High-Performance Field Programmable Gate Array for Advanced Digital Signal Processing
The XCKU9P-2FFVE900E is a premium AMD (formerly Xilinx) Kintex UltraScale+ FPGA engineered for demanding applications requiring optimal price-performance-watt balance. This state-of-the-art device combines advanced FinFET technology with extensive programmable logic resources to deliver exceptional performance for high-end digital processing tasks.
1. Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+ Series
- Part Number: XCKU9P-2FFVE900E
- Speed Grade: -2 (Mid-range performance)
- Technology Node: 20nm FinFET
- Temperature Grade: Extended (E) – 0ยฐC to 100ยฐC (TJ)
Logic Resources
- Logic Elements/Cells: 599,550
- Configurable Logic Blocks (CLBs): 34,260
- Total RAM Bits: 41,881,600
- UltraRAM: On-chip memory for BOM cost reduction
- DSP Slices: Optimized for signal processing applications
Physical Characteristics
- Package Type: 900-FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 31ร31mm
- Pin Count: 900 pins
- I/O Count: 304 user I/O pins
- Mounting Type: Surface Mount
- Weight: Industrial standard
Electrical Specifications
- Core Voltage (VCCINT): 0.825V – 0.876V
- Supply Voltage Range: 0.85V or 0.72V operation modes
- Power Options: Multiple configurations for optimal performance/power balance
- Maximum Operating Frequency: Up to 645 MHz (depending on design)
Memory Interfaces
- DDR3/DDR4 Support: High-speed memory controllers
- PCIe Gen3: Integrated for system connectivity
- Ethernet: 100G connectivity cores support
- Transceiver Support: High-speed serial interfaces
2. Pricing Information
XCKU9P-2FFVE900E pricing varies based on quantity, distributor, and market conditions. Current pricing trends show:
- Unit Price: Contact for RFQ (Request for Quote)
- Volume Discounts: Available for quantities >100 units
- Lead Time: Typically 35 weeks from manufacturer
- Availability: Active product status with regular stock updates
Price Monitoring: Leading distributors track real-time inventory and pricing fluctuations to ensure competitive market rates.
Authorized Distributors
- Avnet
- Mouser Electronics
- Newark/Farnell
- FPGAkey
- Microchip USA
- OMO Electronic
Contact distributors directly for current pricing and availability
3. Documents & Media
Technical Documentation
- Official Datasheet: Complete electrical and mechanical specifications
- Pinout Guide: UG575 UltraScale+ Package and Pinout documentation
- User Guide: Kintex UltraScale+ device family overview
- Application Notes: Design implementation guidelines
- Reference Designs: Proven design examples and templates
Development Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified intellectual property cores
- Evaluation Boards: KCU105/KCU116 development platforms
- Starter Kits: Complete development ecosystems
- Video Tutorials: Step-by-step implementation guides
CAD Models & Support Files
- 3D CAD Models: Mechanical design integration
- IBIS Models: Signal integrity simulation
- Schematic Symbols: PCB design libraries
- Footprint Libraries: Layout design resources
4. Related Resources
Development Ecosystem
- Vivado Design Suite 2023.x: Latest synthesis and implementation tools
- Vitis Unified Software Platform: High-level synthesis and acceleration
- System Generator: MATLAB/Simulink integration
- SDK/Vitis IDE: Embedded software development
Hardware Platforms
- KCU105 Evaluation Board: Full-featured development platform
- KCU116 Evaluation Board: Latest generation development kit
- Custom Carrier Cards: Application-specific development modules
- FMC Mezzanine Cards: Modular I/O expansion options
Software Tools
- ChipScope Pro: Real-time debugging and analysis
- Power Estimator: Power consumption analysis
- Timing Analyzer: Performance optimization tools
- IP Integrator: System-level design assembly
Training & Support
- Technical Documentation Portal: Comprehensive online resources
- Community Forums: Peer-to-peer technical discussions
- Application Engineering: Direct technical support
- Training Courses: Online and instructor-led education
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant
- REACH Compliance: No SVHC (Substances of Very High Concern) as of January 15, 2019
- Conflict Minerals: Compliant with industry standards
- Green Packaging: Environmentally responsible packaging materials
Export Control Classifications
- ECCN (Export Control Classification Number): 3A991.d
- HTS Code (US): 8542390001
- TARIC Code: 8542399000
- Country of Origin: Varies by manufacturing location
Quality Standards
- ISO Certification: Manufacturing facility certifications
- Quality Grade: Industrial standard
- Reliability Testing: Extended qualification programs
- Product Status: Active production
Sustainability Initiatives
- Carbon Footprint: Part of AMD’s environmental responsibility program
- Recycling Programs: End-of-life product management
- Energy Efficiency: Optimized power consumption designs
- Supply Chain: Responsible sourcing practices
Keywords: XCKU9P-2FFVE900E, Kintex UltraScale+ FPGA, AMD Xilinx, 900-FCBGA, 599550 logic elements, extended temperature, high-performance FPGA, digital signal processing, 20nm technology, programmable logic, Vivado compatible
Applications: 5G Infrastructure, Machine Learning Acceleration, Video Processing, Software-Defined Radio, High-Frequency Trading, Aerospace & Defense, Medical Imaging, Network Processing, Industrial Automation, Edge Computing
For technical support, pricing inquiries, or detailed specifications, contact your preferred authorized distributor or AMD technical support team.
