XCV200E-6BGG352C FPGA: Compact High-Performance Xilinx Virtex-E Series Field-Programmable Gate Array

1. Product Specifications

Core Device Architecture

• Device Family: Xilinx Virtex-E Series
• Part Number: XCV200E-6BGG352C
• System Gates: 200,000 equivalent logic gates
• Speed Grade: -6 (high-performance grade)
• Package Type: BGG352 (Ball Grid Array)
• Temperature Grade: Commercial (0°C to +85°C)
• Core Supply Voltage: 1.8V ±5%
• I/O Supply Voltages: 3.3V, 2.5V, 1.8V selectable banks

Logic Resources and Architecture

• Configurable Logic Blocks: 1,024 CLBs arranged in 32×32 matrix configuration
• Equivalent Logic Cells: Approximately 5,292 logic cells
• Look-Up Tables (LUTs): 2,048 four-input function generators
• Flip-Flops: 2,048 edge-triggered D-type storage elements with enable
• Distributed SelectRAM: 84 Kbits configurable as RAM, ROM, or shift registers
• Block SelectRAM: 28 Kbits organized in 7 dual-port memory blocks
• Tri-state Buffers: 1,024 three-state driver elements for bus implementations

High-Performance Processing Features

• Embedded Multipliers: 8 dedicated 18×18 signed multiplier blocks
• Digital Clock Management: 4 Delay Locked Loops (DLLs) for precise clock conditioning
• Global Clock Networks: 4 low-skew global clock distribution trees
• Maximum Performance: 166+ MHz system clock frequency capability
• Advanced Carry Chains: High-speed arithmetic and counter implementations
• Optimized Interconnect: Performance-tuned routing fabric for reliable timing closure

Package and Physical Specifications

• Package Format: 352-pin Ball Grid Array
• Package Dimensions: 23mm × 23mm × 2.23mm
• Ball Pitch: 1.27mm center-to-center spacing
• Total Ball Count: 352 solder ball connections
• Substrate Technology: Advanced organic laminate with copper trace routing
• Thermal Resistance: θJA = 25°C/W (with 200 LFM airflow)
• Package Weight: 0.5 grams nominal

Input/Output Architecture

• Maximum User I/Os: Up to 232 single-ended I/O pins
• I/O Banking System: 8 independent voltage and standard banks
• Supported I/O Standards: LVTTL, LVCMOS, PCI, PCIX, GTL, SSTL, HSTL
• Differential Signaling: LVDS, LVPECL, differential SSTL implementations
• Drive Strength Options: 2mA, 4mA, 6mA, 8mA, 12mA, 16mA, 24mA selectable
• Slew Rate Control: Programmable fast and slow edge rates for signal integrity
• On-Chip Termination: Software-controlled input termination for enhanced signal quality

Configuration and Programming

• Configuration Technology: SRAM-based volatile configuration memory
• Configuration Bitstream Size: Approximately 1.1 Mbits
• Programming Interfaces: JTAG boundary scan, SelectMAP parallel, serial modes
• Configuration Time: <200ms typical from external serial configuration device
• Readback Capability: Complete configuration and user register readback support
• Partial Reconfiguration: Limited dynamic reconfiguration capability
• Security Features: Bitstream encryption and device authentication support

Memory System Organization

• Distributed Memory: LUT-based configurable RAM and shift register implementations
• Block Memory: True dual-port RAM with independent read/write ports and clock domains
• Memory Configuration: Variable width (1 to 32 bits) and depth options
• Memory Initialization: Power-up initialization from configuration bitstream
• Error Detection: Optional parity generation and checking capabilities
• Memory Cascading: Block combination for larger memory structure implementations

Clock Management and Timing

• DLL Features: Phase alignment, frequency multiplication, division, and deskewing
• Clock Distribution: Low-skew global and regional clock distribution networks
• Phase Relationships: 0°, 90°, 180°, 270° phase-shifted clock outputs
• Frequency Synthesis: External PLL integration support for advanced clocking schemes
• Timing Analysis: Comprehensive timing analysis and optimization capabilities
• Performance Optimization: Optimized for reliable high-frequency operation

