1. Product Specifications
Core Features
- Part Number: XCV100E-7PQG240I
- Manufacturer: AMD (formerly Xilinx Inc.)
- Product Family: Virtex-E 1.8V FPGAs
- Logic Capacity: 32.4K System Gates / 2,700 Logic Cells
- Operating Voltage: 1.8V ± 5% (1.71V – 1.89V)
- Technology Node: 0.18μm CMOS process
- Speed Grade: -7 (Standard performance grade)
- Temperature Grade: Industrial (-40°C to +100°C junction temperature)
Package Specifications
- Package Type: 240-Pin PQG (Plastic Quad Flat Pack with Gull-wing leads)
- Package Dimensions: 32mm x 32mm nominal
- Total I/O Pins: 158 user I/O
- Pin Pitch: 0.5mm
- Lead Configuration: Gull-wing surface mount
- Package Height: Low-profile design for space-constrained applications
Performance Characteristics
- Maximum Internal Frequency: Up to 400MHz
- System Performance: 130MHz (four LUT levels)
- Propagation Delay: Optimized for speed grade -7
- Configuration Method: SRAM-based, volatile configuration
- Power Consumption: Low-power 1.8V operation
- Junction Temperature Range: -40°C to +100°C (Industrial)
Architecture Details
- Configurable Logic Blocks (CLBs): 600 CLBs
- Logic Elements: 2,700 programmable cells
- Look-Up Tables (LUTs): 4-input LUTs per logic cell
- Total RAM Bits: 81,920 bits distributed and block RAM
- Clock Management: Dedicated delay-locked loops (DLLs)
- Interconnect Architecture: 6-layer metal hierarchical routing
- SelectIO+ Technology: Multi-standard I/O interface support
Key Technical Features
- Industrial Temperature Operation: Reliable performance from -40°C to +100°C
- PCI Compliance: 33/66MHz PCI compatible interfaces
- Hot-Swappable Design: CompactPCI compatible for critical systems
- Multi-Standard I/O: Support for 16+ industry-standard interfaces
- Dedicated Arithmetic Logic: High-speed carry chains for DSP applications
- Advanced Clock Distribution: Low-skew global and regional clock networks
- Configuration Flexibility: Multiple configuration modes and interfaces
2. Pricing Information
Current Market Pricing (2025)
The XCV100E-7PQG240I is available through authorized distributors and specialized electronic component suppliers. As an industrial-grade FPGA with extended temperature capabilities, pricing reflects the premium quality and reliability:
- Sample Quantities (1-9 units): Premium pricing for low-volume requirements
- Small Production (10-99 units): Volume discounts available
- Production Volumes (100+ units): Competitive bulk pricing for qualified applications
- Extended Lead Times: 4-20 weeks depending on global inventory levels
Authorized Distribution Partners
- Xilinx-ADM: Specialized Xilinx distributor with 2,870 pcs stock available
- IC-Components: Global electronic component distributor with 1,874 pcs stock available
- DigiPart: Real-time pricing and inventory aggregation platform
- World IC Stock: International distributor with FOB pricing USD 0.1-1000.0/Piece
- FPGAkey: Specialized FPGA component marketplace
- Additional Distributors: Multiple certified suppliers across global markets
Market Considerations
- Industrial Grade Premium: Higher pricing compared to commercial temperature variants
- Legacy Product Status: Limited production runs with potential supply constraints
- Regional Availability: Stock levels vary significantly by geographic market
- Alternative Recommendations: Distributors may suggest newer industrial-grade FPGAs
- Long-term Availability: Consider lifecycle planning for new design implementations
Note: The XCV100E-7PQG240I represents mature FPGA technology. For new designs requiring industrial temperature operation, consult with AMD Xilinx for current recommended alternatives with enhanced features and longer lifecycle support.
