1. Product Specifications
Core Architecture
- Family: Xilinx Virtex-E 1.8V Field Programmable Gate Arrays
- Part Number: XCV1000E-8FG1156C
- Speed Grade: -8 (maximum performance tier in Virtex-E family)
- Temperature Grade: Commercial (C) – 0°C to +85°C operation
- System Gates: 331.776K gates for large-scale system implementation
- Logic Elements: 27,648 logic cells/elements
Package & Connectivity Characteristics
- Package Type: 1156-Pin Fine-pitch Ball Grid Array (FBGA)
- Package Description: 1156-BBGA (35×35) ultra-high pin density design
- Total Pin Count: 1156 pins – largest package in Virtex-E family
- User I/O Count: 660 user I/O pins for maximum external connectivity
- Mounting Type: Surface Mount Technology (SMT)
- Ball Pitch: Fine-pitch design optimizing signal density
Electrical Specifications
- Supply Voltage: 1.8V nominal (1.71V ~ 1.89V range)
- Operating Temperature: 0°C to +85°C (Commercial grade)
- Maximum Operating Frequency: Up to 416MHz for high-speed processing
- Total RAM: 393,216 bits embedded memory resources
- CLBs (Configurable Logic Blocks): 6,144 CLBs for complex logic implementation
Advanced Performance Features
- Technology Node: Advanced 0.18μm CMOS process technology
- Metal Layers: 6-layer metal interconnect for superior routing density
- Architecture: Place-and-route optimized for maximum silicon efficiency
- Memory System: SelectRAM+ embedded memory blocks for data buffering
- I/O Technology: SelectI/O+ supporting comprehensive I/O standards
Ultra-High Density Specifications
- Pin Utilization: Maximum I/O density available in Virtex-E series
- Signal Integrity: Advanced package design for high-speed signal transmission
- Power Distribution: Optimized power delivery for high pin-count operation
- Thermal Management: Enhanced heat dissipation for high-density applications
- EMI Performance: Sophisticated electromagnetic interference management
2. Pricing Information
Market Positioning & Availability
The XCV1000E-8FG1156C commands premium positioning as the flagship connectivity solution in the Virtex-E family. Despite its obsolete status, exceptional stock availability exists through specialized distributors, ensuring continued support for ultra-high I/O density applications requiring this unique capability.
Stock Distribution & Market Supply
- Primary Supplier: 29,574 pieces available at XI DA Electronics with 365-day warranty
- Secondary Sources: 2,747 pieces at Xilinx-ADM with comprehensive support
- Global Distribution: Multiple suppliers maintaining strategic inventory levels
- Lead Times: Immediate availability for standard quantities, 1-2 weeks for larger orders
Pricing Structure & Commercial Terms
- Flagship Premium Pricing: Reflects maximum I/O density and performance specifications
- Volume Pricing: Significant discounts available for quantities of 25+, 100+, and 500+ units
- Quote-Based Pricing: RFQ required due to specialized nature and premium positioning
- Ultra-High Density Premium: 40-60% premium over standard pin-count variants
Commercial Considerations
- Payment Terms: Multiple options including Wire Transfer, Credit Cards, and PayPal
- Warranty Coverage: Up to 365 days warranty from qualified distributors
- Express Shipping: Free shipping on first 0.5kg for orders over $200
- Global Logistics: DHL, FedEx, UPS, TNT express services worldwide
Long-Term Sourcing Strategy
- Strategic Inventory: Consider volume procurement for multi-year project requirements
- Obsolescence Planning: Last-time buy opportunities for long lifecycle support
- Alternative Assessment: Migration planning to current ultra-high I/O FPGA families
- Supply Chain Diversification: Multiple sourcing channels for risk mitigation
3. Documents & Media
Official Technical Documentation
- Primary Datasheet: Virtex-E FPGA Family Complete Data Sheet (DS022)
- Package Specifications: 1156-Pin FBGA Mechanical and Electrical Characteristics (FG1156.pdf)
- Pin Assignment: Comprehensive 660 I/O pinout diagrams and signal planning resources
- Thermal Analysis: High pin-count thermal management and cooling requirements
Ultra-High Density Design Resources
- PCB Design Guidelines: 1156-pin FBGA layout recommendations and signal integrity
- Signal Integrity: High-speed design considerations for maximum I/O density
