Product Specifications
Core Architecture
- Part Number: XCV2000E-6FG1156C
- Device Family: Virtex-E Series FPGA
- Logic Density: 2,000,000 system gates
- Logic Cells: 23,040 equivalent logic cells
- Configurable Logic Blocks (CLBs): 2,880 CLBs
- Slices per CLB: 8 slices (23,040 total slices)
Memory Resources
- Block RAM: 160 Kbits embedded block memory
- Distributed RAM: 360 Kbits distributed memory
- Block RAM Configuration: 40 blocks x 4K bits each
- Memory Flexibility: Dual-port, single-port, and FIFO configurations
- RAM Cascade: Support for larger memory structures
Performance Specifications
- Speed Grade: -6 (standard performance grade)
- Core Voltage: 1.8V ±5%
- I/O Voltage: 3.3V, 2.5V, 1.8V selectable
- Maximum Clock Frequency: Up to 180 MHz
- Typical Gate Delay: 0.22ns
- Clock-to-Output: 1.5ns typical
Package Details – FG1156C
- Package Type: FG1156 Fine-pitch Ball Grid Array
- Temperature Grade: C (Commercial: 0°C to +85°C)
- Total Ball Count: 1,156 solder balls
- Ball Pitch: 1.0mm
- Package Dimensions: 35mm x 35mm x 2.65mm
- Maximum User I/O: 804 pins
Digital Signal Processing Features
- Dedicated Multipliers: 160 embedded 18×18 signed multipliers
- DSP Blocks: Optimized for high-performance signal processing
- Multiply-Accumulate (MAC): Hardware-efficient MAC operations
- Filter Implementations: Optimized for FIR and IIR digital filters
- FFT Support: Efficient Fast Fourier Transform implementations
Clock Management System
- Delay Locked Loops (DLLs): 8 precision DLLs
- Global Clock Networks: 4 dedicated low-skew clock trees
- Clock De-skew: Advanced phase alignment capabilities
- Secondary Clocks: 12 secondary global clock networks
- Clock Enable: Global clock enable functionality
I/O Architecture
- I/O Standards: LVTTL, LVCMOS, GTL+, HSTL, SSTL2, SSTL3, LVDS, LVPECL
- Differential I/O: Up to 402 differential pairs
- Output Drive Strength: 2mA to 24mA programmable
- Input/Output Delay: Programmable input and output delays
- 3-State Control: Individual 3-state control for each output
Configuration and Programming
- Configuration Method: SRAM-based unlimited reprogramming
- Configuration Memory: 65,536 x 32-bit frames
- Configuration Time: <100ms typical
- Boundary Scan: IEEE 1149.1 JTAG compliant
- Partial Reconfiguration: Support for runtime reconfiguration
Pricing Information
XCV2000E-6FG1156C commercial pricing and availability:
Price Structure
- Unit Price (1-9 pieces): Contact authorized distributors for current rates
- Small Quantity (10-24 units): Standard list pricing
- Medium Volume (25-99 units): Volume discount pricing available
- Large Volume (100-499 units): Significant price reductions
- Production Volume (500+ units): Maximum volume discounts
Commercial Procurement
- Lead Time: 10-18 weeks standard delivery
- Minimum Order Quantity: 1 unit
- Sample Programs: Engineering samples available
- Packaging Options: Anti-static trays, tubes, tape and reel
Cost Optimization
- Commercial Grade Value: Cost-effective compared to industrial/military grades
- High I/O Density: Excellent price-per-I/O ratio with 804 pins
- Integration Benefits: Reduced system cost through high logic capacity
For current XCV2000E-6FG1156C pricing, volume discounts, and delivery schedules, contact authorized Xilinx distributors or sales representatives.
