1. Product Specifications
Core Technical Specifications – XCV1000E-7BG728C
| Parameter | Specification |
|---|---|
| Part Number | XCV1000E-7BG728C |
| Device Family | Virtex-E 1.8V FPGAs |
| System Gates | 331,776 (331.776K) |
| Logic Cells | 27,648 |
| CLB Array Size | 96 x 96 |
| Maximum Frequency | 400MHz |
| Speed Grade | -7 (Commercial) |
| Process Technology | 0.18μm CMOS |
| Metal Layers | 6-layer metal process |
| Core Voltage | 1.8V |
| I/O Voltage | 1.8V, 2.5V, 3.3V, 5V tolerant |
Package Specifications
| Parameter | Specification |
|---|---|
| Package Type | 728-pin Ball Grid Array (BGA) |
| Package Code | BG728 |
| Package Size | 31mm x 31mm (nominal) |
| Ball Pitch | 1.0mm |
| User I/O Pins | Up to 680 user I/O |
| Temperature Grade | Commercial (0°C to +85°C) |
| Moisture Sensitivity | Level 3 per JEDEC J-STD-020 |
| Thermal Resistance | θJA ≈ 4.8°C/W (in still air) |
Memory and Logic Resources
- Configurable Logic Blocks (CLBs): 4,608 CLBs
- Block RAM: 40 blocks of 4K-bit each (160K bits total)
- Distributed RAM: Up to 442K bits using LUTs
- Multipliers: Dedicated 18×18 multiplier blocks
- DLLs: Up to 8 Delay Locked Loops for clock management
- Global Clock Networks: 4 primary and 4 secondary networks
Performance Characteristics
- Internal Performance: 130MHz (four-level logic)
- Block RAM Performance: 200MHz+ operation
- I/O Performance: Up to 200MHz DDR operation
- PCI Compliance: 33MHz and 66MHz PCI support
- Configuration Time: <100ms for full device configuration
2. Price Information
Current Market Pricing (August 2025)
The XCV1000E-7BG728C pricing reflects its high-performance capabilities and specialized BGA728 package:
Pricing Structure
- Single Unit: $150 – $300 USD (varies by supplier and condition)
- Volume Pricing (25+): 15-25% discount typically available
- Volume Pricing (100+): 25-35% discount for production quantities
- Lead Time: 2-8 weeks depending on availability
- Stock Status: Limited availability due to legacy product status
Price Factors
- Original vs. Refurbished: New parts command premium pricing
- Supplier Type: Authorized distributors vs. brokers
- Market Demand: Fluctuations based on legacy system maintenance
- Geographic Region: Regional pricing variations apply
- Packaging Requirements: Anti-static and moisture barrier packaging
Cost Considerations
- Development Costs: Factor in legacy tool licensing for ISE
- PCB Complexity: BGA728 requires advanced PCB fabrication
- Assembly Costs: Specialized BGA placement and inspection required
- Thermal Management: Consider heat sink and thermal interface materials
Note: Due to the legacy nature of Virtex-E devices, pricing requires direct supplier quotation. Contact certified Xilinx distributors for current availability and pricing.