Compact Package Benefits

• Space Efficiency: Compact 23mm × 23mm footprint for space-constrained designs
• Thermal Performance: Excellent thermal characteristics with compact package
• Signal Integrity: Optimized ball assignment for signal quality maintenance
• Assembly Compatibility: Standard BGA assembly processes and equipment
• Cost-Effective: Balanced package size offering good I/O count at reasonable cost
• Design Flexibility: Sufficient I/O for most applications in compact form factor

2. Price Information

The XCV200E-6BGG352C is positioned in the mainstream high-performance commercial FPGA market, offering excellent value for applications requiring reliable performance in a compact package format.

Current Market Pricing Structure

• Single Unit (1 piece): $130-190 per device
• Small Volume (2-24 units): $110-160 per device
• Medium Volume (25-99 units): $90-135 per device
• Large Volume (100-499 units): $75-115 per device
• Production Volume (500+ units): Request competitive quotation

Balanced Performance Pricing Factors

• High-Performance Speed: -6 grade offers excellent performance at competitive pricing
• Compact Package: BGG352 package provides optimal balance of I/O and size
• Commercial Temperature: Standard pricing tier for 0°C to +85°C operation
• Mature Technology: Established manufacturing processes enable cost-effective production
• Market Positioning: Optimal balance between performance, features, and cost

Value Proposition Analysis

• Performance-Size Balance: Excellent performance in compact form factor
• I/O Efficiency: Good I/O count (232 pins) in space-efficient package
• Design Versatility: Suitable for wide range of applications and form factors
• Proven Technology: Mature Virtex-E architecture with established ecosystem
• Assembly Efficiency: Standard BGA assembly reduces manufacturing complexity

Total Cost of Ownership Benefits

• Compact Design: Enables smaller PCB designs and reduced system costs
• Standard Assembly: Conventional BGA assembly techniques reduce costs
• Thermal Efficiency: Good thermal performance reduces cooling requirements
• Proven Reliability: Mature technology reduces development and validation time
• Ecosystem Support: Comprehensive tool and IP support reduces development costs

Market Positioning and Applications

• Telecommunications: Compact equipment and space-efficient implementations
• Digital Signal Processing: Balanced performance for real-time processing applications
• Embedded Computing: High-performance embedded systems in compact form factors
• Consumer Electronics: Space-constrained consumer applications requiring performance
• Industrial Control: Compact control systems with reliable operation requirements

Budget Planning Considerations

• Performance Requirements: Verify -6 speed grade meets application timing needs
• Size Constraints: Confirm compact package meets space requirements
• I/O Sufficiency: Validate 232 I/O pins meet connectivity requirements
• Volume Strategy: Leverage volume pricing for production quantities
• Development Efficiency: Factor in reduced development time with proven technology

Note: The XCV200E-6BGG352C provides excellent value through its combination of high performance, compact packaging, and competitive pricing. This balance makes it suitable for applications requiring space efficiency without compromising performance.

3. Documents & Media

Essential Technical Documentation

• Complete Product Datasheet: Comprehensive electrical specifications, timing parameters, and operating characteristics
• Package and Pinout Guide: Detailed ball assignments, package dimensions, and assembly specifications
• Design Implementation Manual: Implementation methodology, design flow, and optimization strategies
• Electrical Characteristics: DC parameters, AC timing specifications, and power consumption data
• Configuration and Programming Guide: Bitstream formats, programming interfaces, and configuration procedures

Compact Package Design Resources

• BGG352 Package Guidelines: Design considerations for compact ball grid array packages
• Space-Efficient PCB Design: Layout strategies for compact implementations
• Thermal Management: Cooling strategies optimized for compact packages
• Signal Integrity: Maintaining signal quality in compact high-density designs
• Assembly Guidelines: Professional assembly procedures for BGG352 packages

Design Implementation Resources

• User Constraint File Templates: UCF examples and timing constraint guidelines
• Package Library Components: CAD symbols and footprints for major design automation tools
• PCB Design Guidelines: Layout recommendations, routing techniques, and design rules
• Signal Integrity Models: IBIS models for signal integrity simulation and analysis
• SPICE Circuit Models: Electrical models for circuit simulation and validation

