1. Product Specifications
Core Architecture
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV1000E-8HQG240C
- System Gates: 1,000,000 gates
- Speed Grade: -8 (high-performance grade)
- Package Type: HQG240 (240-pin Heat sink Quad Grid array)
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
Logic Resources
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- Total Logic Cells: Approximately 27,648 logic cells
- Flip-Flops: 55,296 flip-flops
- 4-input LUTs: 27,648 look-up tables
- Maximum User I/O: 180 pins
Memory and Multipliers
- Block RAM: 320 Kbits total block RAM
- Distributed RAM: Available through CLB resources
- Dedicated Multipliers: Multiple 18×18 multiplier blocks
- Clock Management: Digital Clock Manager (DCM) units
Performance Characteristics
- Maximum Operating Frequency: Up to 200+ MHz (application dependent)
- Power Supply: 1.8V core, 3.3V I/O
- Advanced Features: Hot-swappable capability, partial reconfiguration support
2. Price Information
Pricing for the XCV1000E-8HQG240C varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing:
- Unit Price Range: Contact for quote
- Volume Discounts: Available for quantities 100+
- Lead Time: Varies by supplier (typically 8-16 weeks for standard orders)
- Availability: Contact authorized distributors for stock status
Note: Pricing is subject to change. Contact authorized Xilinx partners for the most current pricing and availability information.
3. Documents & Media
Technical Documentation
- Data Sheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines
- Package Information: Detailed pinout and mechanical drawings
- Application Notes: Design implementation best practices
- Errata: Known issues and workarounds
- Migration Guide: Upgrade path documentation
Development Resources
- Reference Designs: Pre-verified design examples
- IP Cores: Compatible intellectual property blocks
- Timing Models: IBIS and simulation models
- PCB Layout Guidelines: Board design recommendations
Software Support
- ISE Design Suite: Compatible development environment
- ChipScope Pro: Integrated logic analyzer
- CORE Generator: IP core customization tool
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment
- ModelSim: Simulation and verification software
- Synopsys Design Compiler: Synthesis tools
- Mentor Graphics Tools: Additional EDA support
Evaluation Boards
- Virtex-E Evaluation Platform: Complete development system
- Custom Carrier Boards: Application-specific platforms
- Prototyping Solutions: Rapid design verification tools
Compatible Products
- XCV600E Series: Lower-density alternatives
- XCV1600E Series: Higher-density options
- Configuration Devices: PROM and serial flash solutions
- Power Management ICs: Optimized power supply solutions
Support Services
- Technical Support: Xilinx online support portal
- Design Services: Professional consulting available
- Training Programs: FPGA design methodology courses
- Community Forums: User discussion groups
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package options available
- REACH Regulation: EU chemical compliance certified
- Conflict Minerals: Compliant with conflict minerals regulations
- ISO 14001: Manufactured in environmentally certified facilities
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 10% to 95% non-condensing
- Altitude: Up to 2000 meters operational
Export Classifications
- ECCN (Export Control Classification Number): Check current regulations
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Various (check specific part marking)
- Export Restrictions: Subject to current trade regulations
Quality Standards
- ISO 9001: Quality management system certified
- AS9100: Aerospace quality standard compliance
- Automotive Grade: AEC-Q100 qualified versions available
- Military Standards: MIL-STD versions for defense applications
Packaging Information
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Anti-Static Packaging: ESD protective packaging standard
- Traceability: Full lot traceability maintained
- Shelf Life: 12 months in original packaging
The XCV1000E-8HQG240C represents a proven solution for high-performance FPGA applications, offering the reliability and performance characteristics demanded by today’s most challenging digital design requirements. Contact authorized Xilinx distributors for detailed technical support, current pricing, and availability information.
For the most current specifications and compliance information, always refer to the official Xilinx documentation and consult with authorized distributors.
