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XCV200-4FGG256I FPGA: High-Performance Programmable Logic Solution

Original price was: $20.00.Current price is: $19.00.

The XCV200-4FGG256I is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex series, designed to deliver exceptional performance for demanding digital design applications. This advanced programmable logic device combines high-speed processing capabilities with flexible configuration options, making it an ideal choice for telecommunications, industrial automation, and embedded system applications.

Product Specifications

The XCV200-4FGG256I features robust technical specifications that set it apart in the FPGA market:

Core Architecture:

  • System gates: 238,000 gates providing substantial logic capacity
  • Logic cells: 4,704 configurable logic blocks for complex digital functions
  • Block RAM: 28 dedicated memory blocks totaling 56 Kbits of embedded storage
  • Speed grade: -4 offering optimized performance for high-frequency applications

Package Details:

  • Package type: FGG256 (Fine-pitch Ball Grid Array)
  • Pin count: 256 pins in compact 17mm x 17mm footprint
  • Operating temperature: Industrial grade (-40ยฐC to +85ยฐC)
  • Voltage requirements: 2.5V core with 3.3V I/O compatibility

Performance Characteristics:

  • Maximum system frequency up to 200 MHz
  • Low power consumption design
  • Advanced routing architecture for efficient signal management
  • Support for multiple I/O standards including LVTTL, LVCMOS, and PCI

Price Information

Pricing for the XCV200-4FGG256I varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, making this FPGA cost-effective for both prototyping and mass production applications.

Documents & Media

Technical Documentation:

  • Complete datasheet with electrical specifications and timing parameters
  • User guide covering configuration and programming procedures
  • Application notes demonstrating common implementation scenarios
  • IBIS models for signal integrity analysis
  • Package drawings and mechanical specifications

Development Resources:

  • Reference designs and example projects
  • ISE Design Suite compatibility information
  • Constraint files and UCF templates
  • Simulation models for popular EDA tools

Related Resources

Development Tools:

  • Xilinx ISE WebPACK (free development environment)
  • ModelSim simulation software compatibility
  • ChipScope Pro for real-time debugging
  • Impact programming and configuration tools

Complementary Products:

  • XCV100 and XCV300 series for different capacity requirements
  • Spartan series FPGAs for cost-optimized applications
  • Configuration memory devices and programming cables
  • Evaluation boards and development kits

Technical Support:

  • Online forums and community resources
  • Application engineering support
  • Training courses and webinars
  • Migration guides from legacy devices

Environmental & Export Classifications

Environmental Compliance:

  • RoHS compliant lead-free package options available
  • REACH regulation compliance for European markets
  • Halogen-free variants for environmentally sensitive applications
  • ISO 14001 certified manufacturing processes

Export Control Information:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • Country of origin: Various (check specific part marking)
  • Export licensing may be required for certain destinations
  • Dual-use technology classification applies

Quality Standards:

  • Automotive grade (AEC-Q100) versions available for automotive applications
  • Military temperature range options (-55ยฐC to +125ยฐC)
  • Extended lifecycle support for long-term projects
  • Comprehensive quality assurance and reliability testing

The XCV200-4FGG256I represents a proven solution for engineers requiring reliable, high-performance programmable logic. Its combination of substantial logic resources, industrial-grade reliability, and comprehensive development support makes it suitable for a wide range of applications from prototype development to volume production deployment.