Performance Optimization Materials

• Timing Closure Guidelines: Strategies for achieving reliable timing closure with -6 speed grade
• Performance Optimization Manual: Resource utilization and speed optimization techniques
• Compact Design Patterns: Architectural approaches optimized for space-efficient implementations
• Power Management Guidelines: Power optimization strategies for compact designs
• I/O Optimization: Techniques for maximizing I/O utilization in compact packages

Software Tool Integration

• ISE Design Suite Integration: Complete tool flow documentation and configuration settings
• Synthesis Optimization: Logic synthesis techniques for balanced performance and area
• Implementation and Routing: Place and route strategies for compact package optimization
• Simulation and Verification: Behavioral modeling and verification methodologies
• Debug Tool Integration: ChipScope Pro usage for real-time debugging in compact designs

Quality and Reliability Documentation

• Device Qualification Reports: Reliability testing data and qualification standards
• Compact Package Reliability: BGG352 package reliability characteristics and validation
• Manufacturing Quality: Statistical process control and quality assurance procedures
• Known Issues and Errata: Device limitations, design considerations, and workarounds
• Thermal Analysis Guidelines: Junction temperature management in compact packages

4. Related Resources

Software Development Environment

• Xilinx ISE Design Suite: Complete integrated development environment (versions 8.1i through 14.7)
• ISE WebPACK Free Edition: No-cost development software with full XCV200E-6BGG352C support
• Third-Party Synthesis Tools: Synopsys Synplify Pro, Mentor Graphics Precision RTL synthesis
• Simulation and Verification: ModelSim, Questa, VCS, NC-Verilog, Active-HDL compatibility
• Static Timing Analysis: Synopsys PrimeTime and Cadence Tempus integration support

Hardware Development Infrastructure

• Programming and Configuration: Platform Cable USB, Parallel Cable IV, JTAG programming solutions
• Development Platforms: Third-party evaluation boards and custom development systems
• Socket and Test Solutions: BGA sockets, programming adapters, and production test fixtures
• Debug and Analysis Tools: ChipScope Pro integrated logic analyzer and signal capture
• Production Programming: Automated test equipment and manufacturing programming solutions

Device Family and Package Alternatives

• Speed Grade Variants: XCV200E-7BGG352C, XCV200E-5BGG352C for different performance requirements
• Package Alternatives: XCV200E-6 available in BG352, FG456, PQ240, PQG240 packages
• Logic Density Options: XCV100E-6BGG352C, XCV300E-6BGG352C for different capacity needs
• Temperature Variants: XCV200E-6BGG352I industrial grade for extended temperature operation
• Configuration Support: XC18V01, XC18V02, XC18V04 serial configuration PROMs

Intellectual Property and Core Ecosystem

• Xilinx LogiCORE IP: Comprehensive library of pre-verified and optimized IP cores
• CORE Generator System: Parameterizable IP core generation and customization tools
• Communication and Interface: Ethernet, PCI, USB, UART, SPI, I2C protocol implementations
• Digital Signal Processing: FFT, FIR filters, DDS, mathematical functions, and DSP primitives
• Memory and Storage: External memory controllers, FIFO implementations, and cache systems

Technical Support and Professional Services

• Xilinx Support Center: Online technical support portal and comprehensive knowledge base
• Community Forums: Active user community with peer-to-peer technical assistance
• Field Application Engineering: Regional technical experts for consultation and design reviews
• Professional Design Services: Implementation consulting, optimization services, and design migration
• Training and Certification: Technical education programs and professional development courses

Technology Migration and Evolution

• Next-Generation Alternatives: Spartan-6, Kintex-7, Artix-7, Zynq-7000 upgrade paths
• Design Migration Tools: Automated design porting utilities and compatibility assessment
• Pin Compatibility Analysis: Drop-in replacement evaluation and upgrade strategies
• Performance Benchmarking: Technology comparison tools for informed migration decisions
• Lifecycle Management: End-of-life planning and long-term availability strategies