3. Documents & Media
Official Technical Documentation
Primary Documentation
- Device Datasheet: DS022 – Virtex-E 1.8V Field Programmable Gate Arrays
- Version: v2.3 (Final revision)
- Release Date: July 17, 2002
- File Size: 69KB PDF
- Content: Complete electrical, mechanical, and timing specifications
Package-Specific Documentation
- Package Drawing: BG728 mechanical specifications
- Pin Assignment: Complete pinout and signal assignments
- Thermal Characteristics: Junction-to-ambient thermal resistance
- Assembly Guidelines: BGA soldering and inspection procedures
Development Tools and Software
Design Environment
- ISE Design Suite: Legacy development environment (recommended)
- Version Support: ISE 14.7 (final version with Virtex-E support)
- Synthesis Tools: XST (Xilinx Synthesis Technology)
- Implementation: Place and Route (PAR) tools
- Simulation: ModelSim integration support
Programming and Debug Tools
- iMPACT: Device programming and configuration
- ChipScope Pro: On-chip logic analyzer functionality
- JTAG: Boundary scan and in-system programming
- Configuration Modes: JTAG, Master Serial, Slave Serial
Application Resources
Reference Designs
- DSP Applications: Digital filter implementations
- Communication Protocols: Ethernet, PCI, and custom interfaces
- Motor Control: Servo and stepper motor control examples
- Video Processing: Video codec and processing pipelines
User Guides
- Virtex-E Configuration Guide: Startup and configuration sequences
- SelectI/O+ Technology: I/O standard implementation guide
- High-Speed Design: PCB layout and signal integrity guidelines
- Power Management: Voltage regulation and power estimation
4. Related Resources
Development Platforms
Evaluation Boards
- Custom Evaluation Boards: Third-party BG728 development platforms
- Prototyping Boards: Universal FPGA development systems
- Educational Kits: Academic institutions’ legacy development boards
Design Services
- PCB Design Services: BGA728-specific layout expertise required
- Assembly Services: Specialized BGA placement and inspection
- Thermal Design: Heat sink and thermal management solutions
Compatible and Alternative Devices
Pin-Compatible Alternatives
- XCV1000E-6BG728C: Same package, slower speed grade (-6)
- XCV1000E-8BG728C: Same package, faster speed grade (-8)
- XCV1000E-7BG728I: Industrial temperature grade variant
Density Alternatives in BG728 Package
- XCV600E-7BG728C: Lower density (165K gates) option
- XCV1600E-7BG728C: Higher density (529K gates) alternative
- XCV2000E-7BG728C: Maximum density (663K gates) in BG728
Package Alternatives (Same Die)
- XCV1000E-7FG680C: 680-pin FBGA package
- XCV1000E-7BG560C: 560-pin BGA package (fewer I/Os)
- XCV1000E-7FG1156C: 1156-pin FBGA (maximum I/O count)
Software Ecosystem
Synthesis Support
- Xilinx XST: Native synthesis tool
- Synopsys Synplify Pro: Third-party synthesis option
- Mentor Graphics Precision: Alternative synthesis solution
- FPGA Compiler: Legacy synthesis tools
Simulation Environment
- ModelSim: HDL simulation and debug
- VCS: Alternative Verilog simulation
- NCSIM: Cadence simulation environment
- Active-HDL: Aldec simulation platform
5. Environmental & Export Classifications
Environmental Compliance Status
RoHS Compliance
- Status: RoHS Non-Compliant (Contains Lead)
- Lead Content: Present in solder balls and internal interconnects
- Restriction Date: Not suitable for post-2006 EU market requirements
- Alternative Recommendation: Consider newer Xilinx/AMD families for RoHS compliance
Environmental Operating Conditions
- Operating Temperature: 0°C to +85°C (Commercial grade)
- Storage Temperature: -65°C to +150°C
- Junction Temperature: Up to +125°C maximum
- Relative Humidity: 10% to 85% non-condensing
- Altitude: Up to 3,000 meters operational
Export Control and Trade Information
Export Classification
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Schedule B: 8542.31.0001
- Country of Origin: Varies (Ireland, Malaysia, or Philippines)
- Export License: Required for certain countries and end-uses
Trade Compliance
- ITAR Status: Not ITAR controlled (commercial grade)
- EAR Applicability: Subject to Export Administration Regulations
- Dual-Use Technology: Controlled for certain applications
- End-Use Restrictions: Military and nuclear applications restricted
Quality and Reliability Standards
Manufacturing Standards
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management certified
- TS 16949: Automotive quality standard (reference only)
- AS9100: Aerospace quality standard (reference only)
Reliability Specifications
- MTBF: >1,000,000 hours at 55°C ambient
- FIT Rate: <50 failures per billion hours
- Qualification Level: Commercial grade per JESD47