3. Documents & Media
Primary Technical Documentation
- Official Datasheet: Virtex-E 1.8V FPGAs Complete Specification (DS022)
- Package Specification: PQG240 mechanical drawings and thermal characteristics
- Pin Assignment Guide: Complete pinout with signal descriptions and electrical specifications
- Industrial Temperature Guidelines: Extended temperature operation and derating curves
- Electrical Characteristics: DC/AC parameters across full temperature range
Design Implementation Resources
- User Constraints File (UCF): Pre-validated constraint templates for PQG240 package
- Reference Designs: Sample implementations demonstrating best practices
- Application Notes: Industrial temperature design considerations and guidelines
- PCB Layout Guidelines: High-reliability board design recommendations
- Thermal Management Guide: Heat dissipation and thermal design recommendations
Development Tools Documentation
- ISE Design Suite Manual: Complete development environment documentation
- Industrial Design Guidelines: Temperature-aware design and verification methodologies
- Simulation Models: VHDL/Verilog models with temperature compensation
- Timing Analysis Guide: Industrial temperature timing closure techniques
- Power Analysis Tools: Thermal-aware power estimation and optimization
Quality & Reliability Documentation
- Industrial Qualification Report: Temperature cycling and reliability test results
- MTBF Analysis: Mean time between failures for industrial environments
- Stress Testing Data: Accelerated life testing and failure analysis
- Quality Management: ISO 9001 manufacturing process documentation
- Traceability Documentation: Component tracking and lot identification procedures
4. Related Resources
Development Platforms & Tools
- Virtex-E Evaluation Boards: Industrial-grade development platforms
- Temperature Characterization Kits: Thermal testing and validation tools
- In-Circuit Debuggers: ChipScope Pro for real-time industrial system debugging
- Third-Party Platforms: Compatible industrial development ecosystems
- Custom Development Services: Professional industrial FPGA design support
Compatible Product Variants
- XCV100E-6PQG240I: Lower speed grade industrial variant (-6)
- XCV100E-8PQG240I: Higher speed grade industrial option (-8)
- XCV100E-7PQG240C: Commercial temperature equivalent (0°C to +85°C)
- XCV100E-7FG256I: Alternative 256-pin package with more I/O
- XCV200E-7PQG240I: Higher capacity device in same package and temperature grade
Industrial Application Domains
- Automotive Electronics: Engine control, transmission systems, safety-critical applications
- Military & Aerospace: Avionics, radar systems, missile guidance, satellite communications
- Industrial Automation: Process control, manufacturing equipment, robotics
- Energy & Utilities: Power grid management, renewable energy systems, smart meters
- Transportation: Railway signaling, marine navigation, heavy equipment control
- Medical Equipment: Industrial-grade diagnostic and life support systems
Design Migration & Alternatives
- Current AMD Xilinx Families: Modern industrial-grade FPGAs with enhanced features
- Zynq UltraScale+: SoC alternatives for complex industrial applications
- Kintex UltraScale+: Mid-range alternatives with superior power efficiency
- Spartan-7: Cost-optimized alternatives for price-sensitive industrial applications
- Migration Services: Professional design porting and optimization support
Technical Support Ecosystem
- Industrial Design Centers: Specialized support for harsh environment applications
- Temperature Testing Services: Thermal characterization and validation
- Reliability Engineering: Industrial qualification and certification support
- Regional Technical Support: Local expertise for industrial market requirements
- Training Programs: Industrial FPGA design courses and certification
5. Environmental & Export Classifications
Environmental Compliance & Standards
- RoHS Compliance: Fully compliant with EU RoHS Directive 2011/65/EU
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Full compliance with Dodd-Frank Act Section 1502
- Industrial Environmental Rating: Qualified for harsh environment operation
- Lead-Free Manufacturing: Compatible with lead-free soldering processes
- Green Product Classification: Environmentally sustainable design
Industrial Operating Conditions
- Junction Temperature Range: -40°C to +100°C (Industrial grade)
- Ambient Temperature Operation: Depends on thermal design and power dissipation
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing operational
- Altitude Operation: Up to 3000 meters above sea level
- Vibration Resistance: MIL-STD-883 Method 2007 compliant
Reliability & Quality Standards