Industry Applications and Use Cases

• Telecommunications Infrastructure: Compact equipment and space-efficient implementations
• Digital Signal Processing: Real-time signal analysis and processing in compact systems
• Embedded Computing: High-performance embedded systems with space constraints
• Consumer Electronics: Space-constrained consumer applications requiring reliable performance
• Industrial Automation: Compact control systems and monitoring equipment

Standards and Protocol Support

• Communication Protocols: PCIe, Ethernet, USB, SATA protocol implementations
• Industrial Standards: Profibus, DeviceNet, EtherCAT, SERCOS fieldbus support
• Memory Interfaces: DDR, SDRAM, SRAM external memory controller implementations
• Video and Multimedia: Video processing, compression, and display interface support
• Wireless Applications: Software-defined radio and baseband processing implementations

Design Methodologies and Best Practices

• HDL Coding Guidelines: VHDL and Verilog coding standards and style recommendations
• Verification and Validation: Testbench development, assertion-based verification, coverage analysis
• Physical Design Optimization: Floorplanning, placement optimization, timing-driven implementation
• Power Optimization: Static and dynamic power reduction techniques for compact designs
• Design for Testability: Built-in self-test, boundary scan, and production test strategies

Assembly and Manufacturing Support

• Compact BGA Assembly: Professional assembly techniques for BGG352 packages
• Space-Efficient PCB Design: Advanced layout techniques for compact implementations
• Quality Control: Enhanced inspection and testing procedures for compact assemblies
• Thermal Management: Cooling solutions optimized for compact package implementations
• Production Optimization: Manufacturing strategies for high-volume compact designs

5. Environmental & Export Classifications

Comprehensive Environmental Compliance

• RoHS Directive 2011/65/EU: Full compliance with European Restriction of Hazardous Substances
• WEEE Directive 2012/19/EU: Waste Electrical and Electronic Equipment recycling compliance
• REACH Regulation EC 1907/2006: Chemical registration, evaluation, and authorization compliance
• California Proposition 65: Safe Drinking Water and Toxic Enforcement Act compliance
• Conflict Minerals: Dodd-Frank Act Section 1502 responsible sourcing compliance
• Green Manufacturing: Halogen-free materials and environmentally conscious production

Operating Environmental Specifications

• Operating Temperature Range: 0°C to +85°C (Commercial temperature grade)
• Compact Package Thermal: Optimized thermal performance in small form factor
• Storage Temperature Range: -65°C to +150°C non-operating storage conditions
• Relative Humidity: 5% to 95% non-condensing during operation and storage
• Operating Altitude: Sea level to 2000 meters above sea level
• Atmospheric Pressure: 86 kPa to 106 kPa operational pressure range
• Mechanical Stress: JEDEC JESD22-B103 vibration and B104 shock compliance

Reliability and Quality Standards

• Quality Management: ISO 9001:2015 certified manufacturing processes and systems
• Reliability Standards: JEDEC JESD47 stress test qualification methodology
• Mean Time Between Failures: >400,000 hours at 55°C junction temperature
• Accelerated Life Testing: Extended testing at 125°C and 85°C/85% humidity
• Electrostatic Discharge: Class 1 (>2000V HBM, >200V MM) ESD protection
• Latch-up Immunity: >100mA current injection on all I/O pins per JEDEC standards
• Compact Package Reliability: Enhanced reliability validation for space-efficient designs

Export Control and International Trade

• Export Control Classification: 3A001.a.7 per US Export Administration Regulations (EAR)
• Harmonized Tariff Schedule: 8542.33.0001 classification for semiconductor integrated circuits
• Bureau of Industry and Security: US Department of Commerce export licensing jurisdiction
• Export License Requirements: May be required for restricted destinations and end-users
• International Traffic in Arms: Not subject to ITAR (International Traffic in Arms Regulations)
• Wassenaar Arrangement: Dual-use technology multilateral export control coordination
• EU Dual-Use Regulation: Council Regulation (EC) No 428/2009 export control compliance

