Product Specifications
Core Architecture
- Device Family: Xilinx Virtex-E Series (Top-tier model)
- Logic Cells: 1,600,000 system gates
- Speed Grade: -6 (Premium high-performance grade)
- Package Type: FG900 (Fine-pitch Ball Grid Array)
- Temperature Grade: I (Industrial, -40ยฐC to +100ยฐC)
- Supply Voltage: 1.8V core, 3.3V/2.5V I/O compatible
- User I/O Pins: 804 configurable I/O pins
- Configuration: SRAM-based with multiple configuration modes
Advanced Features
- Block RAM: 294,912 bits total block RAM
- Distributed RAM: Extensive LUT-based memory resources
- Multipliers: 160 dedicated 18×18 multiplier blocks
- DLLs: 8 Digital Delay Locked Loops for clock management
- Global Clock Networks: 8 low-skew global clock buffers
- SelectRAM: Dual-port RAM capability
Performance Characteristics
- Maximum System Frequency: Up to 200+ MHz
- Propagation Delay: Sub-nanosecond routing delays
- Power Optimization: Advanced power management features
- Package Size: 31mm x 31mm BGA footprint
- Pin Pitch: 1.0mm ball pitch for high-density routing
Price
The XCV1600E-6FG900I represents premium FPGA technology with pricing reflecting its advanced capabilities and industrial qualification. Contact authorized Xilinx distributors for current pricing and availability. Volume pricing tiers are available for quantities of 25+, 100+, and 500+ units. Extended temperature testing and industrial qualification contribute to the premium positioning of this device.
Documents & Media
Comprehensive Technical Documentation
- Complete Datasheet: Detailed electrical characteristics and AC/DC specifications
- Architecture Overview: Logic block and routing resource descriptions
- Packaging Information: Mechanical drawings and thermal characteristics
- Configuration Guide: Multi-mode configuration implementation details
- Power Analysis Guidelines: Dynamic and static power consumption data
Design Implementation Resources
- HDL Templates: Verilog and VHDL code examples optimized for XCV1600E-6FG900I
- Constraint Templates: Comprehensive UCF and SDC timing constraints
- PCB Design Guidelines: High-speed layout recommendations and via strategies
- Thermal Management: Heat sink selection and thermal interface materials
- Signal Integrity Guidelines: Impedance control and termination strategies
Verification and Testing
- Characterization Reports: Performance across temperature and voltage ranges
- Quality Assurance Data: Industrial qualification test results
- IBIS Models: Signal integrity simulation models
- Timing Models: SDF files for accurate timing simulation
Related Resources
Development Ecosystem
- Xilinx ISE WebPACK/Foundation: Complete integrated development environment
- Xilinx Platform Studio: Embedded system development tools
- ChipScope Pro: Advanced real-time verification and debugging
- System Generator: MATLAB/Simulink integration for DSP applications
Hardware Platforms
- Evaluation Boards: ML310 and custom development platforms
- Prototyping Systems: High-speed connector and peripheral interfaces
- Debug Accessories: JTAG boundary scan and configuration tools
- Socket Solutions: High-reliability test and prototyping sockets
Complementary Components
- Configuration Memory: Platform Flash XL PROMs and SPI Flash
- Power Management: Multi-rail power supply solutions optimized for Virtex-E
- Clock Generation: Ultra-low jitter PLLs and clock distribution networks
- High-Speed I/O: LVDS, HSTL, and differential signaling components
Professional Services
- Design Consulting: Expert FPGA implementation services
- IP Cores: Pre-verified intellectual property blocks
- Training Programs: Advanced FPGA design methodology courses
- Technical Support: Priority industrial-grade technical assistance
Environmental & Export Classifications
Industrial Environmental Specifications
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial I-grade)
- Junction Temperature: Up to +125ยฐC maximum
- Storage Temperature: -65ยฐC to +150ยฐC
- Thermal Resistance: ฮธJA = 16ยฐC/W (with proper heat sinking)
- Humidity Tolerance: 85% RH non-condensing across temperature range
Regulatory Compliance
- RoHS Directive: Fully compliant lead-free package construction
- REACH Regulation: Complete substance disclosure and compliance
- WEEE Directive: Environmentally conscious disposal guidelines
- Conflict Minerals: Responsible sourcing certification
- Green Package: Halogen-free and environmentally sustainable materials
Export Control Classifications
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized System Code: 8542.33.0001
- Bureau of Industry and Security: EAR99 classification with restrictions
- International Traffic in Arms: Not ITAR controlled
- Dual-Use Technology: Export license requirements for specific destinations
Quality and Reliability Standards
- Industrial Qualification: Full AEC-Q100 equivalent testing
- Reliability Standards: MIL-STD-883 method compatibility
- Quality Management: ISO 9001:2015 certified manufacturing
- Statistical Quality Control: Six Sigma manufacturing processes
- Failure Rate: <10 FIT (Failures in Time) at 55ยฐC operation
Packaging and Materials
- Lead Frame: Copper alloy with gold-plated balls
- Substrate Material: High-performance organic substrate
- Encapsulation: Advanced epoxy molding compound
- Ball Composition: SAC305 lead-free solder (96.5% Sn, 3% Ag, 0.5% Cu)
- Moisture Sensitivity: MSL-3 (168 hours at 30ยฐC/60% RH)
The XCV1600E-6FG900I stands as the pinnacle of Xilinx’s Virtex-E series, combining maximum logic density with industrial-grade reliability for mission-critical applications. Its comprehensive development ecosystem, extensive documentation, and proven track record make it the optimal choice for demanding industrial, aerospace, and telecommunications applications requiring the highest levels of performance and reliability.
