1. Product Specifications
Core Architecture
- Family: Xilinx Virtex-E 1.8V Field Programmable Gate Arrays
- Part Number: XCV100E-6FG256C
- Speed Grade: -6 (commercial performance tier)
- Logic Elements: 2700 logic cells/elements
- Temperature Grade: Commercial (C) – 0ยฐC to +85ยฐC operation
Package & Physical Characteristics
- Package Type: 256-Pin Fine-Pitch Ball Grid Array (FBGA)
- Package Description: FBGA-256 with optimized footprint
- Pin Count: 256 pins for high-density connectivity
- I/O Count: 176 user I/O pins
- Mounting Type: Surface Mount Technology (SMT)
Electrical Specifications
- Supply Voltage: 1.8V nominal operation
- Total RAM: 81,920 bits embedded memory
- CLBs (Configurable Logic Blocks): 600 CLBs for flexible logic implementation
- System Gates: Approximately 100,000 equivalent system gates
- Maximum Operating Frequency: High-speed operation for demanding applications
Performance Characteristics
- Technology Node: Advanced 0.18ฮผm CMOS process with 6-layer metal
- Operating Temperature: 0ยฐC to +85ยฐC (commercial grade)
- Power Consumption: Optimized for 1.8V low-power operation
- Architecture: Place-and-route optimized for silicon efficiency
- Memory Architecture: SelectRAM+ embedded memory blocks
Advanced Features
- SelectI/O+ Technology: Multiple I/O standard support
- 6-Layer Metal Process: Enhanced routing density and performance
- PCI Compliance: 33/66 MHz PCI interface compatibility
- Clock Management: Integrated clock distribution and management
- Fast Interconnect: Hierarchical routing resources for high performance
2. Pricing Information
Market Availability & Stock Status
The XCV100E-6FG256C maintains good availability through multiple distributors despite its legacy status. Current stock levels show over 2,600+ pieces available from major suppliers, ensuring availability for maintenance and replacement applications.
Pricing Structure
- Legacy Product Pricing: Competitive pricing for mature technology
- Volume Discounts: Bulk pricing available for quantities of 100+, 500+, and 1K+ units
- Quote-Based Pricing: Current market pricing requires RFQ due to legacy product status
- Stock Conditions: New original parts available with full traceability
Distribution Channels
- Authorized Distributors: Available through established Xilinx/AMD distribution network
- Specialty Suppliers: Legacy component specialists and independent distributors
- Broker Networks: Secondary market channels for obsolescence management
- Regional Availability: Global distribution with regional pricing variations
Commercial Considerations
- Lead Times: Typically 1-3 weeks for standard quantities from stock
- Payment Terms: Multiple options including TT, PayPal, Credit Cards, and Western Union
- Shipping Options: Express delivery via DHL, FedEx, UPS, TNT available globally
- Warranty: Standard distributor warranties ranging from 90 days to 1 year
Obsolescence Management
- Product Status: Marked as obsolete by original manufacturer
- Last-Time Buy: Consider volume purchases for long-term support requirements
- Alternative Sourcing: Multiple independent distributors maintain inventory
- Migration Options: Newer FPGA families available for design updates
3. Documents & Media
Official Documentation
- Primary Datasheet: Virtex-E FPGA Family Complete Data Sheet (DS022)
- Package Documentation: 256-Pin FBGA Package Specifications and Mechanical Drawings
- Migration Guides: Legacy design preservation and modernization pathways
- Application Notes: Implementation guidelines specific to Virtex-E architecture
Technical Reference Materials
- Pin Assignment: Comprehensive pinout diagrams and I/O planning resources
- Timing Specifications: Commercial grade timing analysis and constraint files
- Power Analysis: Thermal characteristics and power consumption models
- Signal Integrity: High-speed design considerations for FBGA packaging
Legacy Design Support
- Design Files: Historical reference designs and implementation examples
- Constraint Libraries: Legacy timing and placement constraint files
- IP Cores: Compatible intellectual property blocks for Virtex-E family
- Tool Support: Information on legacy development tool compatibility
Assembly & Manufacturing
- PCB Guidelines: Layout recommendations for FBGA mounting
- Thermal Management: Heat dissipation requirements and cooling strategies
- Soldering Profiles: Assembly guidelines for lead-containing and lead-free processes
- Testing Procedures: Functional verification and quality assurance protocols
Maintenance Documentation
- Failure Analysis: Common failure modes and diagnostic procedures
- Replacement Guidelines: Direct substitution and functional equivalent options
- Storage Requirements: Proper handling and long-term storage recommendations
- EOL Planning: End-of-life management and inventory planning strategies
4. Related Resources
Development Tools & Software
- Legacy Tool Support: Compatible with ISE Design Suite and Foundation Series tools
- Modern Tool Migration: Vivado Design Suite compatibility considerations
- IP Library: Virtex-E compatible intellectual property cores
- Simulation Tools: ModelSim and legacy simulation environment support
Replacement & Migration Options
- Direct Replacements: Pin-compatible alternatives within Virtex-E family