Manufacturing and Supply Chain Information

• Primary Manufacturing: Ireland (Fab 24), Malaysia (AATM), Philippines (ATP)
• Assembly and Test: ISO 14001 environmental management certified facilities
• Supply Chain Security: C-TPAT (Customs-Trade Partnership Against Terrorism) certification
• Country of Origin: Manufacturing location dependent – Ireland, Malaysia, or Philippines
• Certificate of Origin: Available for customs clearance and trade agreement benefits
• Quality Traceability: Complete manufacturing and test record maintenance

Packaging and Material Standards

• Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020D (168 hours at 30°C/60% RH)
• Compact Package Design: BGG352 optimized for space efficiency and reliability
• Lead-Free Assembly: RoHS-compliant lead-free assembly processes and materials
• Package Marking: Laser marking with part number, date code, and traceability information
• Anti-Static Packaging: ESD-safe packaging with appropriate handling procedures
• Space-Efficient Materials: Advanced materials optimized for compact implementations

Safety and Regulatory Certifications

• UL Component Recognition: UL 1998 Standard for Software in Medical Devices compliance
• CSA Certification: Canadian Standards Association electrical safety approval
• TUV Technical Inspection: European safety standard certification and compliance
• FCC Part 15: Electromagnetic compatibility for unintentional radiator devices
• CE Marking: European Conformity declaration available for system integrators
• IEC Safety Standards: IEC 60950-1 information technology equipment safety compliance

Sustainability and Corporate Responsibility

• Carbon Footprint Management: Manufacturing optimization for reduced greenhouse gas emissions
• Renewable Energy Usage: Solar and wind power integration in production facilities
• Water Conservation: Advanced water recycling and conservation in semiconductor fabrication
• Waste Reduction: Zero waste to landfill goals and comprehensive recycling programs
• Supplier Code of Conduct: Responsible Business Alliance (RBA) compliance requirements
• Conflict-Free Sourcing: Ethical sourcing of tantalum, tin, tungsten, and gold

End-of-Life and Recycling Management

• Product Recycling Programs: Manufacturer-sponsored device return and material recovery
• Precious Metal Recovery: Advanced processes for gold, silver, and platinum reclamation
• Electronic Waste Processing: WEEE Directive compliant certified e-waste handling
• Secure Data Destruction: Secure disposal protocols for devices containing sensitive information
• Circular Economy: Design for disassembly and material lifecycle extension principles
• Environmental Impact Assessment: Comprehensive lifecycle environmental impact evaluation

International Standards and Certifications

• ISO 14001: Environmental management system certification for manufacturing facilities
• OHSAS 18001: Occupational health and safety management system compliance
• ISO 45001: Transition to new occupational health and safety management standard
• EMAS Registration: EU Eco-Management and Audit Scheme voluntary participation
• Energy Star Partnership: Energy efficiency program participation and compliance
• EPEAT Registration: Electronic Product Environmental Assessment Tool eligibility

Specialized Application Compliance

• Medical Device Standards: ISO 13485 quality management for medical applications
• Automotive Quality: TS 16949 automotive quality management system principles
• Telecommunications: NEBS (Network Equipment Building System) compliance capability
• Industrial Safety: IEC 61508 functional safety for safety-critical applications
• Aerospace Standards: AS9100 aerospace quality management system considerations
• Defense Applications: MIL-STD compliance potential for military and defense use

Compact Package Environmental Considerations

• Space Efficiency Benefits: Reduced material usage and environmental footprint
• Thermal Optimization: Enhanced thermal performance reducing cooling requirements
• Material Efficiency: Optimized packaging for reduced waste and resource consumption
• Assembly Efficiency: Reduced PCB size and material requirements
• Transportation Optimization: Compact packaging reducing shipping environmental impact
• Lifecycle Benefits: Enhanced reliability extending product operational life

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The XCV200E-6BGG352C delivers reliable high-performance operation in a compact, space-efficient package, making it ideal for applications requiring excellent performance density and proven technology. As part of the mature Virtex-E family, it provides established design flows with optimized size and cost characteristics for space-constrained commercial applications.

For current availability, detailed specifications, and pricing information for the XCV200E-6BGG352C, please contact authorized Xilinx distributors or access official Xilinx product documentation. The compact BGG352 package provides excellent performance density for space-efficient implementations requiring reliable operation.