1. Product Specifications
Core Architecture
- Family: Xilinx Virtex-E 1.8V Field Programmable Gate Arrays
- Part Number: XCV100E-6BG352C
- Speed Grade: -6 (commercial performance tier)
- Logic Elements: 2700 logic cells/elements
- System Gates: 32.4K equivalent system gates
Package & Physical Characteristics
- Package Type: 352-Pin Metal Ball Grid Array (BGA)
- Package Description: 352-LBGA with exposed pad and metal construction
- Pin Count: 352 total pins for maximum connectivity
- I/O Count: 196 user I/O pins (highest in XCV100E family)
- Mounting Type: Surface Mount Technology (SMT)
- Temperature Grade: Commercial (C) – 0ยฐC to +85ยฐC operation
Electrical Specifications
- Supply Voltage: 1.8V nominal operation
- Total RAM: 81,920 bits embedded memory
- CLBs (Configurable Logic Blocks): 600 CLBs for flexible logic implementation
- Maximum Operating Frequency: 357MHz high-speed operation
- Architecture: Place-and-route optimized for silicon efficiency
Advanced Technical Features
- Technology Node: Advanced 0.18ฮผm CMOS process
- Metal Layers: 6-layer metal interconnect for enhanced routing
- Memory Architecture: SelectRAM+ embedded memory blocks
- I/O Technology: SelectI/O+ supporting multiple I/O standards
- Clock Management: Integrated clock distribution and management resources
Package Specifications
- Exposed Pad Design: Enhanced thermal and electrical performance
- Metal Construction: Superior reliability and signal integrity
- High Pin Density: Optimized for maximum I/O utilization
- PCB Compatibility: Standard BGA land pattern and assembly processes
- Thermal Characteristics: Exposed pad design for improved heat dissipation
2. Pricing Information
Market Status & Availability
The XCV100E-6BG352C maintains reasonable availability through multiple distributors despite its obsolete status. Current inventory levels show over 7,000+ pieces available across various suppliers, providing adequate stock for replacement and maintenance applications.
Stock Distribution
- Primary Suppliers: 3,856 pieces at Heisener with immediate availability
- Secondary Sources: 3,024 pieces at Ovaga with 1-year warranty
- Specialty Distributors: Additional stock at Veswin, Silitech, and other legacy component suppliers
- Regional Availability: Global distribution network with varying stock levels
Pricing Structure
- Legacy Product Pricing: Competitive rates for mature, obsolete technology
- Volume Discounts: Bulk pricing available for quantities of 100+, 500+, and 1K+ units
- Quote-Based Pricing: RFQ required due to fluctuating obsolete component markets
- Lead Times: Typically 1-2 weeks for stock quantities, longer for special orders
Commercial Terms
- Payment Options: Wire Transfer, PayPal, Credit Cards, Western Union, MoneyGram
- Warranty Terms: 90 days to 1 year depending on supplier
- Shipping Methods: Express delivery via DHL, FedEx, UPS, TNT globally
- Minimum Orders: Starting from 1 piece with some suppliers
Obsolescence Considerations
- Last-Time Buy: Consider volume purchases for long-term system support
- Price Volatility: Legacy component pricing subject to supply-demand fluctuations
- Authenticity Verification: Enhanced quality control due to obsolete status
- Alternative Sourcing: Multiple broker channels for continued availability
3. Documents & Media
Official Documentation
- Primary Datasheet: Virtex-E FPGA Family Complete Data Sheet (DS022)
- Package Documentation: 352-Pin Metal BGA Package Specifications and Assembly Guidelines
- Migration Guides: Legacy design preservation and modernization strategies
- Pin Assignment: Comprehensive 196 I/O pinout diagrams and planning resources
Technical Implementation Resources
- PCB Design Guidelines: Metal BGA layout recommendations and thermal considerations
- Assembly Instructions: Reflow soldering profiles and assembly best practices
- Thermal Management: Heat sink design and cooling strategies for high I/O applications
- Signal Integrity: High-speed design considerations for 352-pin BGA packaging
Legacy Support Documentation
- Constraint Files: Historical timing and placement constraint libraries
- Reference Designs: Example implementations leveraging high I/O count
- Tool Compatibility: Legacy development environment support information
- IP Cores: Compatible intellectual property blocks for Virtex-E architecture
Application & Design Resources
- High I/O Applications: Design examples for communication and interface applications
- Power Analysis: Thermal modeling and power consumption optimization
- EMI/EMC Guidelines: Electromagnetic compatibility considerations for BGA packages
- Testing Procedures: Functional verification and boundary scan test strategies
Replacement & Migration Information
- Obsolescence Management: End-of-life planning and inventory strategies
- Modern Alternatives: Migration paths to current FPGA families
- Pin Compatibility: Cross-reference with other Virtex-E package options
- Performance Equivalents: Comparative analysis with contemporary FPGA solutions
4. Related Resources
Development Tools & Software Support
- Legacy Development Tools: ISE Design Suite and Foundation Series compatibility
- Modern Tool Support: Limited Vivado Design Suite compatibility considerations
- IP Libraries: Virtex-E compatible intellectual property cores and modules
- Simulation Environment: ModelSim and legacy simulation tool support
Hardware Development Resources
- Evaluation Platforms: Custom development boards supporting 352-pin BGA packages
- Socket Solutions: Programming and testing fixtures for development work
- Prototype Services: PCB design and assembly for high I/O FPGA integration
- Programming Hardware: Compatible configuration and debugging tools
Technical Support Ecosystem
