The XCKU9P-L1FFVE900I is a cutting-edge field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, wireless communications, and high-performance computing environments.
Product Specifications
The XCKU9P-L1FFVE900I features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 548,160 logic cells and 2,520 DSP slices, making it ideal for complex signal processing and compute-intensive applications.
Key Technical Specifications:
- Logic Cells: 548,160 system logic cells
- DSP Slices: 2,520 DSP48E2 slices
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 270 Mb UltraRAM blocks
- Package Type: FFVE900 (35mm x 35mm flip-chip BGA)
- Speed Grade: -1L (low power variant)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Supply Voltage: 0.85V core, 1.8V auxiliary
The XCKU9P-L1FFVE900I supports high-speed serial connectivity with 16 GTY transceivers capable of operating up to 32.75 Gbps, enabling seamless integration into high-bandwidth systems.
Price Information
Pricing for the XCKU9P-L1FFVE900I varies based on order quantity, delivery requirements, and current market conditions. Contact authorized distributors or AMD Xilinx directly for current pricing and availability. Volume discounts are typically available for production quantities.
Documents & Media
Comprehensive technical documentation is available for the XCKU9P-L1FFVE900I through AMD Xilinx’s official documentation portal:
- Datasheet: Complete electrical specifications and operating parameters
- User Guide: Detailed implementation guidelines and best practices
- Package Information: Mechanical drawings and pinout specifications
- Power Estimation Tools: Xilinx Power Estimator (XPE) spreadsheets
- Development Resources: Reference designs and application notes
- PCB Design Guidelines: Layout recommendations and thermal considerations
Video tutorials and webinars covering XCKU9P-L1FFVE900I implementation strategies are available through AMD Xilinx’s learning center.
Related Resources
Development Tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- Vitis unified software platform for embedded and acceleration development
- Hardware debugging tools and IP catalog access
Evaluation Platforms:
- KCU116 evaluation board featuring similar Kintex UltraScale+ architecture
- ZCU216 evaluation kit for advanced development scenarios
Application-Specific Resources:
- 5G wireless infrastructure reference designs
- Machine learning acceleration frameworks
- High-frequency trading FPGA solutions
- Video processing and broadcast equipment designs
The XCKU9P-L1FFVE900I integrates seamlessly with AMD Xilinx’s ecosystem of IP cores, including AXI4-Stream interfaces, memory controllers, and communication protocols.
Environmental & Export Classifications
The XCKU9P-L1FFVE900I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (Lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting template available
- Halogen-free package materials
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- COO (Country of Origin): Varies by manufacturing location
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive-grade variants available (AEC-Q100 qualified)
- Industrial temperature range operation
- Extended product lifecycle support
The XCKU9P-L1FFVE900I undergoes comprehensive testing including burn-in procedures, electrical testing, and reliability qualification to ensure consistent performance across all operating conditions.
This advanced FPGA solution provides the flexibility and performance required for next-generation applications while maintaining the reliability and support expected from AMD Xilinx’s industry-leading programmable logic portfolio.
