, high-density designs
- Signal Integrity Consulting: PCB design review and optimization for fine-pitch packages
- Miniaturization Training: Specialized workshops on ultra-compact design methodologies
Technology Migration and Compact Evolution
- Next-Generation Miniaturization: Ultra-compact alternatives in newer FPGA families
- Fine-Pitch Migration: Design porting strategies for ultra-compact package implementations
- Miniaturization Benchmarking: Technology comparison for space-critical applications
- Compact Design Future: Roadmap for next-generation ultra-compact FPGA technology
- Space Optimization: Continuous improvement strategies for miniaturized designs
Industry Applications and Space-Critical Use Cases
- Portable Electronics: Battery-powered devices requiring maximum functionality density
- Medical Devices: Miniaturized medical equipment and implantable systems
- Aerospace and Satellite: Weight and space-critical avionics and communication systems
- Wearable Technology: Ultra-compact wearable devices and sensor systems
- IoT and Edge Computing: Miniaturized internet-of-things and edge processing nodes
Standards and Miniaturized Protocols
- Compact Communication: Miniaturized implementations of standard protocols
- Low-Power Standards: Power-efficient protocol implementations for portable applications
- Space-Constrained Interfaces: Compact memory and peripheral interface implementations
- Wireless Miniaturization: Ultra-compact wireless communication protocol stacks
- Sensor Integration: Miniaturized sensor interface and processing implementations
Advanced Miniaturization Methodologies
- 3D Design Techniques: Multi-layer and stacked design approaches for space optimization
- Thermal Management: Advanced cooling techniques for high-density, compact implementations
- Power Distribution: Efficient power delivery in space-constrained designs
- Signal Routing: Advanced routing techniques for ultra-compact PCB layouts
- System Integration: Holistic approaches to miniaturized system design
Assembly and Manufacturing for Ultra-Compact Designs
- Fine-Pitch Assembly: Specialized assembly techniques for 0.65mm ball pitch packages
- Quality Control: Enhanced inspection procedures for ultra-compact assembly
- Thermal Management: Cooling solutions for compact, high-density electronic assemblies
- Test and Validation: Specialized test procedures for miniaturized electronic systems
- Production Scaling: Manufacturing strategies for ultra-compact, high-volume production
5. Environmental & Export Classifications
Comprehensive Environmental Compliance
- RoHS Directive 2011/65/EU: Full compliance with European Restriction of Hazardous Substances
- WEEE Directive 2012/19/EU: Waste Electrical and Electronic Equipment recycling compliance
- REACH Regulation EC 1907/2006: Chemical registration, evaluation, and authorization compliance
- California Proposition 65: Safe Drinking Water and Toxic Enforcement Act compliance
- Conflict Minerals: Dodd-Frank Act Section 1502 responsible sourcing compliance
- Green Miniaturization: Halogen-free materials optimized for ultra-compact applications
Operating Environmental Specifications
- Operating Temperature Range: 0°C to +85°C (Commercial temperature grade)
- Compact Thermal Management: Enhanced thermal considerations for ultra-compact designs
- Storage Temperature Range: -65°C to +150°C non-operating storage conditions
- Relative Humidity: 5% to 95% non-condensing with enhanced moisture protection
- Operating Altitude: Sea level to 2000 meters above sea level
- Atmospheric Pressure: 86 kPa to 106 kPa operational pressure range
- Mechanical Stress: Enhanced JEDEC JESD22-B103 and B104 compliance for fine-pitch packages
Enhanced Reliability and Quality Standards
- Quality Management: ISO 9001:2015 with specialized controls for ultra-compact packaging
- Fine-Pitch Qualification: Enhanced JEDEC JESD47 qualification for fine-pitch technology
- Mean Time Between Failures: >350,000 hours at 55°C junction temperature
- Accelerated Stress Testing: Extended testing optimized for ultra-compact package reliability
- Electrostatic Discharge: Enhanced Class 1 (>2000V HBM, >200V MM) ESD protection
- Latch-up Immunity: >100mA current injection with fine-pitch package considerations
- Assembly Reliability: Enhanced solder joint reliability validation for fine-pitch connections
Export Control and International Trade
- Export Control Classification: 3A001.a.7 per US Export Administration Regulations (EAR)
- Miniaturization Technology: Enhanced scrutiny for ultra-compact packaging technology
- Harmonized Tariff Schedule: 8542.33.0001 classification for semiconductor integrated circuits
- Bureau of Industry and Security: US Department of Commerce export licensing jurisdiction