- Legacy Engineering Services: Specialized support for obsolete FPGA maintenance
- Documentation Archives: Historical technical resources and design files
- Community Resources: User forums and knowledge sharing for legacy systems
- Training Materials: Historical application guides and implementation tutorials
Supply Chain & Procurement
- Obsolescence Management: Lifetime buy and inventory planning services
- Authentication Services: Component verification and counterfeit protection
- Broker Networks: Secondary market sourcing for hard-to-find components
- Excess Inventory Trading: Platforms for surplus component acquisition
Alternative Solutions & Migration
- Direct Replacements: Pin-compatible alternatives within Virtex-E family
- Functional Equivalents: Modern FPGAs offering similar I/O capabilities
- Migration Services: Design porting from legacy to current FPGA architectures
- Performance Upgrades: Enhanced solutions maintaining I/O compatibility
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Compliance: Non-compliant – Contains lead and restricted substances above regulatory limits
- Environmental Classification: Legacy product manufactured prior to current environmental regulations
- Lead Content: Contains lead in solder balls, package materials, and internal components
- REACH Compliance: Non-compliant with current European chemical safety regulations
Material Composition
- Metal BGA Construction: Contains lead-bearing solder balls and metallization
- Package Materials: Traditional materials not meeting current environmental standards
- Exposed Pad Design: Metal construction using legacy materials and processes
- Halogen Content: May contain brominated compounds above current restriction levels
Product Lifecycle Status
- Lifecycle Classification: Obsolete – Discontinued from active production
- Environmental Transition: Superseded by RoHS-compliant FPGA alternatives
- Legacy Support: Available for repair, maintenance, and replacement applications
- Regulatory Grandfathering: Limited exemptions for existing system support
Export Control & Trade Classifications
- ECCN Classification: Standard semiconductor export control requirements
- HTS Code: Harmonized Tariff Schedule classification for customs processing
- Dual-Use Technology: Standard programmable logic export considerations
- Regional Restrictions: Compliance with international technology transfer regulations
Packaging & Handling Standards
- MSL Rating: Moisture Sensitivity Level classification requiring controlled storage
- ESD Protection: Enhanced anti-static handling and packaging procedures
- Thermal Cycling: Storage and handling considerations for BGA packages
- Shelf Life: Extended storage requirements for obsolete components
Compliance Documentation
- Material Declarations: Available substance content and composition documentation
- Quality Certificates: Manufacturing batch and lot traceability information
- Test Reports: Historical compliance testing and analysis data
- Environmental Impact: Assessment documentation for continued use applications
Regional Regulatory Considerations
- Import Restrictions: Some markets may limit non-RoHS component importation
- Application Exemptions: Repair and maintenance exemptions may apply in certain regions
- Documentation Requirements: Enhanced paperwork for non-compliant component shipments
- Risk Mitigation: Environmental impact evaluation for legacy system applications
Applications & System Integration
The XCV100E-6BG352C excels in high I/O density applications including:
- Communications Infrastructure: High-channel-count interface and protocol processing
- Test & Measurement: Multi-channel data acquisition and instrumentation systems
- Industrial Control: Complex automation systems requiring extensive I/O connectivity
- Legacy System Support: Direct replacement for existing high I/O Virtex-E implementations
- Interface Bridging: Multi-protocol conversion and signal conditioning applications
Competitive Advantages
- Maximum I/O Density: 196 I/O pins provide highest connectivity in XCV100E family
- Proven Reliability: Mature technology with extensive field deployment history
- Metal BGA Package: Superior electrical and thermal performance characteristics
- Supply Availability: Multiple sourcing channels ensuring continued availability
- Cost Effectiveness: Competitive pricing for high I/O density legacy applications
Migration & Modernization Planning
- Legacy System Maintenance: Ideal for direct replacement in existing designs
- High I/O Requirements: Unmatched connectivity for communication-intensive applications
- Obsolescence Bridge: Provides transition time for system modernization planning
- Performance Proven: Established track record in demanding industrial applications
- Design Preservation: Maintains compatibility with existing Virtex-E development flows
Summary
The XCV100E-6BG352C represents the pinnacle of I/O density within the Virtex-E family, offering 196 user I/O pins in a robust 352-pin Metal BGA package. While classified as obsolete and non-RoHS compliant, this device remains essential for high I/O density applications, legacy system support, and projects where maximum connectivity is paramount. With over 7,000 pieces available through various distribution channels, the XCV100E-6BG352C provides a reliable solution for maintaining and extending the life of I/O-intensive systems built on proven Virtex-E technology.
For current availability, competitive pricing, and technical support, contact specialized legacy component distributors or obsolete semiconductor suppliers. Consider environmental compliance requirements and long-term sourcing strategies when planning system lifecycle management.
