1. Product Specifications
Core Features
- Part Number: XCV1600E-6BG560C
- Manufacturer: AMD (formerly Xilinx Inc.)
- Product Family: Virtex-E 1.8V FPGAs
- Logic Cells: 419,904K Gates / 34,992 Cells
- Operating Voltage: 1.8V
- Technology Node: 0.18μm CMOS process
- Speed Grade: -6 (Commercial temperature range)
Package Details
- Package Type: 560-MBGA (Metal Ball Grid Array)
- Total I/O Pins: 404 user I/O
- Pin Count: 560 pins
- Temperature Range: Commercial (0°C to +85°C)
- Package Size: Compact BGA560 footprint
Performance Specifications
- Maximum Operating Frequency: Up to 357MHz
- Logic Architecture: 6-layer metal interconnect
- Configuration Memory: On-chip SRAM-based
- Power Consumption: Optimized for 1.8V operation
- ESD Protection: Industry-standard HBM and CDM ratings
Key Technical Features
- High-speed programmable logic solution
- Enhanced place-and-route efficiency
- Rich hierarchy of flexible interconnect resources
- Advanced system-level features
- Compatible with Xilinx ISE Design Suite
- RoHS compliant design
2. Pricing Information
Current Market Pricing (2025)
The XCV1600E-6BG560C is available through authorized distributors and electronic component suppliers worldwide. Pricing varies based on quantity, lead time, and supplier:
- Small Quantity (1-9 units): Contact for quote
- Medium Volume (10-99 units): Competitive volume pricing available
- Large Volume (100+ units): Significant discounts for bulk orders
- Lead Time: Typically 2-12 weeks depending on availability
Authorized Distributors
- IC-Components
- Xilinx-ADM
- ZKXG Electronics
- Ariat Technology
- FPGAkey
- And other certified electronic component distributors
Note: Prices subject to change based on market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: Virtex-E 1.8V FPGAs Complete Specification (DS022)
- Pin Configuration Guide: BG560 package pinout diagrams
- PCB Layout Guidelines: Recommended footprint and routing specifications
- Power and Thermal Guidelines: Thermal management recommendations
- Configuration User Guide: Programming and configuration procedures
Design Resources
- Reference Designs: Sample implementation projects
- Application Notes: Best practices for Virtex-E implementation
- Constraint Files: UCF templates for common applications
- Simulation Models: VHDL/Verilog behavioral models
- Development Board Schematics: Compatible evaluation platforms
Software Tools
- Xilinx ISE Design Suite: Primary development environment
- Vivado Design Suite: Modern design flow support
- ChipScope Pro: On-chip debugging and analysis
- EDK: Embedded development kit compatibility
4. Related Resources
Compatible Development Platforms
- Virtex-E Evaluation Boards: Official development platforms
- Third-party Development Kits: Various vendor solutions
- Prototyping Boards: For proof-of-concept designs
- Educational Platforms: University and training boards
Alternative Part Numbers
- XCV1600E-6BG560I: Industrial temperature variant
- XCV1600E-7BG560C: Higher speed grade option
- XCV1600E-6FG680C: Alternative package configuration
- XCV1600E-6FG860C: Larger package with more I/O
Application Areas
- Telecommunications: High-speed data processing and protocol implementation
- Aerospace & Defense: Mission-critical systems and signal processing
- Industrial Automation: Real-time control and monitoring systems
- Medical Equipment: High-reliability diagnostic and imaging systems
- Research & Development: Prototype development and algorithm validation
Design Support
- Technical Support: AMD Xilinx customer support portal
- Community Forums: User community and knowledge base
- Training Resources: Online tutorials and certification programs
- Design Services: Professional consulting and implementation services
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with EU RoHS Directive 2011/65/EU
- REACH Regulation: Compliant with EU REACH requirements
- Conflict Minerals: Compliant with Dodd-Frank Act Section 1502
- Green Product: Meets environmental sustainability standards
- Lead-Free: Compatible with lead-free soldering processes
Operating Environment
- Operating Temperature: 0°C to +85°C (Commercial grade)
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Vibration Resistance: MIL-STD-883 compliant
- Shock Resistance: Industry standard ratings
Export Control Information
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): 8542.31.0000
- Country of Origin: Various (check specific lot codes)
- Export Restrictions: Subject to U.S. export administration regulations
- License Requirements: May require export license for certain destinations
Quality & Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: Comprehensive qualification per JEDEC standards
- Failure Rate: Demonstrated high reliability in field applications
- Warranty: Standard manufacturer warranty terms apply
- Traceability: Full supply chain traceability available
Packaging & Shipping
- Anti-Static Protection: ESD-safe packaging and handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rated
- Shelf Life: Extended storage capability with proper handling
- Transportation: Compliant with international shipping regulations
Why Choose XCV1600E-6BG560C?
The XCV1600E-6BG560C combines high-performance processing capabilities with exceptional flexibility, making it the optimal choice for engineers developing next-generation digital systems. Its proven Virtex-E architecture, comprehensive development tool support, and robust supply chain make it a reliable foundation for both prototype development and volume production.
For technical specifications, pricing quotes, or application support, contact your local authorized AMD Xilinx distributor or visit the official AMD technical documentation portal.
Keywords: XCV1600E-6BG560C, Xilinx Virtex-E FPGA, 560-MBGA package, programmable logic, 1.8V FPGA, high-performance FPGA, AMD Xilinx, electronic components, field programmable gate array
