“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XCV1000E-6FG680I FPGA: High-Performance Xilinx Virtex-E Series Field-Programmable Gate Array

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Features

  • Device Family: Xilinx Virtex-E Series
  • Part Number: XCV1000E-6FG680I
  • Logic Cells: 1,000,000 system gates
  • Speed Grade: -6 (high-performance grade)
  • Package Type: FG680 (Fine-pitch Ball Grid Array)
  • Temperature Range: Industrial (-40ยฐC to +85ยฐC)
  • Operating Voltage: 1.8V core, 3.3V I/O

Technical Specifications

  • CLB Matrix: 64 x 96 Configurable Logic Blocks
  • Total CLBs: 6,144
  • Logic Cells: Approximately 27,648
  • Block RAM: 160 Kbits distributed across 40 blocks
  • Input/Output: Up to 512 user I/Os
  • Dedicated Multipliers: 40 embedded multiplier blocks
  • DLL (Delay Locked Loops): 8 available
  • Maximum System Clock: Up to 200+ MHz

Package Details

  • Package: 680-pin Fine-pitch Ball Grid Array (FBGA)
  • Package Size: 27mm x 27mm
  • Ball Pitch: 1.0mm
  • Pin Count: 680 pins total

2. Price Information

Pricing for the XCV1000E-6FG680I varies based on quantity, supplier, and market conditions. The device is considered a premium FPGA solution, with typical pricing ranging from $800 to $1,500 per unit for small quantities. Volume discounts are available for orders of 100+ units. Contact authorized Xilinx distributors for current pricing and availability, as this device may have limited stock due to its specialized nature and production status.

Note: Prices are subject to change based on market conditions and availability. Always verify current pricing with authorized distributors.

3. Documents & Media

Technical Documentation

  • Datasheet: Complete electrical and mechanical specifications
  • User Guide: Comprehensive implementation and design guidelines
  • Package Information: Detailed pinout diagrams and package dimensions
  • Errata: Known issues and workarounds
  • Application Notes: Design implementation best practices

Development Resources

  • Reference Designs: Pre-built design examples and templates
  • IP Cores: Compatible intellectual property cores
  • Timing Models: IBIS and simulation models
  • PCB Design Guidelines: Layout recommendations and design rules

Software Support

  • Xilinx ISE: Compatible with ISE Design Suite
  • Synthesis Tools: Support for various synthesis environments
  • Simulation Models: Behavioral and timing simulation support

4. Related Resources

Development Tools

  • Xilinx ISE Design Suite: Primary development environment
  • ModelSim: Simulation and verification software
  • ChipScope Pro: On-chip debugging and analysis
  • FPGA Editor: Low-level design editing and optimization

Evaluation Boards

  • ML300: Virtex-E evaluation and development platform
  • Custom Development Boards: Third-party solutions available

Compatible Products

  • XCV600E-6FG680I: Lower-capacity alternative
  • XCV1600E-6FG680I: Higher-capacity option
  • Configuration Devices: Compatible PROM and configuration solutions

Technical Support

  • Xilinx Support: Official technical support and documentation
  • Community Forums: User community and knowledge sharing
  • Training Resources: Design methodology and best practices training

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets European restriction of hazardous substances
  • REACH Compliant: Complies with EU chemical safety regulations
  • Halogen-Free: Environmentally friendly package materials
  • Operating Temperature: Industrial grade (-40ยฐC to +85ยฐC)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity: 5% to 95% non-condensing

Reliability & Quality

  • MTBF: >1,000,000 hours under normal operating conditions
  • Quality Standard: ISO 9001 certified manufacturing
  • Qualification: Fully qualified to JEDEC standards

Export Classifications

  • ECCN: 3A001.a.7 (US Export Administration Regulations)
  • Country of Origin: Varies by manufacturing location
  • Export Restrictions: Subject to US and international export control regulations
  • License Requirements: May require export license for certain destinations

Packaging & Shipping

  • Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
  • Packaging: Anti-static tray packaging
  • Shipping: ESD-safe packaging with proper handling instructions

The XCV1000E-6FG680I represents a mature, high-performance FPGA solution ideal for applications requiring significant processing power and flexibility. While newer FPGA families offer enhanced features, the XCV1000E-6FG680I remains valuable for legacy system support and specific applications where its characteristics provide optimal performance-to-cost ratios.

For the most current technical specifications, pricing, and availability of the XCV1000E-6FG680I, consult with authorized Xilinx distributors and the official Xilinx documentation.