Product Specifications
Core Features
- Part Number: XCS30-3TQ144C
- Manufacturer: Xilinx (now AMD)
- Product Category: Embedded – FPGAs (Field Programmable Gate Array)
- FPGA Family: Spartan and Spartan-XL Series
Technical Specifications
- System Gates: 30,000 gates
- Logic Elements/Cells: 1,368 logic cells
- Configurable Logic Blocks (CLBs): 576 CLBs
- Number of I/O: 113 I/O pins
- Total RAM Bits: 18,432 bits
- Operating Temperature: 0ยฐC to +85ยฐC (TJ)
- Supply Voltage: 4.75V to 5.25V
- Technology: Advanced CMOS process
Package Information
- Package Type: 144-pin TQFP (Thin Quad Flat Pack)
- Package Dimensions: 20mm x 20mm
- Mounting Type: Surface Mount Technology (SMT)
- Pin Count: 144 pins
- Package Case: 144-LQFP
Performance Characteristics
- Maximum Operating Frequency: Up to 125MHz
- High-speed performance for demanding applications
- Low power consumption design
- Non-volatile configuration memory
- In-system programmability
Price Information
Current Market Pricing:
- Unit pricing varies based on quantity and supplier
- Volume discounts available for bulk orders (1K+ units)
- Contact authorized distributors for current pricing
- Lead times typically 2-8 weeks depending on availability
Major Distributors:
- Digi-Key Electronics
- Mouser Electronics
- Heisener Electronics
- Arrow Electronics
- Avnet
Note: Pricing fluctuates based on market conditions and semiconductor availability. Contact suppliers directly for real-time quotes.
Documents & Media
Technical Documentation
- Datasheet: Spartan and Spartan-XL FPGA Families Data Sheet (DS060)
- Programming Guide: Configuration and programming specifications
- Pin Configuration: Detailed pinout diagrams and I/O specifications
- Application Notes: Design implementation guidelines
- Reference Manual: Complete technical reference documentation
Design Resources
- Xilinx ISE Design Suite: Legacy development environment
- Vivado Design Suite: Modern FPGA development platform (for newer devices)
- FPGA configuration files and bitstreams
- HDL design examples and templates
- Timing and placement constraints files
Software & Tools
- Programming Tools: JTAG boundary-scan programming support
- Simulation Models: VHDL and Verilog simulation libraries
- IP Cores: Pre-designed intellectual property blocks
- Development Boards: Compatible evaluation and starter kits
Related Resources
Compatible Products
- XCS30-3TQ144I: Industrial temperature variant (-40ยฐC to +100ยฐC)
- XCS20-3TQ144C: Lower gate count alternative (20K gates)
- XCS40-3TQ144C: Higher gate count option (40K gates)
Development Ecosystem
- Configuration PROMs: In-system programmable memory devices
- Programming Cables: JTAG and parallel programming interfaces
- Evaluation Boards: Development and prototyping platforms
- Reference Designs: Proven application implementations
Application Areas
- Digital Signal Processing (DSP)
- Communications Infrastructure
- Industrial Automation
- Automotive Electronics
- Consumer Electronics
- Prototyping and Development
Technical Support
- IEEE 1149.1/1532 Boundary-Scan (JTAG) Support
- Standard FPGA configuration protocols
- Comprehensive design documentation
- Community forums and technical resources
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not RoHS Compliant (legacy product)
- REACH Compliance: Check with manufacturer for current status
- Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Storage Temperature: Extended range for long-term storage
Export Classifications
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- ECCN: Check current export control classifications
- Country of Origin: Varies by manufacturing location
Package & Handling
- Moisture Sensitivity Level (MSL): Level 3
- Package Marking: Standard Xilinx part marking
- Anti-static Handling: Required for all handling procedures
- Tape and Reel: Available for automated assembly
Quality Standards
- Military/Aerospace: Contact manufacturer for qualified versions
- Automotive Grade: Check AEC-Q100 qualification status
- Industrial Standards: Meets standard commercial specifications
Key Benefits of XCS30-3TQ144C
Cost-Effective ASIC Replacement: The XCS30-3TQ144C offers significant cost advantages over traditional ASIC development, eliminating mask costs and reducing time-to-market.
High-Volume Production Ready: Optimized for applications requiring thousands to millions of units with consistent performance and quality.
Flexible Architecture: Reconfigurable logic allows for design modifications and updates without hardware changes.
Proven Reliability: Backed by Xilinx’s decades of FPGA expertise and manufacturing excellence.
Comprehensive Tool Support: Full ecosystem of development tools, IP cores, and technical documentation.
The XCS30-3TQ144C represents proven FPGA technology suitable for cost-sensitive, high-volume applications. Contact authorized distributors for current availability, pricing, and technical support.