- Export License Requirements: Potential enhanced requirements for miniaturization technology
- Wassenaar Arrangement: Dual-use technology multilateral export control coordination
- EU Dual-Use Regulation: Council Regulation (EC) No 428/2009 enhanced compliance
Manufacturing and Supply Chain Excellence
- Primary Manufacturing: Ireland (Fab 24) with specialized ultra-compact packaging
- Advanced Assembly: Specialized facilities with fine-pitch assembly capabilities
- Supply Chain Security: Enhanced C-TPAT certification with miniaturization technology validation
- Country of Origin: Manufacturing location with enhanced traceability for advanced packaging
- Certificate of Origin: Available with specialized documentation for ultra-compact devices
- Quality Traceability: Statistical process control with fine-pitch assembly validation
Advanced Packaging and Material Standards
- Moisture Sensitivity Level: MSL-3 with enhanced handling for fine-pitch packages
- Ultra-Compact Package: FGG256 optimized for maximum miniaturization and reliability
- Lead-Free Fine-Pitch: Advanced RoHS-compliant assembly for 0.65mm ball pitch
- Package Marking: Laser marking optimized for ultra-compact package identification
- Anti-Static Protection: Enhanced ESD-safe packaging for fine-pitch devices
- Precision Assembly: Optimized package design for fine-pitch assembly precision
Safety and Ultra-Compact Certifications
- UL Recognition: Enhanced component recognition for ultra-compact applications
- CSA Certification: Canadian standards with fine-pitch package validation
- TUV Compliance: European safety standards with ultra-compact design validation
- FCC Part 15: Enhanced electromagnetic compatibility for miniaturized designs
- CE Marking: European Conformity with ultra-compact package validation
- Fine-Pitch Safety: Additional safety considerations for ultra-compact assembly
Sustainability and Miniaturization Optimization
- Material Efficiency: Optimized material usage through ultra-compact design
- Energy Efficiency: Enhanced power efficiency for portable and battery-powered applications
- Miniaturization Benefits: Reduced material consumption and transportation impact
- Lifecycle Optimization: Extended device utility through space-efficient design
- Green Compact Design: Environmentally conscious ultra-compact technology development
- Resource Conservation: Minimized resource usage through advanced miniaturization
International Ultra-Compact Standards
- ISO 14001: Environmental management with ultra-compact packaging specialization
- Miniaturization Quality: Enhanced quality standards for fine-pitch assembly
- Assembly Validation: Statistical validation of fine-pitch assembly reliability
- Thermal Standards: Enhanced thermal management for ultra-compact designs
- EMI/EMC Compliance: Enhanced electromagnetic compatibility for miniaturized applications
- International Handling: Specialized procedures for ultra-compact semiconductor devices
Specialized Application Compliance
- Medical Device Standards: Enhanced ISO 13485 for miniaturized medical applications
- Aerospace Standards: AS9100 with ultra-compact device qualification for space applications
- Portable Electronics: Specialized compliance for battery-powered and portable devices
- Wearable Technology: Enhanced standards for wearable and body-worn applications
- IoT Devices: Compliance considerations for internet-of-things and edge computing
- Mobile Applications: Standards for mobile and handheld device implementations
End-of-Life and Ultra-Compact Recycling
- Fine-Pitch Recycling: Specialized recycling for ultra-compact semiconductor packages
- Precious Metal Recovery: Enhanced recovery processes for miniaturized devices
- Compact Device Disposal: Specialized disposal procedures for ultra-compact electronics
- Material Recovery: Advanced techniques for material reclamation from fine-pitch packages
- Environmental Impact: Lifecycle assessment for ultra-compact device production
- Circular Economy: Design for recycling in ultra-compact applications
The XCV200E-6FGG256C delivers exceptional performance density in an ultra-compact fine-pitch package, making it ideal for space-critical applications where maximum functionality must be achieved in minimal footprint. As part of the mature Virtex-E family, it provides proven high-performance technology with advanced miniaturization capabilities for demanding portable and embedded applications.
For current availability, detailed specifications, and pricing information for the XCV200E-6FGG256C, please contact authorized Xilinx distributors or access official Xilinx product documentation. Due to the ultra-compact fine-pitch nature of this device, early engagement with specialized assembly services is recommended for successful implementation.
