The XCV200-6BGG352C is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex series, designed to deliver exceptional performance for demanding digital signal processing and high-speed computing applications. This advanced programmable logic device combines robust functionality with flexible configuration options, making it an ideal choice for engineers developing complex electronic systems.
Product Specifications
The XCV200-6BGG352C features comprehensive technical specifications that showcase its advanced capabilities:
Core Architecture:
- Logic cells: 200,000 system gates equivalent
- Speed grade: -6 (high-performance variant)
- Package type: BGA (Ball Grid Array) 352-pin configuration
- Operating voltage: 2.5V core with 3.3V I/O compatibility
- Maximum operating frequency: Up to 200 MHz system clock
Memory and Storage:
- Block RAM: 56 Kbits of embedded memory
- Distributed RAM: Configurable from CLB resources
- Configuration memory: SRAM-based for fast reconfiguration
I/O Capabilities:
- Total I/O pins: 284 user-configurable pins
- I/O standards support: LVTTL, LVCMOS, GTL, SSTL, and differential signaling
- High-speed differential pairs for critical signal routing
Package Details:
- Form factor: 23mm x 23mm BGA package
- Pin pitch: 1.27mm for optimal PCB routing
- Operating temperature range: Commercial (0ยฐC to +85ยฐC)
Price Information
The XCV200-6BGG352C pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing tiers:
- Single unit pricing: Available upon request
- Volume discounts: Applied for quantities of 100+ units
- Educational pricing: Special rates available for academic institutions
- Long-term availability: Supported through Xilinx’s product lifecycle program
For the most competitive XCV200-6BGG352C pricing, we recommend obtaining quotes from multiple authorized distributors and considering factors such as lead time, support services, and warranty coverage.
Documents & Media
Comprehensive documentation supports successful XCV200-6BGG352C implementation:
Technical Documentation:
- Official datasheet with complete electrical specifications
- Pin configuration diagrams and package drawings
- Application notes for design optimization
- Timing analysis and constraint guidelines
Design Resources:
- FPGA development software compatibility guide
- Reference designs and example projects
- PCB layout recommendations and guidelines
- Thermal management specifications
Support Materials:
- Migration guides from previous Virtex generations
- Troubleshooting and debugging procedures
- Power consumption analysis tools
- Signal integrity design considerations
All XCV200-6BGG352C documentation is available through Xilinx’s official support portal and authorized distributor websites.
Related Resources
Engineers working with the XCV200-6BGG352C can leverage these additional resources:
Development Tools:
- Xilinx ISE Design Suite for FPGA development
- ModelSim simulation software compatibility
- ChipScope Pro for embedded logic analysis
- Third-party synthesis and place-and-route tools
Evaluation Platforms:
- Development boards featuring the XCV200-6BGG352C
- Reference evaluation kits with sample applications
- Prototyping solutions for rapid concept validation
Community Support:
- Xilinx community forums for technical discussions
- Application engineering support services
- Training courses and certification programs
- User group meetings and technical conferences
Compatible Products:
- Other Virtex series FPGAs for scalability options
- Complementary analog and mixed-signal components
- High-speed memory interfaces and controllers
Environmental & Export Classifications
The XCV200-6BGG352C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting for supply chain transparency
- ISO 14001 environmental management system certified manufacturing
Export Control Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Subject to Export Administration Regulations (EAR)
- Requires appropriate export licenses for certain destinations
- Dual-use technology restrictions may apply
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive qualification available (AEC-Q100)
- Military and aerospace screening options
- Extended temperature range variants available
Reliability Specifications:
- MTBF (Mean Time Between Failures): >1,000,000 hours
- Junction temperature rating: Up to 125ยฐC maximum
- Electrostatic discharge (ESD) protection: Class 1C compliance
- Moisture sensitivity level: MSL-3 classification
The XCV200-6BGG352C represents a proven solution for high-performance FPGA applications, combining advanced programmable logic capabilities with comprehensive support resources and regulatory compliance. Its robust architecture and extensive documentation make it an excellent choice for demanding digital design projects across industrial, communications, and computing applications.