Documents & Media
Primary Technical Documentation
- Complete Datasheet: XCV2000E-6FG1156C electrical and timing specifications
- Virtex-E Family User Guide: Comprehensive architecture and design manual
- Package Documentation: FG1156 mechanical drawings and specifications
- Pinout Documentation: Complete pin assignment and ball location guide
Design Implementation Files
- PCB Design Files: Footprint libraries for major CAD tools (Altium, Cadence, Mentor)
- IBIS Simulation Models: Signal integrity analysis and simulation files
- Timing Models: SDF and other timing analysis file formats
- Power Models: XPower estimation spreadsheets and power analysis tools
Application Documentation
- PCB Design Guidelines: Layout best practices for XCV2000E-6FG1156C
- High-Speed Design: Signal integrity considerations for 804-pin BGA
- Power Distribution: Voltage regulation and decoupling recommendations
- Thermal Management: Heat dissipation analysis and cooling solutions
- EMI/EMC Guidelines: Electromagnetic compatibility design practices
Software Development Resources
- ISE Design Suite: Complete FPGA development environment documentation
- Synthesis Optimization: XST synthesis guidelines for Virtex-E architecture
- Place and Route: Implementation flow optimization techniques
- Timing Closure: Static timing analysis and constraint methodology
- Debug and Verification: ChipScope Pro and simulation methodologies
Multimedia Resources
- Video Tutorials: Design flow and implementation video guides
- Webinar Recordings: Technical presentations and application discussions
- Interactive Demos: Online demonstrations of key features
- Technical Papers: Published research and case studies
Related Resources
Development and Prototyping Platforms
- XCV2000E-6FG1156C Evaluation Boards: Complete development systems
- Prototyping Kits: Rapid prototyping platforms with I/O expansion
- Reference Designs: Proven implementations for common applications
- Demo Platforms: Application-specific demonstration boards
Programming and Configuration Tools
- JTAG Programming Solutions: Platform Cable USB II, Parallel Cable IV
- Configuration Memory: Compatible PROM, Flash, and SystemACE CF solutions
- In-System Programming: SelectMAP, JTAG, and slave serial interfaces
- Debug Tools: Hardware debugging and real-time analysis equipment
Ecosystem Components
- Power Management Solutions: Multi-rail voltage regulators for Virtex-E
- Clock Generation: Low-jitter oscillators and clock synthesis ICs
- Interface Components: Level translators, buffers, and signal conditioning
- Memory Interfaces: DDR, QDR, RLDRAM, and high-speed SRAM controllers
Design Services and Support
- Application Engineering: Expert technical consultation and design review
- Training and Education: Comprehensive FPGA design methodology courses
- IP Portfolio: Verified intellectual property cores and functions
- Consulting Network: Authorized third-party design service providers
- Technical Support: Online support portal and direct engineering assistance
Software Tools and IP
- Core Generator System: Pre-verified IP core library
- Partner IP Solutions: Third-party intellectual property marketplace
- System Generator: MATLAB/Simulink integration for DSP design
- Embedded Development Kit: Soft processor development tools
Environmental & Export Classifications
Environmental Standards Compliance
- RoHS Directive: Lead-free manufacturing with compliant materials
- REACH Regulation: Full compliance with European chemical safety standards
- Halogen-Free: Available in halogen-free package variants
- Green Manufacturing: Environmentally sustainable production processes
- WEEE Compliance: Electronic waste directive compliance
Commercial Operating Environment
- Operating Temperature: 0°C to +85°C (Commercial grade C specification)
- Junction Temperature: 125°C maximum
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 85% non-condensing
- Altitude: Up to 2000 meters operational
Thermal Characteristics
- Thermal Resistance (θJA): 18°C/W (with airflow), 25°C/W (still air)
- Thermal Resistance (θJC): 0.8°C/W junction-to-case
- Power Dissipation: Up to 15W typical, 25W maximum
- Thermal Management: Heat sink and fan cooling recommended for high-power applications
Reliability and Quality Metrics
- Mean Time Between Failures (MTBF): >1,000,000 hours at 25°C
- Quality Level: Commercial grade with standard reliability
- Defect Rate: <100 DPPM (Defective Parts Per Million)
- Qualification Standards: JEDEC and industry-standard testing