- Power Distribution: Power plane design and decoupling strategies
- Assembly Guidelines: Advanced SMT assembly procedures for large BGA packages
Connectivity & Interface Documentation
- I/O Planning: Comprehensive guides for 660 I/O pin utilization and banking
- Interface Standards: SelectI/O+ compatibility matrix and electrical specifications
- Timing Analysis: High-speed timing constraints for ultra-high pin count designs
- Signal Assignment: Optimal pin assignment strategies for complex interfaces
Legacy System Support
- Migration Strategies: Transition planning from ultra-high I/O legacy designs
- Pin Compatibility: Cross-reference with current high pin-count FPGA alternatives
- Performance Benchmarking: Comparative analysis with modern ultra-scale FPGAs
- Lifecycle Management: Long-term support for mission-critical ultra-high I/O systems
Development & Implementation Resources
- Reference Designs: Ultra-high I/O application examples and best practices
- Constraint Libraries: Comprehensive timing and placement constraint files
- Tool Support: Legacy development environment optimization for large designs
- Verification Procedures: Testing and validation protocols for complex pin-out designs
4. Related Resources
Development Tools & Ultra-High Density Support
- Legacy Development Environment: ISE Design Suite optimized for large Virtex-E designs
- Modern Tool Assessment: Vivado Design Suite compatibility for migration projects
- IP Libraries: High-bandwidth intellectual property cores for multi-interface designs
- Simulation Environment: Advanced verification tools for complex, high pin-count designs
Ultra-High Density Hardware Platforms
- Custom Development Boards: Specialized platforms supporting 1156-pin FBGA packages
- Interface Evaluation: Multi-protocol test and development systems
- High-Speed Testing: Advanced test equipment for 660 I/O validation
- Programming Solutions: Specialized configuration hardware for large BGA packages
Engineering & Design Services
- Ultra-High Density Design: Professional services for complex multi-interface systems
- Signal Integrity Analysis: Expert consultation for high-speed, high pin-count designs
- Thermal Management: Professional thermal modeling and cooling system design
- Migration Planning: Specialized services for transitioning ultra-high I/O legacy systems
Supply Chain & Specialized Procurement
- High-End Component Distributors: Specialized suppliers for flagship FPGA solutions
- Authentication Services: Enhanced verification for mission-critical applications
- Strategic Inventory: Long-term storage and lifecycle management for premium components
- Global Sourcing: Worldwide procurement for specialized ultra-high density requirements
Alternative Solutions & Technology Migration
- Modern Ultra-Scale FPGAs: Current-generation solutions with comparable I/O density
- High Pin-Count Alternatives: Contemporary FPGA families offering similar connectivity
- Performance Migration: Upgrade paths maintaining ultra-high I/O capabilities
- System-on-Chip Solutions: Modern SoC alternatives for complex interface requirements
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Compliance: Non-compliant – Contains lead and restricted substances exceeding regulatory limits
- Product Status: Obsolete – Discontinued from active production by manufacturer
- Environmental Legacy: Manufactured under pre-RoHS high-performance semiconductor standards
- REACH Compliance: Non-compliant with current European chemical safety regulations
Material Composition & Package Construction
- Lead Content: Contains lead in solder balls, package materials, and internal interconnections
- BGA Construction: Traditional high-performance materials optimized for signal integrity
- Fine-Pitch Design: Advanced packaging technology using legacy materials and processes
- Ultra-High Density: Specialized materials for maximum pin density and electrical performance
Product Lifecycle & Technology Status
- Lifecycle Classification: Obsolete – No longer in active high-volume production
- Technology Transition: Superseded by RoHS-compliant ultra-scale FPGA alternatives
- Legacy Ultra-High I/O: Continued availability for existing ultra-high density system maintenance