- Manufacturing Quality: ISO 9001:2015 certified production facilities
- Industrial Qualification: Extended temperature qualification per JEDEC standards
- Reliability Testing: Accelerated life testing at industrial temperature extremes
- Quality Assurance Level: Industrial-grade screening and testing
- Mean Time Between Failures: High reliability in demanding environments
- Warranty Terms: Standard industrial component warranty coverage
Export Control & Trade Compliance
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): 8542.31.0000
- Country of Origin: Varies by manufacturing facility (check specific lot codes)
- Export Administration Regulations: Subject to U.S. EAR requirements
- License Requirements: May require export authorization for sensitive applications
- Dual-Use Technology: Subject to technology transfer restrictions
- End-Use Monitoring: Enhanced oversight for military and aerospace applications
Industrial Packaging & Handling
- Moisture Sensitivity Level (MSL): Rated per JEDEC J-STD-020 standard
- ESD Protection: Enhanced anti-static protection for industrial environments
- Industrial Packaging: Robust packaging designed for harsh shipping conditions
- Shelf Life: Extended storage capability under controlled conditions
- Traceability Requirements: Enhanced lot tracking for industrial applications
- Incoming Inspection: Industrial-grade quality control procedures
Sustainability & Environmental Impact
- Carbon Footprint: Optimized manufacturing for reduced environmental impact
- Lifecycle Assessment: Comprehensive environmental impact analysis
- Recycling Programs: End-of-life component recovery and recycling
- Sustainable Manufacturing: Environmentally responsible production practices
- Supply Chain Responsibility: Verified sustainable supplier network
- Energy Efficiency: Low-power design for reduced operational environmental impact
Industrial Design Considerations
Thermal Management for Industrial Applications
The XCV100E-7PQG240I is designed for operation across the full industrial temperature range, but proper thermal design is critical for reliable operation. Key considerations include:
- Thermal Derating: Power consumption must be derated at elevated temperatures
- Heat Sink Requirements: Adequate thermal management for high-power applications
- Airflow Design: Convective cooling strategies for enclosed industrial systems
- Thermal Monitoring: On-chip temperature sensing and protection circuits
Power System Design
Industrial applications often require robust power supply design to handle temperature variations and electrical noise:
- Supply Voltage Tolerance: 1.8V ± 5% across full temperature range
- Power Supply Filtering: Enhanced filtering for industrial electromagnetic environments
- Inrush Current: Consider startup current requirements in cold temperature conditions
- Power Sequencing: Proper power-up/power-down sequences for reliable operation
Signal Integrity in Industrial Environments
The XCV100E-7PQG240I’s SelectIO+ technology provides robust I/O capabilities for challenging industrial environments:
- EMI/EMC Compliance: Design for electromagnetic compatibility requirements
- Signal Conditioning: Input protection and signal conditioning for harsh environments
- Isolation Requirements: Galvanic isolation for safety-critical applications
- Connector Selection: Industrial-grade connectors rated for temperature extremes
Why Choose XCV100E-7PQG240I?
The XCV100E-7PQG240I represents a proven solution for industrial applications requiring reliable FPGA performance across extended temperature ranges. With 32,400 gates, 2,700 cells, and 400MHz performance capability in a 158 I/O PQFP240 package, it delivers the perfect balance of functionality, reliability, and cost-effectiveness for demanding industrial environments.
Key advantages include industrial temperature qualification (-40°C to +100°C), mature and proven Virtex-E architecture, comprehensive development tool support, and established supply chain availability. The device’s robust design makes it suitable for automotive engine control, military avionics, industrial automation, and other mission-critical applications where reliability is paramount.
For applications requiring industrial temperature operation with moderate logic capacity, the XCV100E-7PQG240I continues to serve as a reliable foundation for embedded system designs that demand long-term availability and proven field performance.
For current availability, industrial qualification documentation, or application support, contact your authorized AMD Xilinx distributor or visit the official AMD technical documentation portal.
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