- Functional Equivalents: Similar performance options from current FPGA families
- Migration Pathways: Upgrade options to newer Xilinx/AMD FPGA architectures
- Design Porting: Services for modernizing legacy Virtex-E designs
Technical Support Ecosystem
- Legacy Support: Specialized engineering services for obsolete product support
- Documentation Archives: Historical design files and technical resources
- Community Forums: User groups and knowledge sharing for legacy systems
- Training Materials: Historical training content and application guides
Evaluation & Development
- Custom Boards: Third-party evaluation platforms supporting FBGA packages
- Socket Solutions: Programming and testing fixtures for development
- Prototype Services: PCB design and assembly for legacy component integration
- Programming Tools: Compatible configuration and programming hardware
Supply Chain Management
- Obsolescence Services: Lifetime buy and inventory management solutions
- Authentication: Component verification and counterfeit protection services
- Excess Inventory: Markets for surplus component trading and sourcing
- Forecasting Tools: Demand planning for legacy component requirements
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Compliance: Non-compliant – Contains lead and other restricted substances
- Legacy Environmental Standards: Manufactured to earlier environmental regulations
- Lead Content: Contains lead in solder finish and internal components
- REACH Compliance: Non-compliant with current European chemical safety regulations
Material Composition & Substances
- Pb-free Status: No – Contains lead above RoHS threshold limits
- Halogen Content: May contain brominated flame retardants above current limits
- Heavy Metals: Contains substances restricted under current environmental directives
- Legacy Materials: Manufactured using materials and processes predating current restrictions
Export Control & Trade Classifications
- ECCN Classification: EAR99 – Export Administration Regulations applicable
- HTS Code: Harmonized Tariff Schedule classification for customs processing
- Country of Origin: Manufacturing location documentation for trade compliance
- Export Restrictions: Standard semiconductor export control requirements
Product Lifecycle & Compliance
- Lifecycle Status: Obsolete – No longer in active production
- Environmental Transition: Superseded by RoHS-compliant alternatives
- Grandfather Provisions: May be acceptable for repair and maintenance applications
- Regional Variations: Compliance requirements vary by geographic market
Packaging & Handling
- MSL Rating: Moisture Sensitivity Level classification for storage and handling
- ESD Protection: Anti-static packaging and electrostatic discharge protection
- Storage Requirements: Controlled environment storage recommendations
- Shelf Life: Component aging and storage life considerations
Compliance Documentation
- Material Declarations: Available substance content documentation
- Test Reports: Historical compliance testing and analysis data
- Certificates: Legacy compliance certificates and quality documentation
- Audit Trail: Manufacturing batch and lot traceability information
Regulatory Considerations
- Regional Restrictions: Some markets may restrict import/use of non-RoHS components
- Application Exemptions: Repair, maintenance, and replacement exemptions may apply
- Documentation Requirements: Enhanced documentation for non-compliant components
- Risk Assessment: Environmental impact evaluation for continued use
Applications & Legacy System Support
The XCV100E-6FG256C continues to serve critical roles in:
- Legacy System Maintenance: Replacement for existing Virtex-E based systems
- Industrial Equipment: Long-life industrial control and automation systems
- Communications Infrastructure: Telecommunications equipment requiring proven reliability
- Test & Measurement: Instrumentation systems with extended operational requirements
- Aerospace & Defense: Legacy military and aerospace systems requiring identical replacements
Migration & Modernization Considerations
- Direct Replacement: Available for immediate substitution in existing designs
- Design Preservation: Maintains compatibility with legacy development flows
- Modernization Planning: Consider migration to current RoHS-compliant alternatives
- Performance Equivalents: Newer FPGAs offer enhanced performance and environmental compliance
- Tool Compatibility: Legacy design tools remain supported for continued development
Summary
The XCV100E-6FG256C represents a mature, proven FPGA solution for applications requiring commercial-grade Virtex-E technology. While classified as obsolete and non-RoHS compliant, this device remains essential for legacy system support, replacement applications, and projects where proven Virtex-E compatibility is paramount. With over 2,600 pieces available through various distribution channels, the XCV100E-6FG256C provides a reliable bridge for systems transitioning from legacy to modern FPGA technologies.
For current availability, pricing, and technical support, contact authorized distributors or specialized legacy component suppliers. Consider environmental compliance requirements and migration planning for new design applications.