- ESD Rating: Class 1C (>1000V HBM, >250V CDM)
Chemical and Material Compliance
Material Composition
- Silicon Die: 0.18μm CMOS technology
- Package Substrate: BT (Bismaleimide Triazine) resin
- Solder Balls: Eutectic lead-tin alloy (Pb63/Sn37)
- Die Attach: Gold-silicon eutectic
- Wire Bonds: Gold wire interconnections
Chemical Regulations
- REACH Compliance: EU chemical regulation status available
- Conflict Minerals: Tin, tungsten, tantalum, gold sourcing documented
- Proposition 65: California chemical disclosure compliance
- PFOS/PFOA: Perfluorinated compound content disclosure
Packaging and Handling Requirements
ESD Protection
- ESD Sensitivity: Class 1C electrostatic discharge sensitive
- Handling Requirements: Grounding straps and conductive surfaces mandatory
- Storage: Anti-static containers and controlled environment
- Transportation: ESD-protective packaging required
Moisture Sensitivity
- MSL Level: Level 3 per JEDEC J-STD-020
- Floor Life: 168 hours at <30°C/60% RH after bag opening
- Baking Requirements: 125°C for 24 hours if humidity exposure exceeded
- Packaging: Moisture barrier bags with humidity indicator cards
Applications and Market Segments
Primary Application Areas
The XCV1000E-7BG728C excels in applications demanding high logic density and extensive I/O connectivity:
Communications and Networking
- Base Station Infrastructure: Radio frequency processing units
- Network Routers: Packet processing and traffic management
- Optical Network Equipment: SONET/SDH and fiber channel interfaces
- Protocol Converters: Multi-standard communication bridges
Industrial and Automotive
- Motor Control Systems: Advanced servo and stepper control
- Industrial Automation: Programmable logic controller (PLC) functions
- Test and Measurement: High-speed data acquisition systems
- Automotive Infotainment: Legacy automotive entertainment systems
Medical and Scientific
- Medical Imaging: Ultrasound and X-ray processing systems
- Laboratory Equipment: Spectroscopy and chromatography systems
- Research Instruments: Data acquisition and signal processing
- Scientific Computing: Parallel processing accelerators
Market Positioning
Competitive Advantages
- Proven Reliability: Mature technology with extensive field deployment
- High I/O Density: BG728 package maximizes connectivity options
- Development Ecosystem: Comprehensive tool support and documentation
- Legacy Support: Sustained availability for maintenance applications
Target Customers
- OEM Manufacturers: Companies maintaining legacy product lines
- System Integrators: Upgrade and modernization projects
- Research Institutions: Academic and R&D applications
- Repair Services: Electronic equipment service providers
Design Considerations and Best Practices
PCB Design Requirements
Layout Considerations
- BGA Fanout: Requires 6-8 layer PCB for complete signal routing
- Via Technology: Microvias recommended for high-density routing
- Thermal Management: Dedicated thermal vias and copper pour planes
- Signal Integrity: Controlled impedance and length matching critical
Power Distribution
- Power Planes: Separate 1.8V core and I/O voltage planes required
- Decoupling: Extensive decoupling capacitor network necessary
- Voltage Regulation: High-efficiency switching regulators recommended
- Power Sequencing: Proper power-up sequence critical for reliability
Thermal Management
Heat Dissipation
- Power Consumption: Typically 2-5W depending on utilization
- Heat Sink: Required for most applications above 50% utilization
- Thermal Interface: High-performance thermal interface materials
- Airflow: Consider forced convection for high-performance applications
Migration and Upgrade Paths
Legacy System Maintenance
- Drop-in Replacement: Pin-compatible with other BG728 variants
- Code Compatibility: Existing VHDL/Verilog designs portable
- Tool Migration: ISE project files directly usable
- Performance Scaling: Speed grade options for different performance needs
Modern Alternatives
For new designs, consider migrating to current AMD/Xilinx FPGA families:
- Artix-7: Cost-optimized alternative for new designs
- Kintex-7: Performance upgrade path
- Zynq-7000: ARM processor integration option
Why Choose XCV1000E-7BG728C?
The XCV1000E-7BG728C represents a mature, field-proven FPGA solution ideal for applications requiring high I/O count and reliable performance. Its BG728 package provides excellent connectivity options while maintaining manageable PCB complexity. The extensive documentation and established development ecosystem ensure successful project implementation.
Contact authorized AMD/Xilinx distributors for current XCV1000E-7BG728C availability, pricing, and technical support.
