Product Specifications
Core Architecture Features
- Device Family: Xilinx Virtex-E Series (High-density variant)
- Logic Capacity: 1,600,000 system gates
- Speed Grade: -6 (High-performance timing grade)
- Package Type: FG680 (Fine-pitch Ball Grid Array)
- Temperature Grade: C (Commercial, 0°C to +85°C)
- Core Voltage: 1.8V with multiple I/O voltage support
- I/O Standards: 3.3V, 2.5V, 1.8V, and differential signaling
- User I/O Pins: 512 configurable I/O pins
Advanced Processing Capabilities
- Configurable Logic Blocks (CLBs): 19,200 logic cells
- Block SelectRAM: 294,912 bits of dual-port block RAM
- Distributed RAM: Flexible LUT-based memory implementation
- Dedicated Multipliers: 160 embedded 18×18 multiplier blocks
- Digital Clock Managers: 8 DLLs for precision clock control
- Global Routing: Low-skew clock distribution network
Package and Performance Specifications
- Package Dimensions: 27mm x 27mm BGA footprint
- Ball Pitch: 1.0mm for high-density PCB routing
- Maximum Operating Frequency: Up to 200 MHz system performance
- Configuration Time: Fast SRAM-based reconfiguration
- Power Consumption: Optimized for commercial applications
- Thermal Characteristics: θJA = 19°C/W (natural convection)
Price
The XCV1600E-6FG680C offers premium FPGA performance at competitive commercial pricing. Current pricing varies by quantity and market conditions. Contact authorized Xilinx distributors for real-time pricing and availability information. Volume discounts are available for purchases of 25+ units, with additional pricing tiers at 100+ and 500+ quantities. Standard lead times range from 12-16 weeks depending on demand.
Documents & Media
Technical Documentation Suite
- Product Datasheet: Complete electrical specifications and timing parameters
- Architecture Manual: Detailed logic block and interconnect descriptions
- Package Specifications: Mechanical drawings and thermal management data
- Configuration Guidelines: Multiple configuration mode implementations
- Power Management Guide: Supply sequencing and decoupling recommendations
Design Implementation Resources
- Reference Designs: Optimized implementation examples for common applications
- HDL Code Templates: Pre-verified Verilog and VHDL design patterns
- Timing Constraints: UCF and SDC constraint file templates
- PCB Layout Guidelines: High-speed design rules and layer stack recommendations
- Simulation Models: Comprehensive timing and functional models
Application-Specific Documentation
- DSP Implementation Guide: Digital signal processing optimization techniques
- High-Speed Interface Design: LVDS, HSTL, and GTL implementation guidelines
- Memory Interface Design: DDR, QDR, and SRAM controller implementations
- Clock Domain Crossing: Best practices for multi-clock designs
- Power Optimization Techniques: Dynamic and static power reduction strategies
Related Resources
Development Tools and Software
- Xilinx ISE Design Suite: Complete FPGA development environment
- WebPACK Edition: Free development tools for XCV1600E-6FG680C
- ChipScope Pro Analyzer: Real-time signal analysis and debugging
- System Generator: MATLAB/Simulink-based DSP design flow
- PlanAhead: Advanced floorplanning and implementation tools
Hardware Development Platforms
- ML310 Development Board: Full-featured evaluation platform
- Custom Evaluation Boards: Application-specific development hardware
- Programming Cables: JTAG configuration and debugging interfaces
- Socket Solutions: Prototyping and testing socket assemblies
IP Core Library
- DSP IP Cores: FIR filters, FFTs, and digital up/down converters
- Interface Controllers: PCI, Ethernet, and memory controllers
- Communication Protocols: UART, SPI, I2C, and custom protocols
- Video Processing: Image processing and video codec implementations
- Cryptographic Cores: AES, DES, and hash function implementations
Technical Support Resources
- Application Engineers: Direct technical support and consultation
- Online Forums: Community-driven troubleshooting and best practices
- Training Materials: Comprehensive FPGA design courses and webinars
- Knowledge Base: Searchable database of solutions and FAQs
- Third-Party Services: Certified design service partners
Environmental & Export Classifications
Commercial Environmental Specifications
- Operating Temperature Range: 0°C to +85°C (Commercial C-grade)
- Junction Temperature: Maximum +125°C with proper thermal management
- Storage Temperature: -65°C to +150°C for long-term storage
- Relative Humidity: 85% RH non-condensing operational limit
- Thermal Cycling: 1000+ cycles per JEDEC JESD22-A104 standard
Environmental Compliance Standards
- RoHS Compliance: Lead-free package construction and materials
- REACH Regulation: Full chemical substance disclosure and compliance
- WEEE Directive: Environmentally responsible disposal guidelines
- Green Package Initiative: Halogen-free and recyclable materials
- Carbon Footprint: ISO 14040 lifecycle assessment available
Export Control Classifications
- Export Administration Regulations (EAR): ECCN 3A001.a.7 classification
- Harmonized Tariff Schedule: 8542.33.0001 commodity code
- Bureau of Industry and Security: Standard EAR99 export requirements
- International Traffic in Arms Regulations: Not ITAR controlled
- Wassenaar Arrangement: Dual-use technology export considerations
Quality and Manufacturing Standards
- ISO 9001:2015: Quality management system certification
- AS9100: Aerospace quality standard compliance available
- Six Sigma Manufacturing: Statistical process control implementation
- Reliability Testing: HTOL, HTDR, THB, and autoclave qualification
- Failure Rate: <5 FIT at 55°C junction temperature operation
Package Materials and Construction
- Substrate Technology: Advanced organic build-up substrate
- Solder Ball Composition: SAC305 lead-free alloy (Sn96.5/Ag3.0/Cu0.5)
- Die Attach: Silver-filled epoxy for optimal thermal conductivity
- Wire Bonding: Gold wire bonds for superior reliability
- Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020
Global Manufacturing and Distribution
- Manufacturing Locations: ISO-certified facilities in Asia and North America
- Supply Chain Management: Responsible sourcing and conflict-free materials
- Global Distribution: Worldwide availability through authorized channels
- Logistics Support: Express shipping and inventory management services
- Regional Support: Local technical support in major markets
The XCV1600E-6FG680C represents an optimal solution for commercial applications requiring high logic density, superior performance, and reliable operation. Its comprehensive development ecosystem, extensive IP library, and proven commercial reliability make it an excellent choice for demanding telecommunications, data processing, and digital signal processing applications where cost-effectiveness and performance are equally important.