Electrostatic Discharge Protection
- ESD Classification: Class 1C (>2000V Human Body Model)
- Charged Device Model: >500V CDM
- Machine Model: >200V MM
- Latch-up Immunity: >100mA at maximum operating temperature
Export Control and Trade Information
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): 8542.31.0000
- Country of Origin: Manufacturing location varies by production lot
- Export License Requirements: May require export authorization for certain countries
- ITAR Status: Not subject to International Traffic in Arms Regulations
Safety and Regulatory Certifications
- UL Recognition: UL 1998 recognized component
- CE Marking: European Conformity declaration
- FCC Part 15: Unintentional radiator compliance
- VCCI Class B: Japanese electromagnetic compatibility standard
- KC Mark: Korean electromagnetic compatibility certification
Package Handling and Storage
- Moisture Sensitivity Level: MSL 3 (168 hours at 30°C/60% RH)
- Bake-out Requirements: 24 hours at 125°C if moisture limit exceeded
- ESD Handling: Requires proper electrostatic discharge precautions
- Package Marking: Laser engraved with part number, date code, and lot traceability
- Storage Conditions: Dry, temperature-controlled environment recommended
Product Lifecycle Information
- Product Status: Active production with long-term availability commitment
- Design Life: 20+ years operational life expectancy
- Technology Migration: Clear upgrade path to newer device families
- Obsolescence Policy: Minimum 12-month end-of-life notification
Key Application Markets
The XCV2000E-6FG1156C serves diverse commercial markets:
Telecommunications Infrastructure
- Network Processing: High-capacity routers and switches
- Protocol Processing: Advanced networking protocol implementations
- Optical Networking: SONET/SDH and WDM system processing
- Wireless Infrastructure: Base station digital signal processing
Computing and Data Processing
- Server Acceleration: Computational offloading and co-processing
- Storage Systems: RAID controllers and data compression engines
- Database Acceleration: SQL query processing and analytics
- High-Performance Computing: Parallel processing algorithms
Test and Measurement Equipment
- Signal Analysis: Real-time spectrum analysis and protocol decoding
- Signal Generation: Arbitrary waveform and pattern generation
- Automated Test Equipment: Multi-channel testing and measurement
- Laboratory Instrumentation: Precision measurement and control systems
Industrial and Commercial Electronics
- Medical Imaging: CT, MRI, and ultrasound signal processing
- Broadcast Equipment: Video processing and format conversion
- Audio Processing: Digital audio workstations and effects processors
- Security Systems: Video analytics and pattern recognition
Technical Advantages of XCV2000E-6FG1156C
Maximum I/O Density
- 804 User I/O Pins: Industry-leading I/O count in FG1156 package
- Flexible I/O Configuration: Support for multiple voltage standards simultaneously
- Differential Pair Support: Up to 402 differential pairs for high-speed interfaces
- Signal Integrity: Optimized package design for high-frequency applications
Commercial-Grade Benefits
- Cost-Effective: Commercial temperature grade provides optimal price-performance
- Standard Environment: Suitable for most commercial and office environments
- High Volume Production: Designed for large-scale commercial deployment
- Extended Lifecycle: Long-term availability for commercial product lifecycles
Design Implementation Advantages
- Mature Tool Chain: Comprehensive development environment with proven methodologies
- Extensive IP Portfolio: Large library of verified intellectual property cores
- Silicon Proven: Field-tested reliability in thousands of commercial applications
- Migration Path: Clear upgrade options within Xilinx device families
Conclusion
The XCV2000E-6FG1156C represents the pinnacle of commercial-grade FPGA technology, combining maximum logic capacity with exceptional I/O density in a cost-effective commercial temperature grade package. With 804 user I/O pins, 2 million system gates, and comprehensive development support, this Virtex-E device enables engineers to implement the most demanding commercial digital systems with confidence, performance, and economic efficiency.
For detailed technical specifications, current pricing, comprehensive documentation, and expert technical support for the XCV2000E-6FG1156C, contact authorized Xilinx distributors or visit the official Xilinx technical resource center.
