Product Specifications
Core Architecture Details
- Part Number: XCV2000E-6FG680I
- Product Family: Virtex-E Series FPGA
- System Gates: 2,000,000 equivalent gates
- Logic Cells: 23,040 logic cells
- Configurable Logic Blocks (CLBs): 2,880 CLBs
- Block RAM: 160 Kbits embedded memory
Performance Parameters
- Speed Grade: -6 (standard performance grade)
- Core Voltage: 1.8V ±5%
- I/O Voltage: 3.3V, 2.5V, 1.8V compatible
- Maximum Operating Frequency: Up to 180 MHz
- Propagation Delay: 0.22ns typical
- Clock Distribution: 4 global clock networks
Package Specifications
- Package Type: FG680 (Fine-pitch Ball Grid Array)
- Total Pins: 680 pins
- Ball Pitch: 1.0mm
- Package Dimensions: 27mm x 27mm
- Body Thickness: 2.30mm nominal
- Temperature Grade: Industrial (-40°C to +85°C)
Memory and I/O Features
- User I/O Pins: 512 maximum
- Differential I/O Pairs: 256 pairs
- Embedded Multipliers: 160 dedicated 18×18 multipliers
- Distributed RAM: 360 Kbits
- I/O Standards Supported: LVTTL, LVCMOS, GTL+, HSTL, SSTL, LVDS
Advanced Features
- Delay Locked Loops (DLLs): 8 DLLs for precise clock management
- Configuration Memory: SRAM-based with multiple configuration modes
- Boundary Scan: IEEE 1149.1 JTAG compliant
- Power Management: Multiple power domains for optimized consumption
Pricing Information
XCV2000E-6FG680I pricing structure and availability:
Standard Pricing
- Single Unit Price: Contact authorized distributors for current rates
- Small Quantity (1-24 units): Premium pricing tier
- Medium Volume (25-99 units): Volume discount applicable
- Large Volume (100+ units): Significant cost reductions available
Procurement Details
- Minimum Order Quantity: 1 piece
- Standard Lead Time: 12-20 weeks from authorized suppliers
- Express Delivery: Available with premium charges
- Stock Availability: Contact Xilinx partners for real-time inventory
Pricing varies by region and distributor. Contact authorized Xilinx distributors for current XCV2000E-6FG680I pricing and delivery schedules.
Documents & Media
Technical Documentation
- Complete Datasheet: XCV2000E-6FG680I specifications and electrical characteristics
- User Guide: Virtex-E FPGA User Manual with design guidelines
- Package Information: FG680 mechanical drawings and dimensions
- Pin Configuration: Complete pinout diagrams and ball assignments
Design Support Files
- CAD Libraries: Footprint files for major PCB design tools
- IBIS Models: Signal integrity simulation models
- Timing Specifications: Setup, hold, and propagation delay data
- Power Estimation: Spreadsheets for power consumption analysis
Application Resources
- Reference Designs: Proven implementations for common applications
- Application Notes:
- PCB Design Guidelines for XCV2000E-6FG680I
- Thermal Management Solutions
- High-Speed Signal Integrity Best Practices
- Power Distribution Network Design
Software Documentation
- ISE Design Suite: Complete development environment documentation
- Synthesis Guidelines: Optimization techniques for Virtex-E architecture
- Implementation Tools: Place and route optimization strategies
- Debug Tools: ChipScope Pro integration and usage guides
Related Resources
Development Platforms
- XCV2000E-6FG680I Evaluation Boards: Complete development and prototyping platforms
- Starter Kits: Entry-level development packages with tutorials
- Reference Boards: Industry-specific demonstration platforms
Programming and Configuration
- JTAG Programming Cables: USB and parallel port interfaces
- Configuration Memory: Compatible PROM and Flash memory devices
- Download Cables: Platform Cable USB II and other programming tools
Companion ICs
- Clock Generation: Compatible oscillators and clock synthesizers
- Power Management: Voltage regulators optimized for Virtex-E requirements
- Interface Circuits: Level translators and signal conditioning ICs
- Memory Interfaces: DDR, QDR, and high-speed SRAM controllers
Technical Support Resources
- Application Engineering: Expert design consultation services
- Training Programs: Online and classroom FPGA design courses
- Design Services: Third-party design and consulting partners
- Community Support: Xilinx forums and user groups
Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Directive: Fully compliant with lead-free manufacturing requirements
- REACH Regulation: Compliant with European chemical safety standards
- WEEE Directive: Electronic waste management compliance
- Conflict Minerals: Compliant with Section 1502 of Dodd-Frank Act
Operating Environmental Conditions
- Operating Temperature: -40°C to +85°C (Industrial temperature grade)
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 85% non-condensing
- Thermal Resistance: θJA = 23°C/W (still air), θJA = 15°C/W (with airflow)
Reliability and Quality Standards
- JEDEC Standards: Compliant with JEDEC solid-state technology standards
- Quality Level: Standard commercial reliability
- ESD Classification: Class 1C (>2000V Human Body Model)
- Latch-up Current: >100mA at maximum operating temperature
Export Control Information
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): 8542.31.0000
- Country of Origin: Manufacturing location varies
- Export License: May require export license for certain destinations
Safety and Certification
- UL Recognition: UL 1998 recognized component
- CE Marking: Compliant with European conformity requirements
- FCC Part 15: Compliant for unintentional radiators
- ITAR Status: Not subject to International Traffic in Arms Regulations
Packaging and Handling
- Moisture Sensitivity Level: MSL 3 (168 hours at 30°C/60% RH)
- ESD Precautions: Requires proper ESD handling procedures
- Package Marking: Laser-marked with part number and date code
- Tray Packaging: Anti-static carrier trays for safe handling
Key Application Areas
The XCV2000E-6FG680I excels in diverse applications including:
- Digital Signal Processing: Real-time audio/video processing systems
- Communications Infrastructure: Base stations and networking equipment
- Industrial Control: High-performance automation and robotics
- Test and Measurement: Advanced instrumentation and analyzers
- Military/Aerospace: Radar, sonar, and avionics systems
- Medical Electronics: Imaging systems and diagnostic equipment
Technical Advantages
Performance Benefits
- High logic density with 2M system gates in compact FG680 package
- Flexible I/O configuration supporting multiple voltage standards
- Dedicated multipliers for efficient DSP implementations
- Advanced clock management with 8 DLLs for timing optimization
Design Flexibility
- SRAM-based configuration enables unlimited reprogramming
- Multiple configuration modes for diverse system requirements
- Extensive I/O capabilities with 512 user-configurable pins
- Compatible with industry-standard design tools and flows
Conclusion
The XCV2000E-6FG680I represents an optimal balance of performance, capacity, and cost-effectiveness for high-performance FPGA applications. With its robust feature set, comprehensive development support, and proven reliability, this Virtex-E device enables designers to implement complex digital systems with confidence.
For detailed specifications, current pricing, and technical support regarding the XCV2000E-6FG680I, contact authorized Xilinx distributors or visit the official Xilinx documentation portal.