- Qualification Heritage: Historical qualification data may remain valid for specific applications
Export Control & Technology Classifications
- ECCN Classification: Advanced programmable logic subject to technology transfer controls
- High-Performance Technology: Ultra-high I/O capabilities requiring export licensing consideration
- Dual-Use Classification: Advanced connectivity technology with potential strategic applications
- International Compliance: Subject to comprehensive technology transfer regulations
Packaging & Ultra-High Density Handling
- MSL Rating: Moisture Sensitivity Level classification for large BGA packages
- ESD Protection: Enhanced anti-static handling procedures for high pin-count devices
- Thermal Cycling: Specialized storage requirements for large, complex packages
- Ultra-High Density Storage: Extended shelf life considerations for premium components
Environmental Impact & Regulatory Considerations
- High-Performance Waste: Specialized disposal procedures for advanced semiconductor packages
- Material Recovery: Premium component recycling and strategic material recovery
- Environmental Assessment: Ultra-high density application environmental impact evaluation
- Regulatory Compliance: Specialized exemptions for critical infrastructure applications
Regional Regulatory Framework
- Import Documentation: Enhanced paperwork for non-compliant ultra-high performance components
- Technology Exemptions: Specialized regulatory treatment for critical system applications
- Documentation Requirements: Comprehensive compliance records for advanced technology components
- Risk Assessment: Environmental and technology transfer risk evaluation protocols
Applications & Ultra-High Connectivity Integration
The XCV1000E-8FG1156C excels in applications requiring maximum I/O density:
- Telecommunications Infrastructure: Central office equipment and high-capacity switching systems
- Network Processing: High-port-count routers, switches, and protocol processing engines
- Multi-Protocol Bridges: Complex interface conversion and data format transformation
- High-Performance Computing: Massively parallel processing and inter-processor communication
- Test & Measurement: Multi-channel data acquisition and signal generation systems
Competitive Advantages
- Maximum I/O Density: 660 I/O pins provide unmatched connectivity in Virtex-E family
- Flagship Performance: Highest speed grade (-8) combined with maximum pin count
- Ultra-High Integration: Single-chip solution for complex multi-interface requirements
- Proven Reliability: Extensive deployment in mission-critical ultra-high I/O applications
- Strategic Availability: Substantial inventory ensuring continued system support
Technology Leadership & Future Considerations
- Connectivity Benchmark: Industry-leading I/O density for early 2000s FPGA technology
- System Integration: Single-device solution for complex multi-protocol applications
- Legacy Ultra-High I/O: Essential for maintaining complex connectivity-intensive systems
- Migration Gateway: Bridge technology for transitioning to modern ultra-scale solutions
- Strategic Component: Critical element for ultra-high connectivity legacy system preservation
Summary
The XCV1000E-8FG1156C stands as the ultimate connectivity solution in the Virtex-E family, combining maximum I/O density (660 pins) with flagship performance (speed grade -8) in an unprecedented 1156-pin FBGA package. With 331.776K gates and 416MHz operation, this device provides unparalleled external interface capability for the most demanding connectivity applications. While obsolete and non-RoHS compliant, the XCV1000E-8FG1156C remains indispensable for ultra-high I/O density legacy systems and applications where maximum external connectivity is paramount. Exceptional stock availability (29,574+ pieces) ensures continued support for mission-critical ultra-high connectivity implementations.
For current availability, flagship pricing, and specialized ultra-high density technical support, contact qualified distributors specializing in premium obsolete semiconductors. Consider strategic procurement planning and environmental compliance requirements when implementing ultra-high connectivity system designs and lifecycle management strategies.
