High-Performance Field Programmable Gate Array for Advanced Applications
The XCKU5P-L2SFVB784E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Kintex UltraScale+ family, engineered to deliver exceptional performance and power efficiency for demanding applications. This advanced FPGA combines high-performance peripherals with cost-effective system implementation, making it ideal for wireless MIMO technology, Nx100G networking, data center acceleration, and digital signal processing applications.
1. Product Specifications
Core Architecture
- FPGA Family: Kintex UltraScale+ (XCKU5P series)
- Process Technology: 16nm FinFET+
- Speed Grade: -L2 (Low power variant)
- Temperature Grade: Extended (-40ยฐC to +100ยฐC)
Logic Resources
- Logic Cells: 474,600 total logic cells
- CLB LUTs: 216,960 configurable logic blocks
- CLB Flip-Flops: 433,920
- Distributed RAM: 6.1 Mb
- Block RAM: 16.9 Mb (16,900 Kbit)
- UltraRAM: 18 Mb with 64 UltraRAM blocks
DSP and Processing
- DSP Slices: 1,824 DSP48E2 slices
- System Monitor: 1 integrated system monitor
- CMTs (Clock Management Tiles): 4
I/O and Connectivity
- Total I/O Pins: 304 user I/O
- HP (High Performance) I/O: 208 pins
- HD (High Density) I/O: 96 pins
- GTY Transceivers: 16 channels at up to 32.75 Gbps
- PCIe: PCIe Gen3 x16 capability
- 100G Ethernet: Supported with appropriate IP cores
Package and Power
- Package Type: SFVB784 (784-pin Flip Chip Ball Grid Array)
- Pin Count: 784 pins
- Core Voltage (VCCINT): 0.72V (Low power operation)
- I/O Voltage: Multiple voltage standards supported
- Power Optimization: Enhanced low-power features for reduced static power consumption
Memory Interfaces
- DDR4: Up to 2666 Mbps support
- DDR3: Full support with high bandwidth
- QDRII+: Supported for low-latency applications
- RLDRAM3: High-performance memory interface support
2. Price
Pricing for XCKU5P-L2SFVB784E varies based on quantity, lead time, and distributor.
Contact authorized distributors for current pricing:
- Request Quote (RFQ) for volume pricing
- Sample quantities available for evaluation
- Production volumes with competitive pricing tiers
- Extended lead times may apply for large orders
Note: Prices fluctuate based on market conditions and availability. Contact AMD authorized distributors for real-time pricing and stock availability.
3. Documents & Media
Technical Documentation
- Datasheet: Kintex UltraScale+ FPGAs Data Sheet (DS922)
- User Guide: UltraScale Architecture Configurable Logic Block User Guide (UG574)
- Package Guide: UltraScale+ Package Files and Pinout Information
- Power Guide: UltraScale+ Power Methodology Guide
- Migration Guide: 7 Series to UltraScale+ Migration Guide
Design Resources
- Vivado Design Suite: Latest version compatibility
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Ethernet, PCIe, DDR4 memory controller examples
- Application Notes: Performance optimization guides
- Errata: Latest device errata and workarounds
Development Tools
- Vivado HLx Editions: Design Suite support
- SDK/Vitis: Embedded software development
- ChipScope Pro: Real-time debugging
- Power Estimator: XPE (Xilinx Power Estimator) support
4. Related Resources
Development Boards
- Evaluation Boards: KCU105, KCU116 evaluation platforms
- Third-party Boards: ALINX ACKU5P System-on-Module
- Custom Solutions: Partner ecosystem boards and modules
Software and IP
- MicroBlaze: Soft processor running 200+ DMIPs
- AXI Interconnect: High-performance system connectivity
- Memory Controllers: DDR4, DDR3, QDRII+ controllers
- Networking IP: 100G Ethernet, PCIe Gen3, Aurora protocols
Training and Support
- Technical Training: UltraScale+ architecture courses
- Design Methodology: Best practices documentation
- Community Support: AMD Developer Forums
- Technical Support: Direct engineering support available
Compatible Devices
- XCKU5P-L1SFVB784I: Industrial temperature variant
- XCKU5P-2SFVB784E: Higher speed grade option
- XCKU5P-L2FFVB676E: Alternative package option
- XCKU5P-L2FFVD900E: Larger pin count variant
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes (Restriction of Hazardous Substances)
- REACH Compliant: No SVHC (Substances of Very High Concern) as of January 15, 2019
- Lead-Free: Pb-free package and assembly process
- Halogen-Free: Environmentally friendly package materials
- WEEE Compliant: Electronic waste directive compliance
Temperature Specifications
- Operating Temperature: -40ยฐC to +100ยฐC (Extended grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Junction Temperature: Maximum 125ยฐC
- Thermal Resistance: Package-specific thermal characteristics
Export Control
- ECCN Classification: 3A001.a.7 (Export Control Classification Number)
- Export Restrictions: Subject to U.S. Export Administration Regulations (EAR)
- License Requirements: May require export license for certain destinations
- End-Use Restrictions: Military and aerospace applications may have additional requirements
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC standards compliance
- Qualification: AEC-Q100 automotive qualification available for select variants
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- ESD Classification: Class 2 (2kV HBM, 200V CDM)
Country of Origin
- Manufacturing: Taiwan and other AMD qualified facilities
- Assembly: Asia-Pacific region facilities
- Final Test: Multiple global test locations
- Quality Assurance: Global quality management system
Applications
The XCKU5P-L2SFVB784E excels in:
- 5G Wireless Infrastructure: Beamforming and MIMO processing
- Data Center Acceleration: Network packet processing and storage acceleration
- Industrial Automation: Machine vision and real-time control systems
- Medical Imaging: High-resolution image processing and analysis
- Aerospace & Defense: Radar processing and secure communications
- Video Processing: 4K/8K video encoding and streaming applications
Why Choose XCKU5P-L2SFVB784E?
This FPGA delivers the optimal balance of performance, power efficiency, and cost-effectiveness for next-generation applications. With its advanced 16nm FinFET+ technology, extensive I/O capabilities, and comprehensive development ecosystem, the XCKU5P-L2SFVB784E enables rapid deployment of high-performance solutions across multiple industries.
For technical support, pricing, and availability information, contact your local AMD authorized distributor or visit the AMD website.
