Product Specifications
The XCS30XL-4PQG208C features a comprehensive set of technical specifications that ensure reliable performance across demanding applications:
Core Architecture:
- Logic cells: 30,000 equivalent gates
- Speed grade: -4 (commercial temperature range)
- Package type: 208-pin Plastic Quad Flat Pack (PQFP)
- Pin count: 208 pins in QFP configuration
Memory and Storage:
- Distributed RAM capabilities for flexible data storage
- Block RAM architecture optimized for high-speed access
- Configuration memory with reliable data retention
Performance Characteristics:
- Operating voltage: 3.3V core with 5V tolerant I/O
- Maximum operating frequency up to 100 MHz
- Low power consumption design
- Commercial temperature range: 0ยฐC to +70ยฐC
I/O Features:
- Multiple I/O standards support including TTL and CMOS
- Programmable drive strength and slew rate control
- Input/output pins with electrostatic discharge (ESD) protection
Price
The XCS30XL-4PQG208C pricing varies based on quantity and distributor. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing factors include:
- Single unit pricing for prototyping and small-scale projects
- Volume pricing tiers for production quantities
- Extended temperature range variants may carry premium pricing
- Lead times and stock availability affect final pricing
For the most competitive XCS30XL-4PQG208C pricing, request quotes from multiple authorized distributors and consider long-term supply agreements for production applications.
Documents & Media
Essential documentation and resources for the XCS30XL-4PQG208C include:
Technical Documentation:
- Official datasheet with complete electrical specifications
- Pin configuration and package drawings
- Application notes for design implementation
- Programming and configuration guides
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and example projects
- Timing analysis and constraint files
- PCB layout guidelines and recommendations
Support Materials:
- Errata documents highlighting known issues
- Migration guides for design updates
- Power consumption calculation tools
- Thermal management guidelines
Related Resources
The XCS30XL-4PQG208C ecosystem includes various complementary products and tools:
Development Tools:
- Xilinx ISE WebPACK (free development software)
- ModelSim simulation environment
- ChipScope Pro for debugging and analysis
- Impact configuration software
Compatible Products:
- Other Spartan-XL series FPGAs for scalable designs
- Configuration memories and programming cables
- Evaluation boards and development kits
- Third-party IP cores and design modules
Technical Support:
- Xilinx technical support forums and communities
- Application engineering support services
- Training courses and certification programs
- Partner network for specialized design services
Environmental & Export Classifications
The XCS30XL-4PQG208C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant lead-free package options available
- REACH regulation compliance for European markets
- Conflict minerals reporting and sourcing transparency
- ISO 14001 environmental management system certification
Export Control Classifications:
- Export Control Classification Number (ECCN) determination
- International Traffic in Arms Regulations (ITAR) compliance
- Export Administration Regulations (EAR) classification
- Country-specific import/export documentation requirements
Quality and Reliability:
- Automotive-grade variants available for harsh environments
- Extended temperature range options (-40ยฐC to +85ยฐC)
- Radiation-tolerant versions for aerospace applications
- Long-term availability commitments for critical applications
Package and Shipping:
- Anti-static packaging for component protection
- Moisture sensitivity level (MSL) classification
- Tape and reel packaging for automated assembly
- Custom packaging options for specific requirements
The XCS30XL-4PQG208C represents a proven solution for engineers requiring reliable FPGA performance in a cost-effective package. Its combination of robust specifications, comprehensive documentation, and strong ecosystem support makes it an excellent choice for both development and production applications across multiple industries.
